• Journal of the Korean Crystal Growth and Crystal Technology
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• v.19 no.6
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• pp.288-292
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• 2009

Hydrophobic/hydrophilic patterned substrates were fabricated on a glass substrate by a liquid phase deposition (LPD) method. Hydrophobic surface was obtained by modifying ZnO thin films with a rough surface using a fluoroalkyltrimethoxysilane (FAS) and hydrophilic surface was prepared by decomposing FAS on an exposed to UV light. The hexagonal ZnO rods were perpendicularly grown by LPD method on glass substrates with a ZnO seed layer. The diameter and thickness of hexagonal ZnO rods were increased as a function of increases of immersion time. The surface morphology, thickness, crystal structure, transmittance and contact angle of prepared ZnO thin films were measured by field emission scanning electron microscopy (FE-SEM), X-ray diffraction (XRD), UV-visible spectrophotometer (UV-vis) and contact angle measurement. Hydrophilic ZnO thin films with a contact angle of $20^{\circ}{\sim}30^{\circ}$ were changed to a hydrophobic surface with a contact angle of $145^{\circ}{\sim}161^{\circ}$ by a FAS surface treatment. Prepared hydrophobic surface was pattered by an irradiation of UV light using shadow mask with $300\;{\mu}m$ or 3 mm dot size. Finally, the hydrophobic surface exposed to UV light was changed to a hydrophilic surface.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.6
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• pp.254-261
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• 2010

Polycrystalline silicon (pc-Si) films are fabricated and characterized for application to pc-Si thin film solar cells as a seed layer. The amorphous silicon films are crystallized by the aluminum-induced layer exchange (ALILE) process with a structure of glass/Al/$Al_2O_3$/a-Si using various thicknesses of $Al_2O_3$ layers. In order to investigate the effects of the oxide layer on the crystallization of the amorphous silicon films, such as the crystalline film detects and the crystal grain size, the $Al_2O_3$ layer thickness arc varied from native oxide to 50 nm. As the results, the defects of the poly crystalline films are increased with the increase of $Al_2O_3$ layer thickness, whereas the grain size and crystallinity are decreased. In this experiments, obtained the average pc-Si sub-grain size was about $10\;{\mu}m$ at relatively thin $Al_2O_3$ layer thickness (${\leq}$ 16 nm). The preferential orientation of pc-Si sub-grain was <111>.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.1C
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• pp.102-110
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• 2004

In this paper, we propose a VLSI structure of real-time image compression and reconstruction processor using 2-D discrete wavelet transform and implement into a hardware which use minimal hardware resource using ASIC library. In the implemented hardware, Data path part consists of the DWT kernel for the wavelet transform and inverse transform, quantizer/dequantizer, the huffman encoder/huffman decoder, the adder/buffer for the inverse wavelet transform, and the interface modules for input/output. Control part consists of the programming register, the controller which decodes the instructions and generates the control signals, and the status register for indicating the internal state into the external of circuit. According to the programming condition, the designed circuit has the various selective output formats which are wavelet coefficient, quantization coefficient or index, and Huffman code in image compression mode, and Huffman decoding result, reconstructed quantization coefficient, and reconstructed wavelet coefficient in image reconstructed mode. The programming register has 16 stages and one instruction can be used for a horizontal(or vertical) filtering in a level. Since each register automatically operated in the right order, 4-level discrete wavelet transform can be executed by a programming. We synthesized the designed circuit with synthesis library of Hynix 0.35um CMOS fabrication using the synthesis tool, Synopsys and extracted the gate-level netlist. From the netlist, timing information was extracted using Vela tool. We executed the timing simulation with the extracted netlist and timing information using NC-Verilog tool. Also PNR and layout process was executed using Apollo tool. The Implemented hardware has about 50,000 gate sizes and stably operates in 80MHz clock frequency.

• Journal of the Korean Ceramic Society
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• v.34 no.2
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• pp.115-122
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• 1997

The powder preparation by using emulsion drying method, one of the chemical powder fabrication methods has the advantages; easy to control the chemical stoichiometry and to fabricate homogeneously fine particles. In the present study, the initial morphology and size distribution of the powder fabricated by using emulsion dry-ing method were controlled and were improved the homogeneity. By carefully controlling the mixing ratio of oil phase and aqueous solution and surfactant of preventing emulsion separation, the Bi(Pb)-Sr-Ca-Cu-O su-perconducting powders were prepared. The properties of the superconducting powder fabricated by this method and the microstructures and superconducting properties of the pelletized samples were investigated. The microstructures and electric properties of the tapes prepared by oxide powder-in-tube method were in-vestigated. The fabricated powder was spherical with less than 1$\mu$m but most of them was agglomerated with 2~5$\mu$m in size. The critical temperature of the pelletized sample annealed at 84$0^{\circ}C$ for 72 hours in oxygen par-tial pressure of 1/13atm in Ar atmosphere was 108K. And the critical current of the first and second annealed tapes in air prepared by oxide powder-in-tube process were 0.4A and 1.5A, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.197-205
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• 2005

Development of the packaging is one of the critical issues for commercialization of the RF-MEMS devices. RF MEMS package should be designed to have small size, hermetic protection, good RF performance and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at the temperature below $300{\times}C$ is used. Au-Sn multilayer metallization with a square loop of $70{\mu}m$ in width is performed. The electrical feed-through is achieved by the vertical through-hole via filled with electroplated Cu. The size of the MEMS Package is $1mm\times1mm\times700{\mu}m$. By applying $O_2$ plasma ashing and fabrication process optimization, we can achieve the void-free structure within the bonding interface as well as via hole. The shear strength and hermeticity of the package satisfy the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.17-21
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• 2007

Dense and periodic arrays of holes and Si nano dots were fabricated on silicon substrate. The nanopatterned holes were approximately $15{\sim}40nm$ wide, 40 nm deep and $40{\sim}80\;nm$ apart. To obtain nano-size patterns, self?assembling diblock copolymer were used to produce layer of hexagonaly ordered parallel cylinders of polymethylmethacrylate (PMMA) in polystyrene(PS) matrix. The PMMA cylinders were degraded and removed with acetic acid rinse to produce a PS. $100\;{\AA}-thick$ Au thin film was deposited by using e-beam evaporator. PS template was removed by lift-off process. Arrays of Au nano dots were transferred by using Fluorine-based reactive ion etching(RE). Au nano dots were removed by sulfuric acid. Si nano dots size and height were $30{\sim}70\;nm$ and $10{\sim}20\;nm$ respectively.

• The Journal of Korean Academy of Prosthodontics
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• v.52 no.3
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• pp.246-251
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• 2014

In case of prosthesis fabrication by CAD/CAM, location, area and contour of occlusal contacts can be adjusted so more functional occlusion can be acquired. Also, errors in a manufacturing process is reduced compared to cast metal prostheses and porcelain fused metal prostheses fabricated by conventional methods such as casting and porcelain build up. Therefore, prostheses by CAD/CAM show superior occlusion accuracy. Recently, virtual articulator function has been introduced to CAD/CAM system, which reproduces mandibular movement against maxilla. Thus, it is possible to consider occlusal interference in anterior/lateral movement as well as closing movement. There have been many studies on the marginal and internal fit of prostheses using zirconia but the occlusal fit of zirconia crown fabricated by CAD/CAM has not been researched as much. In this case report, 7 zirconia crowns were designed and fabricated by CAD/CAM for total 5 patients. The models of zirconia crowns before and after occlusal adjustment during intraoral try-in were scanned for occlusal contacts, which were compared to evaluate accuracy of prostheses and understand patterns of occlusal adjustment. Most of the occlusal adjustments were done on functional cusps and slopes of zirconia crown, and the magnitude of occlusal adjustment ranged from $15{\mu}m$ to $60{\mu}m$. In the zirconia crown fabricated with CAD/CAM systems, the occlusal adjustment is a necessary procedure, so additional procedures will be needed for compensating reduced mechanical properties.

• Journal of the Korean Electrochemical Society
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• v.5 no.3
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• pp.125-130
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• 2002

An attempt was made for the application of porous reticular metal to a heat dissipation material in semiconductor process. For this aim, the electrodeposition of Fe/Ni alloy on the porous reticular Cu has been performed to minimize the thermal expansion mismatch between Cu skeleton and electronic chip. Preliminary tests for the electrodeposition of Fe/Ni alloy layer were conducted by using standard Hull Cell to examine the effect of current density on the composition of alloy layer. It seemed that mass transfer affected significantly the composition of Fe/Ni layer due to anomalous codeposition in the electrodeposition of Fe/Ni alloy. A paddle type stirring bath, which was employed to control the mass transfer of electrolyte in the work, was found to allow the electrodeposition Fe/Ni with a precise composition. result showed that the thermal expansion of Fe/Ni alloy layer was much lower than that of pure copper. From the tests of heat dissipation by using the apparatus designed in the work the heat dissipation material fabricated in the work showed the excellent heat dissipation capacity, namely, more than two times as compared to that of pure copper plate.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.51-56
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• 2017

In this paper, we have developed a differential pressure flow sensor designed as a single capacitive type. And the sensor was fabricated using a MEMS process. Differential pressure flow sensors are the most commonly used sensors for industrial applications. The sensing diaphragm and bonding joint of the MEMS pressure sensor are easily broken at high pressure. In this paper, we proposed a structure in which the diaphragm of the sensor was not broken at a pressure exceeding the proof pressure, and the differential pressure sensor was designed and manufactured accordingly. The operating characteristics of the sensor were evaluated at a pressure three times higher than the sensor operating pressure (0-3 bar). The developed sensor was $3.0{\times}3.0mm$ and measured with a LCR meter (HP 4284a) at a pressure between 0 and 3 bar. It showed 3.67 pF at 0 bar and 5.13 pF at 3 bar. The sensor operating pressure (0-3 bar) developed a pressure sensor with hysteresis of 0.37%.

• Journal of the Korean Magnetics Society
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• v.15 no.3
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• pp.191-197
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• 2005

In the fabrication process of Fe-based amorphous alloy powder cores by pulverization of the melt-spun ribbons and cold compaction, the effects of powder preparation method on the magnetic & electric properties, powder shapes and microstructure of cores have been investigated. The powder cores made by using rotor mill showed low effective permeability as compared to the cores prepared by ball milling. However the frequency dependence and quality factor properties were superior in the case of rotor-milling. Further the powders prepared by rotor mill had homogeneous and round shapes through strong shearing in the sieve ring, while the ball milled powders were inhomogeneous and relatively small. The lower permeability of the powder cores fabricated with rotor mill was considered to be due to the high internal stress occurred by very intensive shearing. Moreover the powder cores produced by rotor-milling showed lower core loss and good frequency dependence of effective permeability possibly due to the higher electrical insulation between magnetic particles. The dc bias property of the powder cores made by rotor-milling was better than the one by ball-milling.