• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.10 no.1
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• pp.22-32
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• 1998

Separate type thermosyphon has larger critical heat flux than non-loop type thermosyphon, because the flooding phenomenon of vapor and liquid occurring in non-loop one does not occur. The experimental study has been carried out separate type thermosyphon with single tube. An investigation of heat transfer characteristics in separate type thermosyphon is performed experimentally. Heat transfer coefficients in an evaporator and condenser were measured experimentally. The effects of liquid filling ratio, height difference, cooling temperature and heat flux on the heat transfer coefficients were examined. As a result, the reasonable range of the liquid filling ratio and the dependence of heat transfer on vapor temperature and heat flux are obtained.

• Advances in concrete construction
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• v.3 no.2
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• pp.103-111
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• 2015

The foam concrete was fabricated by adding the foaming agent which composite ordinary Portland cement with plant and animal protein into cement paste, and the electromagnetic wave absorption properties were studied for the first time as well. The studies showed that the electromagnetic waves can be absorbed by multiple reflections and scattering within the porous material. Thickness and filling ratio have a great influence on the electromagnetic wave absorbing properties in 2-18 GHz of the foam concrete, the greater the thickness, the better the performance of absorption; filling ratio was about 52 vol.%, the absorbing properties achieved the best.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2682-2687
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• 2008

Depressurized drainage systems have been used for more than 30 years and are becoming a common part of urban drainage infrastructures. The hydraulic principles governing the operation of the depressurized drainage systems were studied in this paper and particularly, focused on the analysis of unsteady characteristics of the two-phase flow. A definition of the filling ratio was outlined and types of flow pattern were classified according to the filling ratio. Experiments were conducted to investigate the main features of pressure fluctuation. All results were found to depend on the filling ratio of the upstream pipe flow as well as the upstream Froude number.

• Journal of the Society of Naval Architects of Korea
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• v.60 no.6
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• pp.460-472
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• 2023

This study was conducted based on the case of an accident (excessive deformation) that occurred during the hydraulic test of a shipboard tank manufactured in accordance with the design regulations. Over-pressure phenomenon was noted as the main cause of accidents in the process of testing tanks without physical damage, which can be found in external factors such as cross-sectional difference between inlet pipe and air pipe and higher water filling rate than the recommended one. The main goal of this paper is to establish a safe water filling rate according to the range of sectional area ratio(SAR) reduced below the regulations for each test situation. The simulation was conducted in accordance with the hydraulic test procedure specified in the Ship Safety Act, and the main situation was divided into two types: filling the tank with water and increasing the water head to the test pressure. The structural safety evaluation of the pressure generated inside the tank and the effect on the structure during the test was reviewed according to the SAR range. Based on the results, guidelines for the optimal filling rate applicable according to SAR during the hydraulic test were presented for the shipboard tanks used in this study.

• Tunnel and Underground Space
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• v.22 no.6
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• pp.449-461
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• 2012

Coal ash generated from thermal power plants is planned to use for mine filling in order to prevent subsidence of the ground. In according, the basic physical properties and flow characteristics were grasped using coal ash from generated Yeongdong thermal power plant, and hydraulic filling experiments were performed a total of eight times by manufacturing the model of 1 inclined shaft in Hanbo coal mine. The specific gravity of coal ash is 2.34, and the result of particle size analysis belongs to silty sand (SM). Coal ash of weight ratio of 60% was used in the filling experiments of the model, since liquefaction have shown in coal ash less than weight ratio of 70% from the result of slump and flow test. The outlet should be located at the bottom of the inclined and vertical shaft, this was favorable way in improving the filling efficiency from the experiment results regardless of groundwater exists.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Korean Journal of Metals and Materials
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• v.49 no.4
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• pp.334-341
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• 2011

The mechanism behind super-filling of high-aspect-ratio features with Cu by catalyst-enhanced chemical vapor deposition (CECVD) coupled with plasma treatment is described and the metrology required to predict the filling feasibility is identified and quantified. The reaction probability of a Cu precursor was determined as a function of substrate temperature. Iodine adatoms are deactivated by the bombardment of energetic particles and also by the overdeposition of sputtered Cu atoms during the plasma treatment. The degree of deactivation of adsorbed iodine was experimentally quantified. The quantified factors, reaction probability and degree of deactivation of iodine were introduced to the simulation for the prediction of the trench filling aspect by CECVD coupled with plasma treatment. Simulated results show excellent agreement with the experimental filling aspects.

• Tribology and Lubricants
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• v.22 no.1
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• pp.20-25
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• 2006

The stress behavior analysis of a-rings and packing for a LPG filling unit has been presented using a finite element analysis technique by non-linear MSC/MARC program. The sealing performance and endurance of a-rings and packing are affected by working conditions such as filling pressure, friction coefficient, compression ratio, and material properties. The elastomeric polymers of O-rings and packing are nitrile butadiene rubber (NBR) and polytetrafluoroethylene (PTFE), which are selected as proper materials of a-rings and packing based on the stress analysis results. The calculated FEM results showed that the proper material of O-ring is NBR as a secondary sealing component and the recommended material of packing is PTFE as a primary sealing unit during a LPG filling process.

• Korea-Australia Rheology Journal
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• v.20 no.2
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• pp.79-88
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• 2008

In this study, we focus on the improvement of the filling efficiency in injection molding by application of ultrasonic vibration. While studies about the filling efficiency of typical filling processes in the injection molding have been widely performed, there have been only few studies about the filling efficiency of an ultrasonic process. The effect of the ultrasonic vibration is an important process condition, which influences the flow characteristics of polymer melt. This new condition even affects well-known injection conditions such as cavity pressure, injection temperature and mold temperature. For this study, we carried out a numerical analysis by appropriate modeling and analysis of the ultrasonic process in the filling process. To verify this numerical analysis, we compared the numerical results with the experimental data. Also, we analyzed the filling process in a thin cavity using this numerical analysis. To understand the flow characteristics of polymer melt in the ultrasonic process, we substituted real and complex vibration conditions with simplified and classified conditions according to the position of vibrating cavity surfaces and the phase difference between two opposing cavity surfaces. We also introduced MFR (melt flow ratio) as a new index to estimate the filling efficiency in the ultrasonic process.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.91-96
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• 2014

Through silicon via (TSV) technology is to form a via hole in a silicon chip, and to stack the chips vertically for three-dimensional (3D) electronics packaging technology. This can reduce current path, power consumption and response time. In this study, Cu-filling substrate size was changed from Si-chip to a 4" wafer to investigate the behavior of Cu filling in wafer level. The electrolyte for Cu filling consisted of $CuSO_4$ $5H_2O$, $H_2SO_4$ and small amount of additives. The anode was Pt, and cathode was changed from $0.5{\times}0.5cm^2$ to 4" wafer. As experimental results, in the case of $5{\times}5cm^2$ Si chip, suitable distance of electrodes was 4cm having 100% filling ratio. The distance of 0~0.5 cm from current supplying location showed 100% filling ratio, and distance of 4.5~5 cm showed 95%. It was confirmed good TSV filling was achieved by plating for 2.5 hrs.