• 한국전기전자재료학회논문지
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• 제22권9호
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• pp.747-750
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• 2009

The TFTs have been fabricated with 3 different geometry SID electrodes which have the same channel W/L ratio (W/L = 5) due to constant channel resistance, The 3 samples have different channel widths (350, 150, and 25 ${\mu}m$) and channel lengths (70, 30, and 5 ${\mu}m$) by fixed channel W/L ratio simultaneously on one chip for reliable comparisons. Resultant on-current and field effect mobility are proportional to the channel width, while the subthreshold swing is inversely proportional to the channel width mainly due to the change of contact resistance. These results show that the contact resistance strongly affects the device performances and should be considered in the applications.

• Corrosion Science and Technology
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• 제5권5호
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• pp.153-159
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• 2006

Austenitic stainless steels with addition of various amounts of Mo and W were evaluated in terms of corrosion and contact resistance to determine optimum alloy composition of metallic bipolar plate for PEMFC. The corrosion property was evaluated by both acid fume exposure test at $130^{\circ}C$ and by electrochemical polarization tests in $H_3PO_4$ solution at $80^{\circ}C$. Austenitic stainless steel with proper amount of Mo and W demonstrated not only good corrosion resistance but also low contact resistance. Analyses on the passive film show that partial substitution of Mo by W enhances passive film stability and repassivation property. Test results suggest that austenitic stainless steel with 2 wt%Mo and 4 wt%W has optimum composition for metallic bipolar plate used in PEMFC.

• 전기학회논문지
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• 제56권1호
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• pp.147-150
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• 2007

Electro-deposition of carbon film on silicon substrate in methanol solution was carried out with various current density, solution temperature and electrode spacing between anode and cathode. The carbon films with smooth surface morphology and high electrical resistance were formed when the distance between electrode was relatively wider. The electrical resistance of the carbon films were independent of both current density and solution temperature.

• 대한전자공학회논문지
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• 제24권6호
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• pp.980-985
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• 1987

The thin metal films of Cr, Al, Mn and were made in various evaporation rates with 100\ulcornerthickness under 2x10**-9 bar vacuum level. We analized and discussed the relationships between changes of structure, morphology and sheet resistance, light transmittance for the corresponding evaporation rates. As the evaporation rates were decreased at higher rates, grain sizes of all film were decreased, however both of the sheet resistance and light transmittance were increased. At lower evaporation rate, films of Cr and Cu porduced non-stoi-chiometric oxides but Al an Mn showed up amorphous structures.

• 한국식품영양학회지
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• 제7권4호
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• pp.399-405
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• 1994

Some method was introduced to explain oxygen transfer from broth to cell during aerobic microbe cultivation. It is explained by 5 steps that how desolved oxygen can reach to cell. Among these steps film resistance was the most important factor to describe oxygen transfer. Lumped model and distributed model was introduced to explain oxygen diffusion rate and oxygen consumption rate which occurs in the microbe pellet.

• 공업화학
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• 제2권3호
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• pp.289-299
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• 1991

후막 구리도체에 적합한 유리를 얻기 위하여 연붕규산계 및 무연 붕규산계 유리를 기반으로 하는 9종의 유리를 제조하고 후막 구리도체에의 적합성을 시험하였다. 그 결과 모든 유리들이 후막 구리도체의 쉬트 저항치, 납땜성 및 땜납 침식저항에는 양호하게 기여하는 것을 확인하였다. 그러나 후막과 알루미나 기판간의 노화후의 부착강도는 연붕규산계 유리로 만들어진 구리 도체막 만이 유용한 값을 가졌고, 그 외의 유리로 만들어진 구리 도체막의 노화후 부착강도는 사용하기에 부적합할 정도로 낮은 것이었다. 특히 $Cu_2O$ 가 첨가된 연붕규산계 유리가 후막 구리도체 제조에 가장 양호한 것으로 확인되었다.

• Transactions on Electrical and Electronic Materials
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• 제12권3호
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• pp.110-114
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• 2011

Polymeric films of high chemical stability and mechanical strength covered with a thin metallic film have been extensively used in various fields as electric and electronic materials. In this study, we have chosen polypropylene (PP) as the polymer due to its outstanding chemical resistance and good creep resistance. We coated thin nickel film on PP films by the electroless plating process. The surfaces of PP films were pre-treated and modified to increase the adhesion strength of metal layer on PP films, prior to the plating process, by an environment-friendly process with atmospheric plasma generated using dielectric barrier discharges in air. The surface morphologies of the PP films were observed before and after the surface modification process using a scanning electron microscope (SEM). The static contact angles were measured with deionized water droplets. The cross-sectional images of the PP films coated with thin metal film were taken with SEM to see the combined state between metallic and PP films. The adhesion strength of the metallic thin films on the PP films was confirmed by the thermal shock test and the cross-cutting and peel test. In conclusion, we made a composite material of metallic and polymeric films of high adhesion strength.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.318.2-318.2
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• 2014

The high contact resistance is still one of the major issues to be resolved in CdS/CdTe thin film solar cells. CdTe/Metal Schottky contact induced a high contact resistance in CdS/CdTe solar cells. It has been reported that the work function of CdTe thin film is more than 5.7 eV. There has not been a suitable back contact metal, because CdTe thin film has a high work function. In a few decades, some buffer layer was reported to improve a back contact problem. Buffer layers which are Te, $Sb_2Te_3$, $Cu_2Te$, ZnTe:Cu and so on was inserted between CdTe and metal electrode. A formed buffer layers made a tunnel junction. Hole carriers which was excited in CdTe film by light absorption was transported from CdTe to back metal electrode. In this report, we reported the variation of solar cell performance with different buffer layer at the back contact of CdTe thin film solar cell.

• 한국표면공학회지
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• 제47권4호
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• pp.147-154
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• 2014

Formation behavior of PEO (Plasma Electrolytic Oxidation) films on AZ31 Mg alloy was studied in aqueous solutions containing various concentrations of hydroxide ion ($OH^-$) and silicate ion ($SiO_3{^{2-}}$) by voltage-time curves, and corrosion resistance of the PEO film-covered specimen was investigated by immersion test in 0.5 M NaCl solution. From the analyses of the voltage-time curves, it is suggested that two different types of anions are essentially needed for the formation of PEO films on AZ31 Mg alloy: film formation agent and local film breakdown agent. $SiO_3{^{2-}}$ ion acts only as a film formation agent but $OH^-$ ion acts not only as a film formation agent but also film breakdown agent. The PEO films prepared on AZ31 Mg alloy in alkaline silicate solution showed very good corrosion resistance without any pitting or filiform corrosions up to 480 h of immersion in 0.5 M NaCl.

• 전기전자학회논문지
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• 제25권1호
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• pp.69-75
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• 2021

본 연구에서는 티타늄(Ti) 금속 박막을 사용해서 값비싼 산화주석(FTO) 전극을 대체된 염료감응형 태양전지(DSSC)의 제작 방법과 전기적 특성에 대해서 고찰하였다. Ti 박막의 증착 시간을 조절하여 박막의 두께를 변화시켰으며, Ti 박막의 두께가 두꺼워지면서 표면저항은 감소하였다. 대략 190nm 두께에서 FTO 박막의 표면저항과 비슷해짐을 알 수 있었으며, 250nm 두께에서 DSSC의 에너지 변환효율 4.24%로 가장 높았다. 더 나아가 DSSC 모듈을 제작해 평가함으로써 상용화의 가능성을 확인하였다.