• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.12
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• pp.2340-2348
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• 1992

Recently, various film coated insert tools have been used in order to improve tool life by several different vapor deposition or chemical vapor deposition. Especially, TiN coated drills have been broadly studied because of improving drill performance in terms of drill life, work quality and its brilliant color. Nevertheless, because of the poor adhesion between TiN film and drill, it was difficult to attain the better drill performance. Therefore, to improve adhesion of TiN films, we sputtered titanium as interlayer prior to TiN deposition on drill by PECVD(Plasma Enhanced Chemical Vapor Deposition). The results indicate that Ti/TiN coated drills achieve about 2.6 times life improvement, while TiN coated drills only 2 times. Wear characteristics of tested drills were examined using SEM, and the results were correlated with drill life and roughness of drilled holes.

• Macromolecular Research
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• v.11 no.5
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• pp.357-367
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• 2003

The linear low density polyethylene (LLDPE)/zeolite composite using novel inorganic filler, zeolite, is prepared by a conventional compounding procedure using a twin-screw extruder. The observed scanning electron microscopic (SEM) morphology shows a good dispersion and adhesion of zeolite in the LLDPE matrix. The mechanical properties in terms of the Young's modulus, the yield stress, the impact strength, and the elongation at break were enhanced with a successive increment of zeolite content up to 40 wt%. The X-ray diffraction measurement is of supportive for the improved mechanical properties and the complex melt viscosity is as well. Upon applying a certain level of strain on the composites, the dewetting, the air hole formation and its growth are characterized. The dewetting originates around the filler particles at low strain and induces elliptical micropores upon further stretching. The microporosity such as the aspect ratio, the number and the total area of the air holes is also characterized. Thus, the composites loaded 40 % zeolite and 300 % elongation may be applicable for breathable microporous films with improved modulus, impact and yield stress, elongation at break, microporosity and air hole properties.

• Journal of Information Display
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• v.12 no.1
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• pp.47-50
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• 2011

Highly stable amorphous indium.gallium.zinc-oxide (a-IGZO) thin-film transistors (TFTs) were fabricated with an etchstopper and via-hole structure. The TFTs exhibited 40 $cm^2$/V s field-effect mobility and a 0.21 V/dec gate voltage swing. Gate-bias stress induced a negligible threshold voltage shift (${\Delta}V_{th}$) at room temperature. The excellent stability is attribute to the via-hole and etch-stopper structure, in which, the source/drain metal contacts the active a-IGZO layer through two via holes (one on each side), resulting in minimized damage to the a-IGZO layer during the plasma etching of the source/drain metal. The comparison of the effects of the DC and AC stress on the performance of the TFTs at $60^{\circ}C$ showed that there was a smaller ${\Delta}V_{th}$ in the AC stress compared with the DC stress for the same effective stress time, indicating that the trappin of the carriers at the active layer-gate insulator interface was the dominant degradation mechanism.

• Korean Journal of Materials Research
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• v.9 no.6
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• pp.583-588
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• 1999

The characteristics of copper thin films and pattern filling capability were investigated by ECD. Prior to deposition of copper film, seed-Cu/Ta(TaN)/$SIO_2$(BPSG)/Si structure was manufactured. Copper deposition was performed with various current waveforms(DC/PC, 1~10,000Hz) and current densities(10~60 mA/$\textrm{cm}^2$) after pretreatment (Oxident removal, wetting) of seed-layer. Conformal pattern filling was performed using PC method with fast deposition rate of 6,000~8,000$\AA$/min. Heat-treated($450^{\circ}C$, 30min) copper films showed good resistivities of 1.8~2.1$\mu$$\Omega$.cm. According to the XRD analysis, (111)-preferred orientation of copper film was found in ECD-Cu/seed-Cu/Ta/$Sio_2$/Si structure. Also, we have successfully achieved to fill via holes with 0.35$\mu\textrm{m}$ width and 4:1 aspect ratio.

• Journal of the Korean Vacuum Society
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• v.2 no.4
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• pp.474-479
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• 1993

Submicron contact hole filling with aluminum alloys has been achieved with a multistep metallization method, which utilizes a metal " flow" or self-diffusion process at elevated temperatures after the metal was sputter-deposited. A multi-chamber, modular sputtering system was employed to deposit aluminum alloys and subsequently to anneal the deposited metal films under vacuum at high temperatures. The film were deposited on 200 mm wafers with planar, dc magnetron sputtering sources without anysubstrate bias. The basic process steps studied for the multistep metallization include an initial layer deposition at low temperatures less than $100^{\circ}C$, and an annealin gstep at elevated temperatures, between 450 and $550^{\circ}C$. The degree of planarization or step coverage was dependent strongly upon the temperature and time of the flow step and complete filling of the submicron contacts with aluminum alloys was achieved. Responsible mechanisms for the enhancement in step coverge and factros determining uniform and reproducible flow of aluminum alloys during the high temperauture step are discussed.discussed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.12
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• pp.1058-1062
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• 2009

For the investigation of the mechanism of photoelectric characteristics of a hydrogenated amorphous silicon thin film transistor(a-Si:H TFT), spectral characteristics of various backlights were analyzed in terms of the photon energy at each wavelength. Photon energy spectral characteristics were obtained through the multiplication of each photon energy and spectral intensities of backlights at each wavelength and the total photon energies were obtained by the integration of the photon energy spectrums. From the comparison of the experimental photo leakage current and the calculated photon energy, it was possible to conclude that the absorption of illuminated backlight to a-Si:H layer and the generation of electrons and holes are mainly carried out at the wavelength less than 500 nm as described in previous reports.

• International Journal of Concrete Structures and Materials
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• v.2 no.2
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• pp.99-105
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• 2008

Southern exposure test specimens were used to evaluate corrosion performance of epoxy-coated reinforcing bars in chloride contaminated concrete by electrochemical impedance spectroscopy method. The test specimens with conventional bars, epoxy-coated bars and corrosion inhibitors were subjected 48 weekly cycles of ponding with sodium chloride solution and drying. The polarization resistance obtained from the Nyquist plot was the key parameter to characterize the degree of reinforcement corrosion. The impedance spectra of specimens with epoxy-coated bars are mainly governed by the arc of the interfacial film and the resistance against the charge transfer through the coating is an order of magnitude higher than that of the reference steel bars. Test results show good performance of epoxy-coated bars, although the coatings had holes simulating partial damage, and the effectiveness of corrosion-inhibiting additives. The corrosion rate obtained from the impedance spectroscopy method is equivalent to those determined by the linear polarization method for estimating the rate of corrosion of reinforcing steel in concrete structures.

• Proceedings of the Korean Society of Medical Physics Conference
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• 2002.09a
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• pp.183-185
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• 2002

Heavy ion and proton therapy necessitate range weeks, which are time consuming. Three types of variable compensator, membrane type liquid variable compensator, are proposed by some of the authors to overcome the difficulties, by those arbitrarily thickness distribution of compensator obtained from treatment planning is created at the site of treatment. None of the ideas, however, is yet realized. In this research, we are trying to construct prototype membrane-type liquid variable compensator. This variable compensator partitions air and liquid with elasticity membrane and changes the surface of the elasticity membrane with the thread. The air and oil move through holes to and from the out of beam side of two boxes in which they are contained. The boxes are made of Plexiglas(PMMA), the thread which is made of nylon, the elasticity film which is made from latex for the moment.

• Laser Solutions
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• v.2 no.3
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• pp.32-41
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• 1999

This study is about Jig used in wiring when we make Probecard and Large Scale Intergrated Electronic Circuit. The most universal wiring method is molding with Bond. Polymer film is punched down and adhesives is applied after wiring. Due to shrinkage and modification many problems still have happened in the process of molding. To solve these problems, ceramic plate was introduced in the study. Using Laser, an experiment of microhole treatment on ceramic plate was proceeded. Laser energy, assistance gas, and special features by purity degree were analyzed with the 35W low capacity YAG-Laser. In the condition of energy 0.08J, frequency 20Hz and interval time 200$mutextrm{s}$, about 70${\mu}{\textrm}{m}$ microhole was adequate for the Probecard Jig. In the purity experiment of ceramic materials, high purity ceramic met with good result for microhole. But the price is too high. The shape and size of holes machined combustion gas $O_2$ were better than those in $N_2$ and Ar, the inert gas.