• Title/Summary/Keyword: Film cracks

Search Result 169, Processing Time 0.026 seconds

A study on damage propagation characteristics of granite in different damage levels (단계별 손상에 따른 화강암의 손상 발달특성 연구)

  • Park, Hyuck;Jeong, Gyo-Cheol
    • The Journal of Engineering Geology
    • /
    • v.12 no.3
    • /
    • pp.273-284
    • /
    • 2002
  • The purpose of this study is to characterize damage propagation in granite which exists in South Korea. Coarse, medium and fine-grained granite specimens were sampled respectively In order to perform this study, elastic wave velocity test and permeability test were carried out to estimate the physical specificities of specimens before and after damage. Cellulose acetate film duplication method was used to select only cracks from cross section and to make these visible. Using dark-field illumination, approach photographing technique was used to get more distinct photographs of cracks from acetate peel. Computer programs named Photoshop were used to describe cracks. After damage, coarse and medium-grained granite had lower elastic wane velocity, higher permeability, more cracks and more distinct shear fractures than fine-grained granite.

Pure inorganic protective silica coating on stainless steel prepared at low heat treatment temperature

  • Hwang, Tae-Jin
    • Proceedings of the Materials Research Society of Korea Conference
    • /
    • 2010.05a
    • /
    • pp.6.2-6.2
    • /
    • 2010
  • Stainless steel is widely known to have superior corrosion properties. However, in some harsh conditions it still suffers various kinds of corrosions such as galvanic corrosion, pitting corrosion, intergranular corrosion, chloride stress corrosion cracking, and etc. For the corrosion protection of stainless steel, the ceramic coatings such as protective silica film can be used. The sol-gel coating technique for the silica film has been extensively studied especially because of the cost effectiveness. It has been proved that silica can improve the oxidation and the acidic corrosion resistance of metal surface in a wide range of temperatures due to its high heat and chemical resistance. However, in the sol-gel coating process there used to engage a heat treatment at an elevated temperature like $500^{\circ}C{\sim}600^{\circ}C$ where cracks in the silica film would be formed because of the thermal expansion mismatch with the metal. The cracks and pores of the film would deteriorate the corrosion resistance. When the heat treatment temperature is reduced while keeping the adhesion and the density of the film, it could possibly give the enhanced corrosion resistance. In this respect, inorganic protective silica film was tried on the surface of stainless steel using a sol-gel chemical route where silica nanoparticles, tetraethoxysilane (TEOS) and methyltriethoxysilane (MTES) were used. Silica nanoparticles with different sizes were mixed and then the film was deposited on the stainless steel substrate. It was intended by mixing the small and the large particles at the same time a sufficient consolidation of the film is possible because of the high surface activity of the small nanoparticles and a modest silica film is obtained with a low temperature heat treatment at as low as $200^{\circ}C$. The prepared film showed enhanced adhesion when compared with a silica film without nanoparticle addition. The films also showed improved protect ability against corrosion.

  • PDF

Dielectric Breakdown Behavior of Anodic Oxide Films Formed on Pure Aluminum in Sulfuric Acid and Oxalic Acid Electrolytes

  • Hien Van Pham;Duyoung Kwon;Juseok Kim;Sungmo Moon
    • Journal of the Korean institute of surface engineering
    • /
    • v.56 no.3
    • /
    • pp.169-179
    • /
    • 2023
  • This work studies dielectric breakdown behavior of AAO (anodic aluminum oxide) films formed on pure aluminum at a constant current density in 5 ~ 20 vol.% sulfuric acid (SA) and 2 ~ 8 wt.% oxalic acid (OA) solutions. It was observed that dielectric breakdown voltage of AAO film with the same thickness increased with increasing concentration of both SA and OA solutions up to 15 vol.% and 6 wt.%, respectively, above which it decreased slightly. The dielectric breakdown resistance of the OA films appeared to be superior to that of SA films. After dielectric breakdown test, cracks and a hole were observed. The crack length increased with increasing SA film thickness but it did not increase with increasing OA film thickness. To explain the reason why shorter cracks formed on the OA films than the SA films after dielectric breakdown test, the generation of tensile stresses at the oxide/metal interface was discussed in relation to porosity of AAO films obtained from cross-sectional morphologies.

Cleaning Effects by NH4OH Solution on Surface of Cu Film for Semiconductor Devices (NH4OH용액이 반도체 소자용 구리 박막 표면에 미치는 영향)

  • Lee, Youn-Seoung;Noh, Sang-Soo;Rha, Sa-Kyun
    • Korean Journal of Materials Research
    • /
    • v.22 no.9
    • /
    • pp.459-464
    • /
    • 2012
  • We investigated cleaning effects using $NH_4OH$ solution on the surface of Cu film. A 20 nm Cu film was deposited on Ti / p-Si (100) by sputter deposition and was exposed to air for growth of the native Cu oxide. In order to remove the Cu native oxide, an $NH_4OH$ cleaning process with and without TS-40A pre-treatment was carried out. After the $NH_4OH$ cleaning without TS-40A pretreatment, the sheet resistance Rs of the Cu film and the surface morphology changed slightly(${\Delta}Rs:{\sim}10m{\Omega}/sq.$). On the other hand, after $NH_4OH$ cleaning with TS-40A pretreatment, the Rs of the Cu film changed abruptly (${\Delta}Rs:till{\sim}700m{\Omega}/sq.$); in addition, cracks showed on the surface of the Cu film. According to XPS results, Si ingredient was detected on the surface of all Cu films pretreated with TS-40A. This Si ingredient(a kind of silicate) may result from the TS-40A solution, because sodium metasilicate is included in TS-40A as an alkaline degreasing agent. Finally, we found that the $NH_4OH$ cleaning process without pretreatment using an alkaline cleanser containing a silicate ingredient is more useful at removing Cu oxides on Cu film. In addition, we found that in the $NH_4OH$ cleaning process, an alkaline cleanser like Metex TS-40A, containing sodium metasilicate, can cause cracks on the surface of Cu film.

Estimation of Thermal Stresses Induced in Polymeric Thin Film Using Boundary Element Methods

  • Lee, Sang-Soon
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
    • /
    • 2002.11a
    • /
    • pp.27-33
    • /
    • 2002
  • The residual thermal stresses at the interface corner between the elastic substrate and the viscoelastic thin film due to cooling from cure temperature down to room temperature have been studied. The polymeric thin film was assumed to be thermorheologically simple. The boundary element method was employed to investigate the nature of stresses on the whole interface. Numerical results show that very large stress gradients are present at the interface comer and such stress singularity might lead to edge cracks or delamination.

  • PDF

HVOF Thermal Sprayed AISI316-WC Coating Layer on Stainless Steel for PEMFC Bipolar Plate (고분자 전해질 연료전지용 분리판으로서 스테인리스강에 HVOF 용사된 AISI316-WC 코팅층)

  • Nam, Dae-Geun
    • New & Renewable Energy
    • /
    • v.4 no.1
    • /
    • pp.31-36
    • /
    • 2008
  • Stainless steels have been widely considered as metallic bipolar plates, due to their passive surface film, which is good for corrosion resistance. However, the high resistivity of the passive film increases interfacial contact resistance between the bipolar plates and the electrodes. Stainless steels thermal spray coated with a mixture of tungsten carbide and stainless steel powders showed that the coated layer safely combined with the matrix but they suffered many internal defects including voids and cracks. Many cracks were formed in the coated layer and the interface of the matrix and the coated layer during the rolling process. The coated and rolled stainless steels showed lower interfacial contact resistance and corrosion resistance than bare stainless steel because of low resistivity of tungsten carbide and numerous defects, which caused crevice corrosion, in the coated layer.

  • PDF

Characteristic of HVOF AISI316-WC Coating Layer on Stainless Steel Separator for PEMFC (고분자 전해질 연료전지용 스테인리스강 분리판의 HVOF AISI316-WC 코팅층 특성)

  • Nam, Dae-Geun;Kang, Nam-Hyun;Park, Yeong-Do;Kim, Young-Seok
    • 한국신재생에너지학회:학술대회논문집
    • /
    • 2008.10a
    • /
    • pp.1-5
    • /
    • 2008
  • Stainless steels have been widely considered as metallic separators, due to their passive surface film, which is good for corrosion resistance. However, the high resistivity of the passive film increases interfacial contact resistance between the separators and electrodes. Stainless steels thermal spray coated with a mixture of tungsten carbide and stainless steel powders showed that the coated layer safely combined with the matrix but they suffered many internal defects including voids and cracks. Many cracks were formed in the coated layer and the interface of the matrix and the coated layer during the rolling process. The coated and rolled stainless steels showed lower interfacial contact resistance and corrosion resistance than bare stainless steel because of low resistivity of tungsten carbide and numerous defects, which caused crevice corrosion, in the coated layer.

  • PDF

Effect of Equal Channel Angular Pressing on the Pitting Corrosion Resistance of Hard Anodized Al5052 Alloy (경질양극산화를 실시한 Al5052합금의 내공식성에 미치는 ECAP의 영향)

  • Son, Injoon
    • Journal of the Korean institute of surface engineering
    • /
    • v.48 no.4
    • /
    • pp.142-148
    • /
    • 2015
  • The effect of equal channel angular pressing (ECAP) on the pitting corrosion resistance of hard anodized Al5052 alloy was investigated. The degree of internal stress generated in anodic oxide films during hard anodization was also evaluated with a strain gauge method. The pitting corrosion resistance of hard anodized Al5052 alloy was greatly decreased by ECAP. Cracks occurred in the anodic oxide film during hard anodization and these cracks were larger and deeper in the alloy with ECAP than without. The pitting corrosion was accelerated by cracks. The internal stress present in the anodic oxide films was compressive and the stress was higher in the alloys with ECAP than without, resulting in an increased likelihood of cracks. The pitting corrosion resistance of hard anodized Al5052 alloy was improved by annealing at the range of 473-573K after ECAP processed at room temperature for four passes. The compressive internal stress gradually decreased with increasing annealing temperature. It is assumed that the improvement in the pitting corrosion resistance of hard anodized Al5052 alloy by annealing may be attributed to a decrease in the likelihood of cracks due to the decreased internal stresses in anodic oxide films.

Effect of Strain Rate on the Deformation and Cracking Behaviors of ITO/PET Sheets with 45 ohms/sq. Sheet Resistance (면저항 45 ohms/sq.의 ITO/PET Sheets의 변형률 속도에 따른 균열 형성 거동)

  • Kim, Jin-Yeol;Hong, Sun-Ig
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.22 no.1
    • /
    • pp.67-73
    • /
    • 2009
  • The stress-strain behavior and its effects on the crack initiation and growth of ITO film on PET substrate with a sheet resistance of 45 ohms/sq were investigated. Electrical resistance increased gradually at the strain of 0.7% in the elastic to plastic transition region of the stress strain curves. Numerous cracks were observed after 1% strain and the increase of the resistance can be linked to the cracking of ITO thin films. The onset strain for the increase of resistance increased with increasing strain rate, suggesting the crack initiation is dependent on the strain rate. Upon loading, the initial cracks perpendicular to the tensile axis were observed and propagated the whole sample width with increasing strain. The spacing between horizontal cracks is thought to be determined by the fracture strength and the interfacial strength between ITO and PET. The crack density increased with increasing strain. The spacing between horizontal cracks (perpendicular to the stress axis) increased with decreasing strain rate, The increase of crack density with decreasing strain rate can be attributed to the higher fraction of the plastic strain to the total strain at a given total strain. As the strain increased over 5% strain, cracks parallel to the stress axis were developed and increased in number with strain, accompanied by drastic increases of resistance.

Crystallization of Yttria-Stabilized-Zirconia Film by Sol-Gel Process (졸-겔법에 의한 이트리안 안정화 지프코니아박막의 결정화)

  • 서원찬;조차제;윤영섭;황운석
    • Journal of the Korean institute of surface engineering
    • /
    • v.30 no.3
    • /
    • pp.183-190
    • /
    • 1997
  • Fabrication and crystallization characteristics of yttria($T_2O_3$) stabilized zirconia(YSZ) thin film by sol-gel process were studied. YSZ sol was synthesized with zirconium n-propoxide($Zr(OC_3H_7)_4)$) and yttrium nitrate pentahydrate ($Y(NO_3)_3.5H_2O$). YSZ film was prepared by depositing the polymeric sol on porous $Al_2O_3$ substrate by spin-coating, and the film characteristics were investigated by FRIR, TG-DTA, XRD, DSC, optical microscopy and SEM. The film topology was uniform and cracks were not found. It was found that the annealing temperature and the concentration of stabilizer affect the crystallization of YSZ film. The YSZ film began to crystallize from amorphous to tetragonal phase at 40$0^{\circ}C$, and it was not converted to cubic structure until $1100^{\circ}C$. It seemed that the grains were formed over $700^{\circ}C$and the average grain size was obtained about 0.2$\mu\textrm{m}$.

  • PDF