• Proceedings of the KWS Conference
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• 2010.05a
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• pp.22-22
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• 2010

Eutectic composition phase with low melting point which solidifies at the final stage affects the solidification cracking at the intercellular or interdendritic area of welds and castings. If sufficient amount of eutectic composition liquid does not exist between the solidifying phases, the discontinuities remain as cracks. However, abundant amount of liquid eutectic composition existing in the final stage can flow into the discontinuities easily and heal the cracks. By flowing of liquid eutectic and healing of discontinuities, the possibility of cracking can be reduced when the amount of eutectic liquid is sufficient. For the solidification of pure metals, liquid eutectic does not exist and the interlocking of growing solid phases can be realized without interruption of liquid film. Therefore there is little possibility of solidification cracking in the case of welds and castings of pure metal. In a practical sense, the effective way to reduce or prevent the solidification cracking is making the composition of molten pool or melts near to the eutectic composition.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.86-94
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• 2000

This study was performed to investigate types and formation mechanism of cracks in two Al alloy welds, A5083 and A7N01 spot-welded by pulse Nd : YAG laser, using SEM, EPMA and Micro-XRD. In the weld zone, three types of crack were observed : center line crack({TEX}$C_{C}${/TEX}), diagonal crack({TEX}$C_{D}${/TEX}), and U shape crack({TEX}$C_{U}${/TEX}). Also, HAZ crack({TEX}$C_{H}${/TEX}) was observed in the HAZ region, furthermore, mixing crack({TEX}$C_{M}${/TEX}) consisting of diagonal crack and HAZ crack was observed. White film was formed at th hot crack region in the fractured surface after it was immersed to 10% NaOH water. In the case of A5083 alloy, white films in {TEX}$C_{C}${/TEX} crack and {TEX}$C_{D}${/TEX} crack region were composed of low melting phases, {TEX}$Fe_{2}SiAl_{8}${/TEX} and eutectic phases, $Mg_2$Al$_3$ and $Mg_2$Si. Such films observed $CuAl_2$, {TEX}$Mg_{32}(Al,Zn)_{3}${/TEX}, MgZn$_2$, $Al_2$CuMg and $Mg_2$Si were observed in the whitely etched films near {TEX}$C_{C}${/TEX} crack and {TEX}$C_{D}${/TEX} crack regions. The formation of liquid films was due to the segregation of Mg, Si, Fe in the case of A5083 alloy and Zn, Mg, Cu, Sim in the case of A7N01 alloy, respectively. The {TEX}$C_{C}${/TEX} and {TEX}$C_{D}${/TEX} cracks were regarded as a result of the occurrence of tensile strain during the welding process. The formation of {TEX}$C_{M}${/TEX} crack is likely to be due to the presence of liquid film at the grain boundary near the fusion line in the base metal as well as in the weld fusion zone during solidification. The {TEX}$C_{U}${/TEX} crack is considered a result of the collapsed keyhole through incomplete closure during rapid solidification.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.10
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• pp.59-66
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• 1993

PZT thin film deposited by rf magnetron sputtering was annealed by rapid thermal process(RTP) in PbO ambient to prevent vaporing of Pb and interface reactions. Si and TiN/Ti/Si substrates were prepared to survey application of TiN/Ti layer which can prevent interface interaction with Si and crack of PZT thin films. As temperature increased. PZT thin films surface on Si substrate appeared more severe cracks which should affect electrical properties deadly. TiN/Ti(40-150${\mu}{\Omega}{\cdot}cm$) layer applied for buffer layer suppressed interface interaction and film cracking. The measured leakage current(LC) and breakdown voltage(BV) of PZT thin film on TiN/Ti/Si substrate annealed at 650$^{\circ}$C for 15 sec (thickness of 2500$\AA$) were 38 nA/cm2 and 3.5 MV/cm and dielectric constant was 310 at 1 MHz, and remanent polarization (Pr) and coercive field (Ec) were 6.4${\mu}C/cm^{2}$ and 0.2MV/cm at 60 Hz, respectively.

• Journal of Sensor Science and Technology
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• v.15 no.6
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• pp.386-390
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• 2006

This paper describes the ohmic contact formation of polycrystalline 3C-SiC films deposited on thermally grown Si wafers. In this work, a TiW (titanium tungsten) film as a contact material was deposited by RF magnetron sputter and annealed with the vacuum process. The specific contact resistance (${\rho}_{c}$) of the TiW contact was measured by using the C-TLM (circular transmission line method). The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature as also analyzed by XRD (X-ray diffraction) and SEM (scanning electron microscope). All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30 min., the lowest contact resistivity of $2.90{\times}10{\Omega}cm^{2}$ was obtained due to the improved interfacial adhesion. Therefore, the good ohmic contact of polycrystalline 3C-SiC films using the TiW film is very suitable for high-temperature MEMS applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05b
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• pp.82-85
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• 2003

This dissertation describes an optimization method for fabricating thick films with superconducting YBCO powders by electrophoresis technique. The lateral alternating applied voltage caused to shake the superconducting powder vertically to the deposition field during the process of the oriented deposition so that it was deposited along the c-axis on the silver tape with shaky-aligned EPD. As the result, the optimized thin film fabrication method was obtained to get more dense and uniform surface morphology as well as the improved critical current density. For commercial utilization and efficiency, in this dissertation, alternating voltage of 25-120 V/cm in frequency of 60Hz was proposed to apply it as a subsidiary source for shaky-flow deposition so that the fabricated thin film showed uniform surface morphology with less voids and cracks and $T_{c.zero}$ of 90 K and the critical current density of $3419A/cm^2$.

• Journal of the Speleological Society of Korea
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• no.76
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• pp.49-55
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• 2006

The submicron $YBa_2Cu_3O_x$ powder was prepared by the sol-gel method. The particle size is distributed from 0.2 to 1.0 ${\mu}m$, which benefits to eliminate the micro-cracks formed in the $YBa_2Cu_3O_x$ films deposited by electrophoresis. The powder was single phase of $YBa_2Cu_3O_x$ examined by X-ray diffraction. In the sol-gel process the citrate gel was formed from citric acid and nitrate solution of $Y_2O_3$, $Ba(NO_3)_2$ and CuO. When pH values were adjusted to 6.4-6.7, $Ba(NO_3)_2$ could be dissolved in the citrate solution completely. Appropriate evaporative temperature of the sol-gel formation is discussed. Acetone is used as electrophoreticsolution, in which some water and iodine (0.2 g/1) and polyethylene glycol (2 vol. %) are added. The concentrations of $YBa_2Cu_3O_x$ powders is 20g/l. The thickness of deposited film could be more than 50 ${\mu}m$ in 3 minutes of depositing time. The most EPD films could be 90K zero resistance and the Jc values were over 1000A/cm2 (0 H, 77 K).

• Korean Journal of Materials Research
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• v.22 no.10
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• pp.526-530
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• 2012

Silica-based ceramic-matrix composites have shown promise as advanced materials for many applications such as chemical catalysts, ceramics, pharmaceuticals, and electronics. $SiO_2$-CuO-$CeO_2$ multi-component powders and their thin film, using an oxalic acid template as a chelating agent, have larger surface areas and more uniform pore size distribution than those of inorganic acid catalysts. $SiO_2$-CuO-$CeO_2$ composite powders were synthesized using tetraethylorthosilicate, copper (II) nitrate hemi (pentahydrate), and cerium (III) nitrate hexahydrate with oxalic acid as template or pore-forming agent. The process of thermal evolution, the phase composition, and the surface morphology of these powders were monitored by thermogravimetry-differential thermal analysis (TG-DTA), X-ray diffractometry (XRD), field-emission scanning electron microscopy (FE-SEM), and energy dispersive X-ray spectrometry (EDXS). The mesoporous property of the powders was observed by Brunner-Emmett-Teller surface (BET) analysis. The improved surface area of this powder template with oxalic acid was $371.4m^2/g$. This multi-component thin film on stainless-steel was prepared by sol-gel dip coating with no cracks.

• Journal of the Korean institute of surface engineering
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• v.54 no.1
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• pp.18-24
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• 2021

KNN is widely used in the electronic industry such as memory devices, sensors, and capacitors due to various structural, electrical, and eco-friendly properties. In this study, Mn-doped KNN was prepared by adopting a sol-gel method with advantages of low cost and large area thin film fabrication. The Mn-doped KNN thin films were deposited by annealing in air for 1 hour and 700℃. The surface morphology characteristics and grain size of the heat-treated KNN were observed by SEM and AFM, and we used the X-ray diffraction for measuring the crystal phase of KNN. The XRD analysis results show that the fabrication of (K0.5Na0.5)(Nb1-xMnn)O3 thin films by sol-gel method in the thin film process of this experiment was stable in the perovskite phase of c-axis orientation. The SEM and AFM results show that the cracks were not confirmed from the fracture surface data of KNN thin films and were densely deposited with thin films with uniform thickness.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.40 no.4
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• pp.66-73
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• 2008

When coated paperboard is printed, pressed into a groove with a creasing rule and folded, white line cracking occurs along the crease due to intensive mechanical pressure. The cracking will deteriorates product quality and waste resources. Effects of creasing pressure and ink dosage on the foldability of coated board were investigated. It was shown that applying an optimum pressure is important during creasing. When the pressure was too low, the crease formed was not sufficiently deep enough to enable precise folding. When an excess pressure was applied, fiber bonding was destroyed, resulted in unsatisfactory cracking. When the coated board was folded in machine direction (MD), long cracks were formed along MD. When it folded in cross direction (CD), the cracks were shorter and formed perpendicular to CD. Printing promoted cracking due to the decrease in flexibility of coated board. In addition, uneven ink film layer on the coating layer caused worse cracking.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.11-15
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• 2018

The parts of equipment for semiconductor are protected by anodic aluminum oxide film to prevent corrosion. This study investigated contamination particle and cracking behavior of anodic oxidation in sulfuric acid containing cerium salt. The insulating properties of the sample were evaluated by measuring the breakdown voltage. It was confirmed that the breakdown voltage was about 50% higher when the cerium salt was added, and that the breakdown voltage after the heat treatment was 55% and 35% higher at $300^{\circ}C$ and $400^{\circ}C$, respectively. After heating at $300^{\circ}C$ and $400^{\circ}C$, cracks were observed in non cerium and cerium 3mM, and more cracks occur at $400^{\circ}C$ than at $30^{\circ}C$. The amount of contamination particles generated in the plasma is about 45% less than that of non-cerium specimens.