• 지질공학
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• 제12권3호
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• pp.273-284
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• 2002

화강암의 응력하에서의 손상발달특성을 연구하기 위해 국내의 조립, 중립, 세립 화강암 시료를 채취하였으며, 일축압축에 의한 손상 전과 후에 탄성파속도시험, 투수성시험이 시료의 물리적 특성을 파악하기 위해 수행되었고, 시료의 단면에 발생된 크랙의 육안관찰을 용이하게 하기 위하여 셀롤로즈 아세테이트 필름 복제법이 사용되었다. 그리고 아세테이트필 상의 크랙을 좀더 명확하게 촬영하기 위해, 암시야조명을 이용한 근접촬영법이 적용되었다. 개인용 컴퓨터와 그래픽 프로그램을 이용하여 크랙을 확대 후 스케치하여 측정함으로써 시료단면에 발생한 크랙을 입도 별로 비교 분석하였다. 손상이 발생한 후, 조립·중립화강암이 세립화강암에 비해 상대적으로 더 낮은 탄성파속도, 더 높은 투수성을 가졌으며, 더 많은 크랙 발생을 보였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.6.2-6.2
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• 2010

Stainless steel is widely known to have superior corrosion properties. However, in some harsh conditions it still suffers various kinds of corrosions such as galvanic corrosion, pitting corrosion, intergranular corrosion, chloride stress corrosion cracking, and etc. For the corrosion protection of stainless steel, the ceramic coatings such as protective silica film can be used. The sol-gel coating technique for the silica film has been extensively studied especially because of the cost effectiveness. It has been proved that silica can improve the oxidation and the acidic corrosion resistance of metal surface in a wide range of temperatures due to its high heat and chemical resistance. However, in the sol-gel coating process there used to engage a heat treatment at an elevated temperature like $500^{\circ}C{\sim}600^{\circ}C$ where cracks in the silica film would be formed because of the thermal expansion mismatch with the metal. The cracks and pores of the film would deteriorate the corrosion resistance. When the heat treatment temperature is reduced while keeping the adhesion and the density of the film, it could possibly give the enhanced corrosion resistance. In this respect, inorganic protective silica film was tried on the surface of stainless steel using a sol-gel chemical route where silica nanoparticles, tetraethoxysilane (TEOS) and methyltriethoxysilane (MTES) were used. Silica nanoparticles with different sizes were mixed and then the film was deposited on the stainless steel substrate. It was intended by mixing the small and the large particles at the same time a sufficient consolidation of the film is possible because of the high surface activity of the small nanoparticles and a modest silica film is obtained with a low temperature heat treatment at as low as $200^{\circ}C$. The prepared film showed enhanced adhesion when compared with a silica film without nanoparticle addition. The films also showed improved protect ability against corrosion.

• 한국표면공학회지
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• 제56권3호
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• pp.169-179
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• 2023

This work studies dielectric breakdown behavior of AAO (anodic aluminum oxide) films formed on pure aluminum at a constant current density in 5 ~ 20 vol.% sulfuric acid (SA) and 2 ~ 8 wt.% oxalic acid (OA) solutions. It was observed that dielectric breakdown voltage of AAO film with the same thickness increased with increasing concentration of both SA and OA solutions up to 15 vol.% and 6 wt.%, respectively, above which it decreased slightly. The dielectric breakdown resistance of the OA films appeared to be superior to that of SA films. After dielectric breakdown test, cracks and a hole were observed. The crack length increased with increasing SA film thickness but it did not increase with increasing OA film thickness. To explain the reason why shorter cracks formed on the OA films than the SA films after dielectric breakdown test, the generation of tensile stresses at the oxide/metal interface was discussed in relation to porosity of AAO films obtained from cross-sectional morphologies.

• 한국재료학회지
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• 제22권9호
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• pp.459-464
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• 2012

We investigated cleaning effects using $NH_4OH$ solution on the surface of Cu film. A 20 nm Cu film was deposited on Ti / p-Si (100) by sputter deposition and was exposed to air for growth of the native Cu oxide. In order to remove the Cu native oxide, an $NH_4OH$ cleaning process with and without TS-40A pre-treatment was carried out. After the $NH_4OH$ cleaning without TS-40A pretreatment, the sheet resistance Rs of the Cu film and the surface morphology changed slightly(${\Delta}Rs:{\sim}10m{\Omega}/sq.$). On the other hand, after $NH_4OH$ cleaning with TS-40A pretreatment, the Rs of the Cu film changed abruptly (${\Delta}Rs:till{\sim}700m{\Omega}/sq.$); in addition, cracks showed on the surface of the Cu film. According to XPS results, Si ingredient was detected on the surface of all Cu films pretreated with TS-40A. This Si ingredient(a kind of silicate) may result from the TS-40A solution, because sodium metasilicate is included in TS-40A as an alkaline degreasing agent. Finally, we found that the $NH_4OH$ cleaning process without pretreatment using an alkaline cleanser containing a silicate ingredient is more useful at removing Cu oxides on Cu film. In addition, we found that in the $NH_4OH$ cleaning process, an alkaline cleanser like Metex TS-40A, containing sodium metasilicate, can cause cracks on the surface of Cu film.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2002년도 추계학술대회 발표 논문집
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• pp.27-33
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• 2002

The residual thermal stresses at the interface corner between the elastic substrate and the viscoelastic thin film due to cooling from cure temperature down to room temperature have been studied. The polymeric thin film was assumed to be thermorheologically simple. The boundary element method was employed to investigate the nature of stresses on the whole interface. Numerical results show that very large stress gradients are present at the interface comer and such stress singularity might lead to edge cracks or delamination.

• 신재생에너지
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• 제4권1호
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• pp.31-36
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• 2008

Stainless steels have been widely considered as metallic bipolar plates, due to their passive surface film, which is good for corrosion resistance. However, the high resistivity of the passive film increases interfacial contact resistance between the bipolar plates and the electrodes. Stainless steels thermal spray coated with a mixture of tungsten carbide and stainless steel powders showed that the coated layer safely combined with the matrix but they suffered many internal defects including voids and cracks. Many cracks were formed in the coated layer and the interface of the matrix and the coated layer during the rolling process. The coated and rolled stainless steels showed lower interfacial contact resistance and corrosion resistance than bare stainless steel because of low resistivity of tungsten carbide and numerous defects, which caused crevice corrosion, in the coated layer.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2008년도 추계학술대회 논문집
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• pp.1-5
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• 2008

Stainless steels have been widely considered as metallic separators, due to their passive surface film, which is good for corrosion resistance. However, the high resistivity of the passive film increases interfacial contact resistance between the separators and electrodes. Stainless steels thermal spray coated with a mixture of tungsten carbide and stainless steel powders showed that the coated layer safely combined with the matrix but they suffered many internal defects including voids and cracks. Many cracks were formed in the coated layer and the interface of the matrix and the coated layer during the rolling process. The coated and rolled stainless steels showed lower interfacial contact resistance and corrosion resistance than bare stainless steel because of low resistivity of tungsten carbide and numerous defects, which caused crevice corrosion, in the coated layer.

• 한국표면공학회지
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• 제48권4호
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• pp.142-148
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• 2015

The effect of equal channel angular pressing (ECAP) on the pitting corrosion resistance of hard anodized Al5052 alloy was investigated. The degree of internal stress generated in anodic oxide films during hard anodization was also evaluated with a strain gauge method. The pitting corrosion resistance of hard anodized Al5052 alloy was greatly decreased by ECAP. Cracks occurred in the anodic oxide film during hard anodization and these cracks were larger and deeper in the alloy with ECAP than without. The pitting corrosion was accelerated by cracks. The internal stress present in the anodic oxide films was compressive and the stress was higher in the alloys with ECAP than without, resulting in an increased likelihood of cracks. The pitting corrosion resistance of hard anodized Al5052 alloy was improved by annealing at the range of 473-573K after ECAP processed at room temperature for four passes. The compressive internal stress gradually decreased with increasing annealing temperature. It is assumed that the improvement in the pitting corrosion resistance of hard anodized Al5052 alloy by annealing may be attributed to a decrease in the likelihood of cracks due to the decreased internal stresses in anodic oxide films.

• 한국전기전자재료학회논문지
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• 제22권1호
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• pp.67-73
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• 2009

The stress-strain behavior and its effects on the crack initiation and growth of ITO film on PET substrate with a sheet resistance of 45 ohms/sq were investigated. Electrical resistance increased gradually at the strain of 0.7% in the elastic to plastic transition region of the stress strain curves. Numerous cracks were observed after 1% strain and the increase of the resistance can be linked to the cracking of ITO thin films. The onset strain for the increase of resistance increased with increasing strain rate, suggesting the crack initiation is dependent on the strain rate. Upon loading, the initial cracks perpendicular to the tensile axis were observed and propagated the whole sample width with increasing strain. The spacing between horizontal cracks is thought to be determined by the fracture strength and the interfacial strength between ITO and PET. The crack density increased with increasing strain. The spacing between horizontal cracks (perpendicular to the stress axis) increased with decreasing strain rate, The increase of crack density with decreasing strain rate can be attributed to the higher fraction of the plastic strain to the total strain at a given total strain. As the strain increased over 5% strain, cracks parallel to the stress axis were developed and increased in number with strain, accompanied by drastic increases of resistance.

• 한국표면공학회지
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• 제30권3호
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• pp.183-190
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• 1997

Fabrication and crystallization characteristics of yttria($T_2O_3$) stabilized zirconia(YSZ) thin film by sol-gel process were studied. YSZ sol was synthesized with zirconium n-propoxide($Zr(OC_3H_7)_4)$) and yttrium nitrate pentahydrate ($Y(NO_3)_3.5H_2O$). YSZ film was prepared by depositing the polymeric sol on porous $Al_2O_3$ substrate by spin-coating, and the film characteristics were investigated by FRIR, TG-DTA, XRD, DSC, optical microscopy and SEM. The film topology was uniform and cracks were not found. It was found that the annealing temperature and the concentration of stabilizer affect the crystallization of YSZ film. The YSZ film began to crystallize from amorphous to tetragonal phase at 40$0^{\circ}C$, and it was not converted to cubic structure until $1100^{\circ}C$. It seemed that the grains were formed over $700^{\circ}C$and the average grain size was obtained about 0.2$\mu\textrm{m}$.