• Korean Journal of Metals and Materials
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• v.47 no.2
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• pp.129-137
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• 2009

Corrosion behaviors of TiN coated dental casting alloys have been researched by using various electrochemical methods. Three casting alloys (Alloy 1: 63Co-27Cr-5.5Mo, Alloy 2: 63Ni-16Cr-5Mo, Alloy 3: 63Co-30Cr-5Mo) were prepared for fabricating partial denture frameworks with various casting methods; centrifugal casting(CF), high frequency induction casting(HFI) and vacuum pressure casting(VP). The specimens were coated with TiN film by RF-magnetron sputtering method. The corrosion behaviors were investigated using potentiostat (EG&G Co, 263A. USA) in 0.9% NaCl solution at $36.5{\pm}1^{\circ}C$. The corrosion morphologies were analyzed using FE-SEM and EDX. Alloy 1 and Alloy 2 showed the ${\alpha}-Co$ and ${\varepsilon}-Co$ phase on the matrix, and it was disappeared in case of TiN coated Alloy 1 and 2. In the Alloy 3, $Ni_2Cr$ second phases were appeared at matrix. Corrosion potentials of TiN coated alloy were higher than that of non-coated alloy, but current density at passive region of TiN coated alloy was lower than that of non-coated alloy. Pitting corrosion resistances were increased in the order of centrifugal casting, high frequency induction casting and vacuum pressure casting method from cyclic potentiodynamic polarization test.

• Korean Journal of Metals and Materials
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• v.46 no.11
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• pp.762-769
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• 2008

Hydrogenated amorphous silicon(a-Si : H) layers, 120 nm and 50 nm in thickness, were deposited on 200 $nm-SiO_2$/single-Si substrates by inductively coupled plasma chemical vapor deposition(ICP-CVD). Subsequently, 30 nm-Ni layers were deposited by E-beam evaporation. Finally, 30 nm-Ni/120 nm a-Si : H/200 $nm-SiO_2$/single-Si and 30 nm-Ni/50 nm a-Si:H/200 $nm-SiO_2$/single-Si were prepared. The prepared samples were annealed by rapid thermal annealing(RTA) from $200^{\circ}C$ to $500^{\circ}C$ in $50^{\circ}C$ increments for 30 minute. A four-point tester, high resolution X-ray diffraction(HRXRD), field emission scanning electron microscopy (FE-SEM), transmission electron microscopy (TEM), and scanning probe microscopy(SPM) were used to examine the sheet resistance, phase transformation, in-plane microstructure, cross-sectional microstructure, and surface roughness, respectively. The nickel silicide on the 120 nm a-Si:H substrate showed high sheet resistance($470{\Omega}/{\Box}$) at T(temperature) < $450^{\circ}C$ and low sheet resistance ($70{\Omega}/{\Box}$) at T > $450^{\circ}C$. The high and low resistive regions contained ${\zeta}-Ni_2Si$ and NiSi, respectively. In case of microstructure showed mixed phase of nickel silicide and a-Si:H on the residual a-Si:H layer at T < $450^{\circ}C$ but no mixed phase and a residual a-Si:H layer at T > $450^{\circ}C$. The surface roughness matched the phase transformation according to the silicidation temperature. The nickel silicide on the 50 nm a-Si:H substrate had high sheet resistance(${\sim}1k{\Omega}/{\Box}$) at T < $400^{\circ}C$ and low sheet resistance ($100{\Omega}/{\Box}$) at T > $400^{\circ}C$. This was attributed to the formation of ${\delta}-Ni_2Si$ at T > $400^{\circ}C$ regardless of the siliciation temperature. An examination of the microstructure showed a region of nickel silicide at T < $400^{\circ}C$ that consisted of a mixed phase of nickel silicide and a-Si:H without a residual a-Si:H layer. The region at T > $400^{\circ}C$ showed crystalline nickel silicide without a mixed phase. The surface roughness remained constant regardless of the silicidation temperature. Our results suggest that a 50 nm a-Si:H nickel silicide layer is advantageous of the active layer of a thin film transistor(TFT) when applying a nano-thick layer with a constant sheet resistance, surface roughness, and ${\delta}-Ni_2Si$ temperatures > $400^{\circ}C$.

• Korean Journal of Metals and Materials
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• v.47 no.5
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• pp.322-329
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• 2009

60 nm- and 20 nm-thick hydrogenated amorphous silicon (a-Si:H) layers were deposited on 200 nm $SiO_2/Si$ substrates using ICP-CVD (inductively coupled plasma chemical vapor deposition). A 10 nm-Ni layer was then deposited by e-beam evaporation. Finally, 10 nm-Ni/60 nm a-Si:H/200 nm-$SiO_2/Si$ and 10 nm-Ni/20 nm a-Si:H/200 nm-$SiO_2/Si$ structures were prepared. The samples were annealed by rapid thermal annealing for 40 seconds at $200{\sim}500^{\circ}C$ to produce $NiSi_x$. The resulting changes in sheet resistance, microstructure, phase, chemical composition and surface roughness were examined. The nickel silicide on a 60 nm a-Si:H substrate showed a low sheet resistance at T (temperatures) >$450^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate showed a low sheet resistance at T > $300^{\circ}C$. HRXRD analysis revealed a phase transformation of the nickel silicide on a 60 nm a-Si:H substrate (${\delta}-Ni_2Si{\rightarrow}{\zeta}-Ni_2Si{\rightarrow}(NiSi+{\zeta}-Ni_2Si)$) at annealing temperatures of $300^{\circ}C{\rightarrow}400^{\circ}C{\rightarrow}500^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate had a composition of ${\delta}-Ni_2Si$ with no secondary phases. Through FE-SEM and TEM analysis, the nickel silicide layer on the 60 nm a-Si:H substrate showed a 60 nm-thick silicide layer with a columnar shape, which contained both residual a-Si:H and $Ni_2Si$ layers, regardless of annealing temperatures. The nickel silicide on the 20 nm a-Si:H substrate had a uniform thickness of 40 nm with a columnar shape and no residual silicon. SPM analysis shows that the surface roughness was < 1.8 nm regardless of the a-Si:H-thickness. It was confirmed that the low temperature silicide process using a 20 nm a-Si:H substrate is more suitable for thin film transistor (TFT) active layer applications.

• Journal of Environmental Health Sciences
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• v.47 no.6
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• pp.540-547
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• 2021

Background: Indoor air pollutants are caused by a number of factors, such as coming in from the outside or being generated by internal activities. Typical indoor air pollutants include nitrogen dioxide and carbon monoxide from household items such as heating appliances and volatile organic compounds from building materials. In addition there is carbon dioxide from human breathing and bacteria from speaking, coughing, and sneezing. Objectives: According to recent research results, most indoor air pollution is known to be greatly affected by internal factors such as burning (biomass for cooking) and various pollutants. These pollutants can have a fatal effect on the human body due to a lack of ventilation facilities. Methods: We fabricated a polydopamine (PDA) layer with Ti substrates as a coating on supported glass fiber fabric to enhance its photo-activity. The PDA layer with TiO₂ was covalently attached to glass fiber fabric using the drop-casting method. The roughness and functional groups of the surface of the Ti substrate/PDA coated glass fiber fabric were verified through infrared imaging microscopy and field emission scanning electron microscopy (FE-SEM). The obtained hybrid Ti substrate/PDA coated glass fiber fabric was investigated for photocatalytic activity by the removal of ammonia and an epidermal Staphylococcus aureus reduction test with lamp (250 nm, 405 nm wavelength) at 24℃. Results: Antibacterial properties were found to reduce epidermal staphylococcus aureus in the Ti substrate/PDA coated glass fiber fabric under 405 nm after three hours. In addition, the Ti substrate/PDA coated glass fiber fabric of VOC reduction rate for ammonia was 50% under 405 nm after 30 min. Conclusions: An electron-hole pair due to photoexcitation is generated in the PDA layer and transferred to the conduction band of TiO₂. This generates a superoxide radical that degrades ammonia and removes epidermal Staphylococcus aureus.

• Journal of Conservation Science
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• v.38 no.2
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• pp.124-132
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• 2022

Through scientific analysis, this study identified the material characteristics of metal foil decorating the border line and knotting of the National Folklore Cultural Heritage 'Pouch for the Sutra Embroidered with a Sun and Moon Design'. Through Scanning Electron Microscope-Energy Dispersive Spectroscopy results, it was estimated that silver (Ag) and sulfur (S) were present in the metal foil, and silver leaf was also attached to the medium. S may discolor Ag from yellow to black depending on its concsentration and contact time. Yellow color could not be identified in metal foil at present. But there existed an example of the preparation of a gold-colored flat silver thread; therefore, further research is needed to estimate the original color. The lamella was reddish brown on the back. Aluminum, silicon, and iron were also detected and were the main components found in red soil. This is believed to be the red adhesive in traditional flat gold thread and is considered to be an adhesive-related component of the metal foil. From the gas chromatography mass spectrometry results, the adhesive component was confirmed to be animal glue.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.33 no.4
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• pp.153-157
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• 2023

In order to manufacture a semiconductor circuit, etching, cleaning, and deposition processes are repeated. During these processes, the inside of the processing chamber is exposed to corrosive plasma. Therefore, the coating of the inner wall of the semiconductor equipment with a plasma-resistant material has been attempted to minimize the etching of the coating and particle contaminant generation. In this study, we mixed AlF₃ powder with the solid-state reacted yttrium oxyfluoride (YOF) in order to increase plasma-etching resistance of the plasma spray coated YOF layer. Effects of the mixing ratio of AlF₃ with YOF powder on crystal structure, microstructure and chemical composition were investigated using XRD and FE-SEM. The plasma-etching ratios of the plasma-spray coated layers were calculated and correlation with AlF₃ mixing ratio was analyzed.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.1
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• pp.51-57
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• 2023

Because of the global pollution caused by plastic disposal, demand for eco-friendly transformation in the packaging industry is increased. As part of that, the utilization of polylactic acid (PLA) as a food packaging material is increased. However, it is necessary to improve the crystallinity of PLA by adding nucleating agents or to improve the modulus by adding fillers because of the excessive brittleness of the PLA matrix. Thus, the cellulose nanofiber (CNF) was fabricated and dried to obtain a powder form and applied to the CNF/PLA nanocomposite. The effect of CNF on the morphological, thermal, rheological, and dynamic mechanical properties of the composite was analyzed. We can confirm the impregnated CNF particle in the PLA matrix through the field emission scanning electron microscope (FE-SEM). Differential scanning calorimetry (DSC) analysis showed that the crystallinity of not annealed CNF/PLA nanocomposite was increased approximately 2 and 4 times in the 1st and 2nd cycle, respectively, with the shift to lower temperature of cold crystallization temperature (T_cc) in the 2nd cycle. Moreover, the crystallinity of annealed CNF/PLA nanocomposite increased by 13.4%, and shifted T_cc was confirmed.

• Korean Chemical Engineering Research
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• v.61 no.3
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• pp.419-425
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• 2023

This paper presents the research results of analyzing the high-temperature corrosion characteristics of three currently commercialized heat exchanger tube materials under actual operating conditions of a biomass power plant. In order to precisely analyze the high-temperature corrosion characteristics of these materials, a high-temperature corrosion evaluation device was installed in the power plant equipment, which allows for adjusting the surface temperature of the heat exchanger tubes. Experiments were conducted for approximately 300 hours under various temperature and operating conditions. In this study, the commercialized heat exchanger tube materials used were SA213T12, SA213T22, and SA213T91 alloys. In order to objectively analyze the high-temperature corrosion characteristics of each material, an international standard-based process to remove corrosion products was applied to obtain the weight change of the specimens, and the average thickness loss and corrosion rate were derived. Thus, the high-temperature corrosion results for each condition were quantitatively compared and analyzed. In addition, in order to increase the reliability of the high-temperature corrosion evaluation method introduced in this study, the surface and cross-sectional corrosion of the specimens were confirmed by using scanning electron microscopy and energy-dispersive X-ray analysis. Based on these analysis results, it was found that the corrosion resistance of the commercial heat exchanger materials increases as the content of chrome and nickel in the composition increases. Additionally, it was found that the corrosion phenomenon is rapidly accelerated as the surface temperature increases. Finally, the replacement period (lifetime) of the heat exchanger tubes under each condition could be inferred through this study.

• Journal of the Korea Organic Resources Recycling Association
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• v.32 no.1
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• pp.31-38
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• 2024

In this study, vinyl waste, which is the cause of environmental pollution, is recycled via an electrospinning method and applied as a separator that can be employed for energy storage devices. In detail, vinyl wastes are dissolved in a solution containing p-xylene and cyclohexanone, followed by electrospinning to obtain a vinyl waste-derived separator(VWS), and then the hydrophilic functional groups on the surface of VWS are introduced using a plasma treatment to improve wettability. Scanning electron microscopy analysis have verified that the shape and thickness of as-spun VWS vary depending on the concentration of vinyl waste. The surface hydrophility of VWS is modified by plasma treatment with applied powers ranging from 80 to 120W. The lowest contact angle is observed when the 100W power is applied to VWS(VWS-100W). In electrochemical analysis, the VWS-100W-based supercapacitor device shows the highest specific capacitance of 57.9 F g^-1. This is ascribed to the high porosity achieved by electrospinning as well as the introduction of hydrophilic functional groups by the oxygen plasma treatment. In conclusion, vinyl waste is successfully recycled into separators for energy storage devices, suggesting a new way to reduce environmental pollution.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.1-7
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• 2017

Cobalt silicide was used as a counter electrode in order to confirm its reliability in dye-sensitized solar cell (DSSC) devices. 100 nm-Co/300 nm-Si/quartz was formed by an evaporator and cobalt silicide was formed by vacuum heat treatment at $700^{\circ}C$ for 60 min to form approximately 350 nm-CoSi. This process was followed by etching in $80^{\circ}C$-30% $H_2SO_4$ to remove the cobalt residue on the cobalt silicide surface. Also, for the comparison against Pt, we prepared a 100 nm-Pt/glass counter electrode. Cobalt silicide was used for the counter electrode in order to confirm its reliability in DSSC devices and maintained for 0, 168, 336, 504, 672, and 840 hours at $80^{\circ}C$. The photovoltaic properties of the DSSCs employing cobalt silicide were confirmed by using a simulator and potentiostat. Cyclic-voltammetry, field emission scanning electron microscopy, focused ion beam scanning electron microscopy, and energy dispersive spectrometry analyses were used to confirm the catalytic activity, microstructure, and composition, respectively. The energy conversion efficiency (ECE) as a function of time and ECE of the DSSC with Pt and CoSi counter electrodes were maintained for 504 hours. However, after 672 hours, the ECEs decreased to a half of their initial values. The results of the catalytic activity analysis showed that the catalytic activities of the Pt and CoSi counter electrodes decreased to 64% and 57% of their initial values, respectively(after 840 hours). The microstructure analysis showed that the CoSi layer improved the durability in the electrolyte, but because the stress concentrates on the contact surface between the lower quartz substrate and the CoSi layer, cracks are formed locally and flaking occurs. Thus, deterioration occurs due to the residual stress built up during the silicidation of the CoSi counter electrode, so it is necessary to take measures against these residual stresses, in order to ensure the reliability of the electrode.