• Elastomers and Composites
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• v.56 no.4
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• pp.234-242
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• 2021

The demand for truck bus radial (TBR) tires with enhanced fuel efficiency and wear resistance have grown in recent years. In addition, as the issue of particulate matter and air pollution increases, efforts are being made to reduce the generation of particulate matter. In this study, the properties of epoxidized natural rubber (ENR) containing a silica-friendly functional group were evaluated by considering it as a base rubber and varying the silica ratio in this binary filler system. The results showed that the wear resistance of the NR/BR blend compound decreased as the silica ratio increased. In contrast, the ENR/BR blend compound exhibited an increase in wear resistance as the silica ratio was increased. In particular, the ENR-50/BR blend compound showed the best wear resistance due to the presence of several epoxide groups. Furthermore, we observed that for tan 𝛿 at 60℃, higher epoxide content resulted in the higher T_g of the rubber, indicating a higher tan 𝛿 at 60℃. On the other hand, it was confirmed that increasing the silica ratio decreased the value of tan 𝛿 at 60℃ in all compounds. In addition, we measured the amount of wear particulate matters generated from the compound wear. These measurements confirmed that in the binary filler system, regardless of the filler type, the quantity of the generated wear particulate matters as the filler-rubber interaction increased. In conclusion, the silica filled ENR/BR blend compound exhibited the lowest generation of wear particulate matters.

• Polymer(Korea)
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• v.25 no.6
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• pp.774-781
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• 2001

In order to reuse the waste matters, the polyester hybrid composites were fabricated with the waste stone (WSP) and waste tire (WTC). Before mixing, the waste fillers were treated with the silane coupling agent [${\gamma}$-methacryloxy propyl trimethoxy silane(${\gamma}$-MPS)] for enhancing the dispersion of the fillers and interfacial bonding with polymer matrix. Mechanical properties and morphologies of the resulted hybrid composites were investigated with the filler content. The hybrid composites containing surface treated fillers have high initial thermal decomposition temperature and low weight loss compared to the untreated one. The highest mechanical properties of composites were obtained with the ${\gamma}$-MPS (2 wt%) treated fillers. The porosity of composite increased with the content of organic filler which can be reduced by the silane surface treatment of fillers. The pore size distribution of the composites varied with the waste filler content.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• The Journal of Korean Academy of Prosthodontics
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• v.31 no.3
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• pp.317-349
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• 1993

This study investigated the effect of filler particle size and weight% on mechanical properties of dental core porcelain. In alumina, variation in particle size and weight% and in zirconia, variation in weight%, all specimens were tested three-point bending strength, transmittance, thermal expansion coefficient, porosity and shrinkage and observed with SEM and analysed with X-ray diffractometer. In order to develop shrink-free porcelain, after firing alumina only, glass wasinfiltrated. And aluminum was added to alumina with the expanding character of aluminum oxidize into alumina, and was followed by second firing of glass infiltration procedure. Then mechanical properties were observed. The results of this study were obtained as follows. 1. The bending strength of zirconia was higher than that of alumina, and $5{\mu}m$ alumina had highest strength in variation of particle size of alumina. Except for $5{\mu}m$ alumina, increased with weight%, bending strength increased up to 80% and decreased at 90%. In case of glass infiltration, bending strength was slight higher than 80% and 90% of $5{\mu}m$ alumina. 2. Transmittance increased with increase of shrinkage, decrease of porosity, and with increase of filler size and had no direct correlation with weight%. 3. Thermal expansion coefficient of alumina group was $7.42\sim8.64\times10^{-6}/^{\circ}C$ and that of zirconia group was $9.83\sim12.11\times10^{-6}/^{\circ}C$ and the latter was higher than the former. 4. In x-ray diffraction analysis, alumina group and zirconia group increased $Al_2O_3$ peak and $t-ZrO_2$ peak with increase of weight%. The second phase(cristobalite peak) was observed in zirconia 40% group. 5. Porosity of zirconia was lower than that of alumina and $5{\mu}m$ alumina group had many pores with SEM. In case of low filler content, fracture occurred in glass and high filler content, in glass and filler. In case of aluminum addition to alumina, small oxidised aluminum was observed. 6. Zirconia group had high shrinkage than alumina group, and mixed group of alumina group had high shrinkage. In case of glass infiltration, shrinkage decreased and aluminum addition to alumina group was almost shrink-free.

• Journal of the Korean Ceramic Society
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• v.43 no.9 s.292
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• pp.552-557
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• 2006

A low temperature processing route for fabricating porous SiC ceramics by carbothermal reduction has been demonstrated. Effects of expandable microsphere content, sintering temperature, filler content, and carbon source on microstructure, porosity, compressive strength, cell size, and cell density were investigated in the processing of porous silicon carbide ceramics using expandable microspheres as a pore former. A higher microsphere content led to a higher porosity and a higher cell density. A higher sintering temperature resulted in a decreased porosity because of an enhanced densification. The addition of inert filler increased the porosity, but decreased the cell density. The compressive strength of the porous ceramics decreased with increasing the porosity. Typical compressive strength of porous SiC ceramics with ${\sim}70%$ porosity was ${\sim}13 MPa$.

• Design & Manufacturing
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• v.18 no.3
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• pp.9-14
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• 2024

Among the various plastic polymer molding methods, thermoplastic resins are most commonly used for mass production due to their suitability for high-volume manufacturing. However, recently, thermosetting resins have been utilized depending on product design and functionality, necessitating appropriate mold design and injection conditions to achieve suitable molded products. Therefore, resin selection must be considered not only in terms of product design but also based on functionality, taking into account the physical and mechanical properties of the resin. Additionally, since the flow characteristics of the resin are critical in injection molding, molding conditions should be set according to the thermal, physical, and rheological properties of the resin.This study focuses on the effects of filler content (glass fiber) in thermosetting fiber-reinforced plastics (FRP), specifically Bulk Molding Compound (BMC) resin, which is crucial for thermal deformation in automotive motor housing products. The resins used in this study include Generic BMC1 resin, BMC1 with 15% glass fiber, and BMC1 with 30% glass fiber. The research employs CAE (Computer-Aided Engineering) to investigate strain under basic conditions for the BMC resin and the strain variations with the addition of glass fiber. It also examines the impact of filler content on injection molding conditions, specifically mold temperature and curing time. Experimental results indicate that mold temperature has the most significant effect among the injection conditions, while the impact of curing time was relatively minor.

• Journal of Adhesion and Interface
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• v.9 no.3
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• pp.7-13
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• 2008

The particulate type silicon carbide (SiC) and fiber type carbon fiber (CF) filler, of similar thermal conductivities, were mixed with polyetheretherketone (PEEK) to investigate the filler effects on the thermal diffusivity. The SiC and CF fillers had a good and uniform dispersion in PEEK matrix. Thermal diffusivities of PEEK composites were measured from ambient temperature up to $200^{\circ}C$ by laser flash method. The diffusivities were decreased as increasing temperature due to the phonon scattering between PEEK-filler and filler-filler interfaces. Thermal diffusivity of PEEK composites was increased with increasing filler content and the thermal conductivities of two-phase system were compared to the experimental results and it gave ideas on the filler dispersion, orientation, aspect ratio, and filler-filler interactions. Nielson equation gave a good prediction to the experimental results of PEEK/SiC. The easy network formation by CF was found to be substantially more effective than SiC and it gave a higher thermal diffusivities of PEEK/CF than PEEK/SiC.

• Korean Journal of Materials Research
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• v.27 no.1
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• pp.12-18
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• 2017

Transparent organic-inorganic hybrid hard coating films were prepared by the addition of $SiO_2$ or $ZrO_2$, as an inorganic filler to improve the hardness property, filler was highly dispersed in the acrylic resin. To improve the compatibility in the acrylic resin, $SiO_2$ or $ZrO_2$ is surface-modified using various silanes with variation of the modification time and silane content. Depending on the content and kind of the modified inorganic oxide, transparent modified inorganic sols were formulated in acryl resin. Then, the sols were bar coated and cured on PET films to investigate the optical and mechanical properties. The optimized film, which has a modified $ZrO_2$ content of 4 wt% markedly improved in terms of the hardness, haze, and transparency as compared to neat acrylate resin and acrylate resin containing modified $SiO_2$ content of 8 wt%. Meanwhile, the low transparency and high haze of these films slowly appeared at $SiO_2$ content above 10 wt% and $ZrO_2$ content of 5 wt%, but the hardness values were maintained at 2H and 3H, respectively, in comparison with the HB of neat acrylate resin.

• Polymer(Korea)
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• v.31 no.3
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• pp.221-227
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• 2007

The mechanical properties and morphologies of lyocell and its blend we compared. Poly (vinyl alcohol) (PVA) was used as a filler in blends with lyocell produced through solution blending. The variations of their properties with polymer matrix filler content are discussed. The ultimate tensile strength of the PVA/lyocell blend is highest for a blend lyocell content of 30 wt%, and decreases as the lyocell content is increased up to 40 wt%. The variations in the initial moduli of the blends with filler content are similar. Lyocell and its blended hybrid films were prepared by the solution intercalation method, using dodecyltriphenylphosphonium-mica ($C_{12}PPh$-Mica) as the organoclay. The variations of the mechanical tensile properties of the hybrids with the organoclay content were examined. These properties were found to be optimal for an organoclay content of up to 5 wt%. However, the mechanical tensile properties of the PVA/Lyocell (w/w=30/70) blended hybrid films were found to decrease linearly with increases in organoclay content from 1 to 5 wt%.