• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.8
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• pp.728-740
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• 2004

Heat sink has extended surface area for enhanced heat transfer. The enhanced convection heat transfer has been used widely, such as cooling electronic chips in the electronics industry. Heat sink usually requires an increase in the heat transfer and a decrease in the pressure drop, and must improve the performance in the flow field of industrial plants. In this study, wing fin heat sink was studied and tests were conducted in a rectangular cross sectional channel with wing fin heat sinks. The leading and trailing ends of a wing fin have a sharp edge, simulating the airfoil feature. Empirical correlations have been developed for wing fin heat sink types. And wing fin heat sinks have better cooling performance than elliptic fin and square fin types.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.2
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• pp.61-67
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• 2006

We fabricate local damascene FinFET cell array in sub-60nm feature sized DRAM. The local damascene structure can remove passing-gate-effects in FinFET cell array. p+ boron in-situ doped polysilicon is chosen for the gate material, and we obtain a uniform distribution of threshold voltages at around 0.7V. Sub-threshold swing of 75mV/d and extrapolated off-state leakage current of 0.03fA are obtained, which are much suppressed values against those of recessed channel array transistors. We also obtain a few times higher on-state current. Based on the improved on- and off-state current characteristics, we expect that the FinFET cell array could be a new mainstream structure in sub-60nm DRAM devices, satisfying high density, low power, and high-speed device requirements.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.3
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• pp.54-60
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• 2013

Numerical analysis of the radiant heat characteristic around heatsink according to arrangement and shape of fin on 60W-LED lamp is conducted in this study. In the case of top blow blowing from upper side on LED lamp, there is just little difference in cooling characteristics according to the height of fin. On the other hand, the fin arranged side by side has the advantage of heat transfer enhancement by comparing with zig-zag type because it leads to more loss of flow. In case of making fin round to increase the amount of heat transfer, designing arrangement with the minimized loss of flow has the advantage of characteristic.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2011-2016
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• 2008

A new method is presented for developing a simulation program which can analyze the heat transfer characteristics of fin-tube heat exchanger. This method is able to describe several types of refrigerant circuit arrangement. The delivery path of air and refrigerant properties is simplified by transforming three-dimensional array into one-dimensional array. By comparing simulated results with experiment results, the deviation was 8.2%. Several fin-tube heat exchangers of different design factors and operating conditions were simulated using this program. It was shown that this program could be used for designing practical fin-tube heat exchangers.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.20 no.12
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• pp.833-843
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• 2008

A new method is presented for developing a simulation program which can analyze the heat transfer characteristics of fin-tube heat exchanger. This method is able to describe several types of refrigerant circuit arrangement. The delivery path of air and refrigerant properties is simplified by transforming three-dimensional array into one-dimensional array. By comparing simulated results with experiment results, the deviation was 8.2%. Several fin-tube heat exchangers of different design factors and operating conditions were simulated using this program. It was shown that this program could be used for designing practical fin-tube heat exchangers.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.10
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• pp.2657-2666
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• 1995

In this study, the effects of design factors of finned-tube heat exchanger, such as fin spacing and fin array on the frost growth and heat exchanger performance are investigated under a frosting condition. The results show that the amount of frost, frost density and blockage ratio of air flow passage increase with decreasing fin spacing. Heat transfer rate increases momentarily at the initial stage of frosting and then decreases. After that heat transfer rate continues to increase again to reach a maximum value and then decreases dramatically. It is shown that the time required for heat transfer rate to reach a maximum value becomes shorter with decreasing fin spacing, and after a maximum value, heat transfer rate decreases very fast. The maximum allowable blockage ratio is introduced to determine the operation limit of a finned-tube heat exchanger operating under frosting condition and is obtained as a function of fin spacing. It is also shown that heat transfer rate of heat exchanger with staggered fin array increases about 17% and the amount of pressure drop of air increases about 1~2 mmH$_{2}$O, compared with those of in-line type heat exchanger under frosting condition.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.9 no.3
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• pp.259-267
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• 1997

Average heat transfer coefficients and friction coefficients have been measured from staggered short pin-fin arrays to investigate the effect of fin shapes. Flow entering into the test section is a fully developed duct flow and the Reynolds number ranges from 5,000 to 25,000 based on fin diameter and average approaching velocity. The fin has three different shapes; uniform-diameter circular fin, two stepped-diameter circular fins. Average heat transfer rates change slightly with the fin shapes. However, friction loss(pressure loss) for the stepped-diameter fins is significantly less than that for the uniform-diameter fin. This results indicate that the stepped-diameter fin arrays in duct flow enhance heat transfer rates largely based on unit pumping power.

• Journal of the Korean Society of Propulsion Engineers
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• v.24 no.5
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• pp.43-55
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• 2020

The effect of cutted pin in front of pin-fin array was analyzed for increasing the cooling performance of gas turbine blade. The numerical simulations were conducted to figure out the flow and thermal characteristics. The base case which is staggered pin-fin array, cut pin case 1 which has X₂/D_p=1.25 cut pin and cut pin case 2 which has X₃/D_p=1.75 cut pin were compared. The results showed that cut pin increases the strength of the horseshoe vortex which occurred at the leading edge of pin-fin array. Furthermore, the wake effect is reduced at the trailing edge of pin-fin array. As a result, the heat transfer distribution on the endwall increases. However, the friction factor increases owing to the installation of cut pin, but the thermal performance factor is increased maximum 23.8% in cut pin case 2. Therefore, installation of cut pin will be helpful for increasing the cooling performance of pin-fin array of gas turbine blade.

• Clean Technology
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• v.14 no.4
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• pp.265-270
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• 2008

In this study, the flow and heat transfer of the aligned pin-fin array of the air cooling module for electronic packaging application were numerically analyzed with various fin shapes. The geometric cross-sectional shapes of pin-fins considered in this study were ellipse, wing and circle. The fins had same cross-sectional area and height, but they had different surface areas. As the results, the surface area, the heat transfer coefficient, and the heat transfer performance of pin-fins greatly depended on their shapes. Of the three types of pin-fins, the wing type pin-fin with suitable shape produced the best heat transfer performance. This result implies that the cooling capacity of the pin-fin cooler can be significantly enhanced only by the change of fin shape without increasing air flow-rate or fin density.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.1
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• pp.138-143
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• 2018

In general, the operating temperature of electronic equipment is closely related to product life and reliability, and it is recognized that effectively cooling the parts is an important problem. In this paper, an experimental study on the cooling characteristic according to the pin array of the heat sink is conducted. The experiment on the heat sink was based on the natural convection and temperature distribution changes. The experimental results indicate that the pin array of the heat sink has an effect on the thermoelectric module's cooling characteristic.