• Journal of the Korean Institute of Telematics and Electronics
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• v.9 no.5
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• pp.27-33
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• 1972

This paper describes the computer-aided design, fabrication and performance of high Q and high gain active filters suitable for microminiaturization in the frequency range of 10-800MHz, based on the negative resistance operation of a transistor. 48 as high as 1000 and a transducer gain as high as 35dB can readily be obtained with a single-transistor amplifier and with an inductance as small as a few nH at higher frequencies and 150 nH at lower frequencies in tile above frequency range. The gain of the proposed active filter can be stoabilized within $\pm$ 1.5 dB over the temperature range -1$0^{\circ}C$ to +5$0^{\circ}C$ and the temperature dependence of the center frequency is tapicalla 50ppm/$^{\circ}C$. An experimental FM receiver utilizing these fitters and operating at a carrier frequency of 92 MH3 was built. The whole circuit was fabricated on eight alumina substrates of by the thick-film hybrid IC technique and the coils are constructed, for miniaturization, in a spiral form of 3 or 4 turns of enamel copper wire with an overall diameter of about 5mm. The test results are also reported in this paper.

• Journal of environmental and Sanitary engineering
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• v.10 no.2
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• pp.79-88
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• 1995

The electrostatic precipitation of Auto- Bias has the advantages of a little of power consumption by the voltage to apply only at ionizer and the prevention of fire danger by current flow over. As this ionizer wire was used WXN- Pt material of diameter 90$\mu $m, that improved ion efficiency and safety, simplified a existing source of electric power by induced Auto- Bias voltage. Also, the new type collector used electric conductivity- film wag superior a electric safety and dust collection efficiency and was possible to wash it by water. As a experiment result of this Auto- Bias electrostatic collector, the induced Auto- Bias voltage by appling D.C 4.0∼6.0kV at ionizer was 1.3∼2.3kV and then the power consumption by applied voltage was 8- l8W. The pressure loss of collector by the amount of flowing was 6.1 OmmH$_{2}$O in 300m$^{3}$/hr and showed a safe state of the dust collection. The collection efficiency by particle size was 65.1-95.8% in 0.5∼5.0$\mu $m. After corona discharge of ionizer, the remains ozone concentration was found much lower than that of ACGIH or air pollution criteria in Korea.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.95-95
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• 2009

Single-crystalline Bi nanowires have motivated many researchers to investigate novel quasi-one-dimensional phenomena such as the wire-boundary scattering effect and quantum confinement effects due to their electron effective mass (~0.001 me). Single crystalline Bi nanowires were found to grow on as-sputtered films after thermal annealing at $270^{\circ}C$. This was facilitated by relaxation of stress between the film and the thermally oxidized Si substrate that originated from a mismatch of the thermal expansion. However, the method is known to produce relatively lower density of nanowires than that of other nanowire growth methods for device applications. In order to increase density of nanowire, we propose a method for enhancing compressive stress which is a driving force for nanowire growth. In this work, we report that the compressive stress can be controlled by modifying a substrate structure. A combination of photolithography and a reactive ion etching technique was used to fabricate patterns on a Si substrate. It was found that the nanowire density of a Bi film grown on $100{\mu}m{\times}100{\mu}m$ pattern Si substrate increased over seven times higher than that of a Bi sample grown on a normal substrate. Our results show that density of nanowire can be enhanced by sidewall effect in optimized proper pattern sizes for the Bi nanowire growth.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.365-365
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• 2010

Similar to the superhydrophobic surfaces of lotus leaf, water strider leg is attributed to hierarchical structure of micro pillar and nano-hair coated with low surface energy materials, by which water strider can run and even jump on the water surface. In order to mimick its leg, many effort, especially, on the fabrication of nanohairs has been made using several methods such as a capillarity-driven molding and lithography using poly(urethane acrylate)(PUA). However most of those effort was not so effective to create the similar structure due to its difficulty in the fabrication of nanoscale hairy structures with hydrophobic surface. In this study, we have selected a low surface energy polymeric material of polytetrafluoroethylene (PTFE, or Teflon) assisted with surface modification of CF4 plasma treatment followed by hydrophobic surface coating with pre-cursor of hexamethyldisiloxane (HMDSO) using a plasma enhanced chemical vapor deposition (PE-CVD). It was found that the plasma energy and duration of CF4 treatment on PTFE polymer could control the aspect ratio of nano-hairy structure, which varying with high aspect ratio of more than 20 to 1, or height of over 1000nm but width of 50nm in average. The water contact angle on pristine PTFE surface was measured as approximately $115^{\circ}$. With nanostructures by CF4 plasma treatment and hydrophobic coating of HMDSO film, we made a superhydrophobic nano-hair structure with the wetting angle of over $160^{\circ}C$. This novel fabrication method of nanohairy structures has been applied not only on 2-D flat substrate but also on 3-D substrates like wire and cylinder, which is similarly mimicked the water strider's leg.

• Journal of radiological science and technology
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• v.26 no.4
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• pp.21-26
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• 2003

To evaluate the newly designed gastroduodenal coil catheter:in-vitro test. The coil catheter that we made in our laboratory was 150 cm. The coil that is made of stainless steel wire was composed 1.3 mm inner diameter and this coil spring was covered with heat-shrinkable polyethylene tube. To measure the length under fluorocopy, 8 radiopaque marks were attached at 5 cm, 10 cm, 11 cm, 12 cm, 13 cm, 14 cm, 15 cm, 20 cm apart from distal end of the catheter and 6, 2, 1 pores were made at 7 cm, 13 cm, 19 cm apart from the distal end. Radio-opacity and the amount of injected contrast was investigated in formerly used 5 Fr. vessel catheter, which is possible in measuring length, and newly designed coil catheter. Film density was tested for radio-opacity with autodensitometer. For measuring the volume of injected salin, the catheter was located in the acryl box(26 cm, 3 cm, 16 cm) that divided into 4 chambers. After injection 50 cc of contrast with autoinjector, the contrast's quantity in each chamber was measured with and without over the guide wire. Radio-opacity was 0.51 in 5 Fr. vessel catheter, 0.31 in newly made catheter. The amount of injected contrast was measured. In case of 5 Fr. vessel catheter, the amount was 99.5% from the distal part, there was no difference between with and without the guide wire. Otherwise, using a coil catheter, the pacentage the ejected saline was 1.17%, 18.8%, 41.8%, 38.2% from the distal part with the guide wire, 19.5%, 32.6%, 27.7%, 20.3% without the guide wire. Compare with formerly established catheter, this new coil catheter is easy to measure the length thanks to easy confirming under fluoroscopy and excellent in injecting contrast. Therefore, newly designed gastrointestinal catheter seems to be useful in gastrointestinal intervention procedure.

• Journal of Korean Orthopaedic Sports Medicine
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• v.2 no.2
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• pp.168-175
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• 2003

Fracture about proximal humerus may be classified as the articular segment or the anatomical neck, the greater tuberosity, the lesser tuberosity, and the shaft or surgical neck. Now, usually used, Neer's classification is based on the number of segments displaced, over 1cm of displaced or more than 45 degrees of angulation , rather than the number of fracture line . Absolute indication of a operative treatment a open fracture, the fracture with vascular injury or nerve injury , and unreductable fracture-dislocation . Inversely, the case that are severe osteoporosis, and eldly patient who can't be operated by strong internal fixation is better than arthroplasty used by primary prosthetic replacement and early rehabilitation program than open reduction and internal fixation. The operator make a decision for the patient who should be taken the open reduction and internal fixation, because it's different that anatomical morphology, bone density, condition of patient. The operator decide operation procedure. For example, percutaneous pinning, open reduction, plate & screws, wire tension bands combined with some intramedullary device are operation procedure that operator can decide . The poor health condition for other health problem, fracture with unstable vital sign and severe osteoporosis , are the relative contraindication. The stable fracture without dislocation is not the operative indication . The radiologic film of the prokimal humerus before the operation can not predict for fracture evaluation. It's necessary to good radiologic film for evaluation of fracture form. The trauma serise is better than the other radiologic film for evaluation. The accessary radiologic exam is able to help for evaluation of bone fragment and anatomy. The CT can be helpful in evaluating these injury, especially if the extract fracture type cannot be determined from plain roenterogram of the proximal humerus, bone of humerus head. If the dislocation is severe anatomically , we could consider to do three dimentional remodelling. The MRI doing for observing of bony morphology before the operation is not better than CT If we were suspicious of vascular injury, we could consider the angiography.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Journal of radiological science and technology
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• v.32 no.3
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• pp.335-341
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• 2009

Purpose : The medical imaging issuance is changed from conventional film method to Digital Compact Disk solution because of development on IT technology. However other medical record department's are undergoing identification check through and through whereas medical imaging department cannot afford to do that. So, we examine present applicant's recognition of private intelligence safeguard, and medical imaging issuance condition by CD & DVD medium toward various medical facility and then perform comparative analysis associated with domestic and foreign law & recommendation, lastly suggest standard for medical imaging issuance and process relate with internal environment. Materials and methods : First, we surveyed issuance process & required documents when situation of medical image issuance in the metropolitan medical facility by wire telephone between 2008.6.1$\sim$2008.7.1. in accordance with the medical law Article 21$\sim$clause 2, suggested standard through applicant's required documents occasionally - (1) in the event of oneself $\rightarrow$ verifying identification, (2) in the event of family $\rightarrow$ verifying applicant identification & family relations document (health insurance card, attested copy, and so on), (3) third person or representative $\rightarrow$ verifying applicant identification & letter of attorney & certificate of one's seal impression. Second, also checked required documents of applicant in accordance with upper standard when situation of medical image issuance in Kyung-hee university medical center during 3 month 2008.5.1$\sim$2008.7.31. Third, developed a work process by triangular position of issuance procedure for situation when verifying required documents & management of unpreparedness. Result : Look all over the our manufactured output in the hospital - satisfy the all conditions $\rightarrow$ 4 place(12%), possibly request everyone $\rightarrow$ 4 place(12%), and apply in the clinic section $\rightarrow$ 9 place(27%) that does not medical imaging issuance office, so we don't know about required documents condition. and look into whether meet or not the applicant's required documents on upper 3month survey - satisfy the all conditions $\rightarrow$ 629 case(49%), prepare a one part $\rightarrow$ 416 case(33%), insufficiency of all document $\rightarrow$ 226case(18%). On the authority of upper research result, we are establishing the service model mapping for objective reception when image export situation through triangular position of issuance procedure and reduce of friction with patient and promote the patient convenience. Conclusion : The PACS is classified under medical machinery that mean indicates about higher importance of medical information therefore medical information administrator's who already received professional education & mind, are performer about issuance process only and also have to provide under ID checking process exhaustively.