• Geomechanics and Engineering
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• v.15 no.6
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• pp.1143-1151
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• 2018

Loess often causes problems when used as a filling material in the construction of foundations. Therefore, the compaction technique, shear behavior, and bearing capacity of a filled foundation should be carefully considered. A series of tests was performed in this study to obtain effective compaction techniques and construction parameters. The results indicated that loess is strongly sensitive to water. Thus, the soil moisture content should be kept within 12%-14% when it is used as a filling material. The vibrating-dynamic combination compaction technique is effective and has fewer limitations than other methods. In addition, the shear strength of the compacted loess was found to increase linearly with the degree of compaction, and the soil's compressibility decreased rapidly with an increase in the degree of compaction when the degree of compaction was less than 95%. Finally, the characteristic value of the bearing capacity increased with an increase in the degree of compaction in a ladder-type way when the degree of compaction was within 92%-95%. Based on the test data, this paper could be used as a reference in the selection of construction designs in similar engineering projects.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.767-770
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• 2000

In order to reduce lean-time and cost, recently the technology of Rapid Prototyping and Manufacturing(PR/M) has been used widely. So various RP/M methods have been developed and these systems commercialized several years ago. The machining process is one of these methods. It also offers advantages such as precision and versatility. But there are some considerations during machining. The most important problem among them is the fixturing. So we have to overcome the limitation because the fixturing time is depend on the complexity of geometry to be machined. In this paper, we have developed the fixturing technique using filling process that can be widely useful for rapid products within a short time. So we have carried out some kinds of rapid products such as plastic knob and metal fan using our fixturing process. In fixturing step, the filling material might chosen a resin or a alloy according to wether the work material is plastic or metal respectively. Also we developed the set-up equipment attachable on the table of the milling machine that provided practicable quality during a series of machining operations, named by two step milling process.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.16 no.1
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• pp.37-41
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• 2020

The Nuclear containment building is a main safety-related structure that performs shielding and conservation functions to prevent highly radioactive materials from leakage to the outside environment in the case of various environmental conditions and postulated accidents. The containment building contains a reactor, steam generator, pressurizer, tank, reactor coolant system, auxiliary system and engineering safety system, and is designed so that highly radioactive materials above the limits specified in 10 CFR 100 do not escape to the outside environment in the case of LOCA(Loss of Coolant Accident) for instance. The containment metal liner plate(CLP) is a carbon steel plate with a nominal plate thickness of 6 mm, which functions as a mold for the wall and dome of the containment building when concrete is filled, fulfills airtightness to prevent leakage of seriously radioactive materials. In recent years, backside corrosion was found on the liner plate in some domestic nuclear power plants. The main cause of backside corrosion was unfilled concrete. In this paper, an inspection technique of assessing filling suitability for CLP backside concrete is developed. Results show that the validity of inspection technique for CLP backside concrete using vibration sensor is successfully verified.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.10 no.5
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• pp.2124-2143
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• 2016

In Long Term Evolution-Advanced (LTE-A) systems, Inter-cell Interference (ICI) is a prominent limiting factor that affects the performance of the systems, especially at the cell edges. Based on the literature, Fractional Frequency Reuse (FFR) methods are known as efficient interference management techniques. In this report, the proposed Dynamic Fractional Frequency Reuse (DFFR) technique improved the capacity and cell edge coverage performance by 70% compared to the Fractional Frequency Reuse (FFR) technique. In this study, an improved power allocation method was adopted into the DFFR technique to reach the goal of not only reducing the ICI mitigation at the cell edges, but also improving the overall capacity of the LTE-A systems. Hence, an improved water-filling algorithm was proposed, and its performance was compared with that of other methods that were considered. Through the simulation results and comparisons with other frequency reuse techniques, it was shown that the proposed method significantly improved the performance of the cell edge throughput by 42%, the capacity by 75%, and the coverage by 80%. Based on the analysis and numerical expressions, it was concluded that the proposed DFFR method provides significant performance improvements, especially for cell edge users.

• Journal of the Korea Computer Graphics Society
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• v.26 no.3
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• pp.39-48
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• 2020

In this paper, we propose a new technique for filling holes in triangular mesh. First, arbitrary shaped holes are detected. Second, source and target hole patches are generated through triangulation, refinement, fairing, and smoothing. Finally, the shape difference between the two patches is analyzed and a patch with enhanced features is obtained through blending between patches. The effectiveness of the proposed technique is demonstrated by applying the hole filling technique to the triangular mesh model with various shaped holes.

• Journal of the korean academy of Pediatric Dentistry
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• v.32 no.3
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• pp.481-490
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• 2005

The aim of this study was to investigate the relationship between the C-factor and shrinkage strain values of composite resin and examine the strain values in different incremental filling techniques. The strain gauge method was used for measurement of polymerization shrinkge strain. Experiment was divided two step. In a first experiment, we compared with strain value in three different depth (2mm, 3mm, 4mm) and microhardness of each samples after 24hours were measured. In a second experiment, we examined the strain values in five different filling techniques(Group 1: bulk filling, Group 2: oblique incremental filling, Group 3: horizontal incremental filling, Group 4: vertical incremental filling, Group 5: lining of flowable resin and bulk filling) The results of the present study can be summarized as follows: 1. Composite resin in acrylic molds showed the initial expansion at the early phase of polymerization. 2. Contraction stress was not revealed significant difference between depth of 2mm and 3mm(P>0.05). 3. Contraction stress in sample of 4mm was showed the lowest value(P<0.05). 4. Microhardness of specimen was revealed more difference between upper and lower surface in depth of 4mm than 2 and 3mm(P<0.05). 5. Lining of flowable resin and bulk filling (Group 5) was showed the lowest contraction stress, Group 2 and 3 was showed the highest contraction stress(P<0.05). On the basis above results, the stress that result from the polymerization shrinkage, when incremental curing techniques are used, showed that there is no advantage in incremental placement and curing.

• Restorative Dentistry and Endodontics
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• v.34 no.4
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• pp.350-355
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• 2009

Bond strength depends on characteristics of bonding surface and restorative technique. The majority of studies dealing with dentin bond strength were carried out on flat bonding surface, therefore, difference of bond strength between axial wall and pulpal wall is not clear yet. This study evaluated bonding difference between cavity walls in class I composite resin restoration with different filling techniques. Twenty extracted caries-free human third molars were used. Cavities were prepared in 6 ${\times}$4 ${\times}$3 mm box-type and divided into four groups according to filling technique and bonding surface: Group I; bulk filling - pulpal wall, Group II; bulk filling - axial wall, Group III; incremental filling - pulpal wall, Group IV; incremental filling - axial wall. Cavities were filled with Filtek $Z250^{(R)}$(3M/ESPE., USA) and Clearfill SE $bond^{(R)}$(Kuraray, Japan). After 24 hour-storage in $37^{\circ}C$water, the resin bonded teeth were sectioned bucco-lingualy at the center of cavity. Specimens were vertically sectioned into 1.0 ${\times}$1.0 mm thick serial sticks perpendicular to the bond surface using a low-speed diamond saw (Accutom 50, Struers, Copenhagen, Denmark) under water cooling. The trimmed specimens were then attached to the testing device and in turn, was placed in a universal testing machine (EZ test, Shimadzu Co., Kyoto, Japan) for micro-tensile testing at a cross-head speed of 1 mm/min. The results obtained were statistically analyzed using 2-way ANOVA and t-test at a significance level of 95%. The results were as follows: 1. There was no significant difference between bulk filling and incremental filling. 2. There was no significant difference between pulpal wall and axial wall, either. Within the limit of this study, it was concluded that microtensile bond strength was not affected by the filling technique and the site of cavity walls.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

• The KIPS Transactions:PartD
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• v.11D no.1
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• pp.23-30
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• 2004

In order to approximate the spatial query result size we partition the input rectangles into subsets and estimate the query result size based on the partitioned spatial area. In this paper we examine query result size estimation in skewed data. We examine the existing spatial partitioning techniques such as equi-area and equi-count partitioning, which are analogous to the equi-width and equi-height histograms used in relational databases, and examine the other partitioning techniques based on spatial indexing. In this paper we propose a new spatial partitioning technique based on the Hilbert space filling curve. We present a detailed experimental evaluation comparing the proposed technique and the existing techniques using synthetic as well as real-life datasets. The experiments showed that the proposed partitioning technique based on the Hilbert space filling curve achieves better query result size estimation than the existing techniques for space query size, bucket numbers, skewed data, and spatial data size.

• Korean Journal of Materials Research
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• v.26 no.8
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• pp.427-429
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• 2016

A multi-step deposition process for the gap-filling of submicrometer trenches using dimethyldimethoxysilane (DMDMOS), $(CH_3)_2Si(OCH_3)_2$, and $C_xH_yO_z$ by plasma enhanced chemical vapor deposition (PECVD) is presented. The multi-step process consisted of pre-treatment, deposition, and post-treatment in each deposition step. We obtained low-k films with superior gap-filling properties on the trench patterns without voids or delamination. The newly developed technique for the gap-filling of submicrometer features will have a great impact on inter metal dielectric (IMD) and shallow trench isolation (STI) processes for the next generation of microelectronic devices. Moreover, this bottom up gap-fill mode is expected to be universally for other chemical vapor deposition systems.