• Transactions on Electrical and Electronic Materials
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• v.6 no.1
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• pp.29-32
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• 2005

Chemical mechanical polishing is an essential process in the production of copper-based chips. On this work, the stability of hydrogen peroxide ($H_{2}O_{2}$) as an oxidizer of copper CMP slurry has been investigated. $H_{2}O_{2}$ is known as the most common oxidizer in copper CMP slurry. But $H_{2}O_{2}$ is so unstable that its stabilization is needed using as an oxidizer. As adding KOH as a pH buffering agent, stability of $H_{2}O_{2}$ decreased. However, $H_{2}O_{2}$ stability in slurry went up with putting in small amount of BTA as a film forming agent. There was no difference of $H_{2}O_{2}$ stability between pH buffering agents KOH and TMAH at similar pH value. Addition of $H_{2}O_{2}$ in slurry in advance of bead milling led to better stability than adding after bead milling. Adding phosphoric acid resulted in the higher stability. Using alumina C as an abrasive was good at stabilizing for $H_{2}O_{2}$.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.45 no.4
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• pp.21-26
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• 2013

The effect of esterified starch as surface sizing agent for inkjet printing paper has been evaluated and compared with oxidized starch. Also the influence of various additives including cationic poly-DADMAC, stearic acrylic copolymer, calcium chloride, and GCC was examined. Results showed that starch ester gave higher ink density than oxidized starch. Addition of poly-DADMAC improved water fastness. In general, low molecular weight poly-DADMAC performed better than high molecular weight one, and it was attributed to the fact that it gave more uniform film forming characteristics in surface sizing. Use of styrene acrylic acid copolymer increased hydrophobicity of the paper surface, but it did not increase the ink density. Use of GCC and calcium chloride had only marginal effect on printing quality.

• Applied Chemistry for Engineering
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• v.1 no.2
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• pp.161-167
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• 1990

Polymethylphenylsilane(PMPS) was synthesized with methylphenyldichlorosilane using metal sodium. Various sample coated on quartz plate were exposed and the yield of residual film was calculated. To obtain the fine image forming after developing and drying, optical transmittance characterization have to be considered. Exposure is described by three optical parameters X, Y, and Z. There parameters are normally determined from optical transmittance measurements of exposed PMPS films. Z parameter was determined from the initial slope of a transmittance according to exposure time. This set of function parameters provided a complete description of photoresist exposure and development and became the basis for the theoretical process models.

• Korea-Australia Rheology Journal
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• v.19 no.3
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• pp.165-169
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• 2007

The light guide plate (LGP) of LCD-BLU (Liquid Crystal Display-Back Light Unit) is usually manufactured by forming numerous dots by etching process. However, the surface of those etched dots of LGP is very rough due to the characteristics of etching process, so that its light loss is relatively high due to the dispersion of light. Accordingly, there is a limit in raising the luminance of LCD-BLU. In order to overcome the limit of current etched-dot patterned LGP, micro-lens pattern was tested to investigate the possibility of replacing etched pattern in the present study. The micro-lens pattern fabricated by the modified LiGA with thermal reflow process was applied to the optical design of LGP. The attention was paid to the effects of different optical pattern type (i.e. etched dot, micro-lens). Finally, the micro-lens patterned LGP showed better optical qualities than the one made by the etched-dot patterned LGP in luminance.

• Korea-Australia Rheology Journal
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• v.19 no.3
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• pp.171-176
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• 2007

LCD-BLU (Liquid Crystal Display-Back Light Unit) of medium size is usually manufactured by forming numerous dots with $50{\sim}300\;{\mu}m$ in diameter by etching process and V-grove shape with $50\;{\mu}m$ in height by mechanical cutting process. However, the surface of the etched dots is very rough due to the characteristics of the etching process and V-cutting needs rather high cost. Instead of existing optical pattern made by etching and mechanical cutting, 3-dimensional continuous micro-lens of $200\;{\mu}m$ in diameter was applied in the present study. The continuous micro-lens pattern fabricated by modified LIGA with thermal reflow process was tested to this new optical design of LGP. The manufacturing process using LIGA-reflow is made up of three stages as follows: (i) the stage of lithography, (ii) the stage of thermal reflow process and (iii) the stage of electroplating. The continuous micro-lens patterned LGP was fabricated with injection molding and its test results showed the possibility of commercial use in the future.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.7
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• pp.354-358
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• 2006

In this paper, we investigated the selective etching rate of amorphous As-Ge-Se-S thin film due to the photoexpansion effect and fabricated the 2-dimensional embossing type diffraction grating hologram. We measured the thickness change with the etching time among NaOH solution after forming 1-dimension diffraction grating. As a results, we found that the selective etching rate were $2.5\AA/s,\;3.3\AA/s,\;3.9\AA/s$ where NaOH solution concentration were 0.26N, 0.33N, 0.36N, respectively. Also after the formation of 2-dimensional diffraction grating by the $90^{\circ}$ degree of circulation on the formed 1-dimensional diffraction grating, we etched selectively during 60sec, among 0.26N NaOH solution and obtained 2-dimensional embossing diffraction grating. As the results of AFM (Atomic Force Microscopy), we confirmed the formation of distinct embossing type 2-dimensional diffraction grating hologram, successfully.

• Corrosion Science and Technology
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• v.7 no.1
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• pp.27-34
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• 2008

In industrial and fluid handling systems, frequently the protective film forming materials suffer from severe corrosion due to microbial effects. As an example, various micro-organisms, including bacteria, exist in seawater normally fed to power and desalination plants. Unless seawater intakes are properly disinfected to control these microbial organisms, biological fouling and microbial induced corrosion (MIC) will be developed. This problem could destroy metallic alloys used for plant construction. Seawater intakes of cogeneration plants are usually disinfected by chlorine gas or sodium hypochlorite solution. The dose of disinfectant is designed according to the level of contamination of the open seawater in the vicinity of the plant intake. Higher temperature levels, lower pH, reduced flow velocity and oxidation potential play an important role in the enhancement of microbial induced corrosion and bio-fouling. This paper describes, in brief, the different types of bacteria, mechanisms of microbiological induced corrosion, susceptibility of different metal alloys to MIC and possible solutions for mitigating this problem in industry. A case study is presented for the power plant steam condenser at Al-Taweelah B-station in Abu Dhabi. The study demonstrates resistance of Titanium tubes to MIC.

• Journal of the Korean Ceramic Society
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• v.20 no.4
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• pp.305-314
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• 1983

In order to enhance the rate of th nitridation and to give the high density of reaction-bonded silicon nitride MgO powder as nitriding aid were added to silicon powders and the mixture was pressed isostatically into compacts which were nitrided in the furnace of 1, 35$0^{\circ}C$ where 95% $N_2$-5% $H_2$ gases were flowing. As the other nitriding aid $Mg(NO_3)_2 6H_2O$ was selected, A slip made of magnesium nitrate solution and fine silicon particles was spray-dried and then decomposed at 30$0^{\circ}C$. Magnesium oxide-coated silicon powders were formed into compacts prior to the nitridation on the same condition as the former. Magnesium nitrate (MgO, produced from the decomposition of magnesium nitrate) was more effective for the formation of the $\beta$-phase in the initial stage of the nitridation probably due to the easy formation of $MgO-SiO_2$-metal oxide eutectic melt. It has been confirmed that forsterite was formed as a result of the reaction between MgO and $SiO_2$ film of silicon surface. It was considered that MgO produced from magnesium nitrate may be finer more reactive and more uniformly distributed on the surface of silicon particles than original MgO. The higher the forming pressure was the more the $\beta$-phase was formed.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.170-173
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• 2007

Cruciform conjugated molecule, 4(DP3T)-benzene bearing terthiophene moieties has been synthesized through Horner-Emmons Reaction using 5-dodecyl-5"-aldehyde-[2,2';5',2"] terthiophene as dendrons and octaethyl benzene- 1,2,4,5-tetrayltetrakis(methylene)tetraphosphonate as the core unit; this molecule has been fully characterized. The terthiophene-based molecule exhibits good solubility in common organic solvents and good self-film forming property. They are intrinsically crystalline as they exhibit well-defined X-ray diffraction patterns from uniform orientations of molecules. Thus, intermolecular interaction can be enhanced to affect the carrier transport phenomena after annealing at $148^{\circ}C$. The semiconducting property of 4(DP3T)-benzene have been evaluated in organic field-effect transistors. 4(DP3T)-benzene exhibit carrier mobility as high as $(6.6{\pm}0.5)$ ${\times}$ $10^{-6}cm^2V^{-1}s^{-1}$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.7
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• pp.73-81
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• 1992

We have investigated the thermal reaction property and the oxygen behavior of TiN/Ti/Si structure after different hear treatments using x-ray photoelectron spectroscopy and cross-sectional transmission electron microscopy measurements. During the heat treatment in N$_2$ amibient, the considerable amount of oxygen atoms incorporates into TiN/Ti/Si Structures. It is found that oxygen atoms pile up at the top surface of TiN and TiN/Ti interface, forming a compound of TiO$_2$ above $600^{\circ}C$. Inside the TiN film, the oxygen content increases as the annealing temperature increases, mostly TiO and Ti$_2$O$_3$ rather than thermodynamically stable TiO$_2$. Above the annealing temperature of 55$0^{\circ}C$, the TiSi$_2$ formation has initiated. One thing to note is that a severe blistering is observed in the sample annealed at $600^{\circ}C$, due to (1) the difference of thermal expansion coefficient between TiN and Si` (2) the compressive stress induced by the volume reduction caused by the Ti-Silicide grain while elevating temperatures.