• Title/Summary/Keyword: Fabrication process

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FIB milling을 이용한 고정밀 다이아몬드공구 제작과 공정에 관한 연구 (A study on the fabrication and processing of ultra-precision diamond tools using FIB milling)

  • 위은찬;정성택;김현정;송기형;최영재;이주형;백승엽
    • Design & Manufacturing
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    • 제14권2호
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    • pp.56-61
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    • 2020
  • Recently, research for machining next-generation micro semiconductor processes and micro patterns has been actively conducted. In particular, it is applied to various industrial fields depending on the machining method in the case of FIB (Focused ion beam) milling. In this study, intends to deal with FIB milling machining technology for ultra-precision diamond tool fabrication technology. Ultra-precision diamond tools require nano-scale precision, and FIB milling is a useful method for nano-scale precision machining. However, FIB milling has a problem of Gaussian characteristics that are differently formed according to the beam current due to the input of an ion beam source, and there are process conditions to be considered, such as a side clearance angle problem of a diamond tool that is differently formed according to the tilting angle. A series of process steps for fabrication a ultra-precision diamond tool were studied and analyzed for each process. It was confirmed that the effect on the fabrication process was large depending on the spot size of the beam and the current of the beam as a result of the experimental analysis.

반구형 나노 패턴의 크기에 따른 PMMA기판의 광특성 평가 (Fabrication of nano-structured PMMA substrates for the improvement of the optical transmittance)

  • 박용민;신홍규;김병희;서영호
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2009년도 추계학술대회 논문집
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    • pp.217-220
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    • 2009
  • This paper presents fabrication method of nano-structured PMMA substrates as well as evaluations of their optical transmittance. For anti-reflective surface, surface coating method had been conventionally used. However, it requires high cost, complicated process and post-processing times. In this study, we suggested the fabrication method of anti-reflective surface by the hot embossing process. Using the nano patterned master fabricated by anodic aluminum oxidation process. Anodic aluminum oxide(AAO) is widely used as templates or a molds for various applications such as carbon nano tube (CNT), nano rod and nano dots. Anodic aluminum oxidation process provides highly ordered regular nano-structures on the large area, while conventional pattering methods such as E-beam and FIB can fabricate arbitrary nano-structures on small area. We fabricated a porous alumina hole array with various inter-pore distance and pore diameter. In order to replicate nano-structures using alumina nano hole array patterns, we have carried out hot-embossing process with PMMA substrates. Finally the nano-structured PMMA substrates were fabricated and their optical transmittances were measured in order to evaluate the charateristivs of anti-reflection. Anti-reflective structure can be applied to various displays and automobile components.

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UV 임프린팅 공정을 이용한 금속막 필터제작 (Fabrication of Metallic Nano-Filter Using UV-Imprinting Process)

  • 노철용;이남석;임지석;김석민;강신일
    • 소성∙가공
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    • 제14권5호
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    • pp.473-476
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    • 2005
  • The demand of on-chip total analyzing system with MEMS (micro electro mechanical system) bio/chemical sensor is rapidly increasing. In on-chip total analyzing system, to detect the bio/chemical products with submicron feature size, a filtration system with nano-filter is required. One of the conventional methods to fabricate nano-filter is to use direct patterning or RIE (reactive ion etching). However, those procedures are very costly and are not suitable fur mass production. In this study, we suggested new fabrication method for a nano-filter based on replication process, which is simple and low cost process. After the Si master was fabricated by laser interference lithography and reactive ion etching process, the polymeric mold was replicated by UV-imprint process. Metallic nano-filter was fabricated after removing the polymeric part of metal deposited polymeric mold. Finally, our fabrication method was applied to metallic nano-filter with $1{\mu}m$ pitch size and $0.4{\mu}m$ hole size for bacteria sensor application.

HEMT 소자 제작을 위한 GaAs/AlGaAs층의 선택적 건식식각 (Selective Dry Etching of GaAs/AlGaAs Layer for HEMT Device Fabrication)

  • 김흥락;서영석;양성주;박성호;김범만;강봉구;우종천
    • 전자공학회논문지A
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    • 제28A권11호
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    • pp.902-909
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    • 1991
  • A reproducible selective dry etch process of GaAs/AlGaAs Heterostructures for High Electron Mobility Transistor(HEMT) Device fabrication is developed. Using RIE mode with $CCl_{2}F_{2}$ as the basic process gas, the observed etch selectivity of GaAs layer with respect to GaAs/$Al_{0.3}Ga_{0.7}$As is about 610:1. Severe polymer deposition problem, parialy generated from the use of $CCl_{2}F_{2}$ gas only, has been significantly reduced by adding a small amount of He gas or by $O_{2}$ plasma ashing after etch process. In order to obtain an optimized etch process for HEMT device fabrication, we com pared the properties of the wet etched Schottky contact with those of the dry etched one, and set dry etch condition to approach the characteristics of Schottky diode on wet etched surface. By applying the optimized etch process, the fabricated HEMT devices have the maximum transconductance $g_{mext}$ of 224 mS/mm, and have relatively uniform distribution across the 2inch wafer in the value of 200$\pm$20mS/mm.

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CIM을 이용한 PZT 프리폼의 제조공정에 대한 유한요소해석 (FEA for Fabrication Process of PZT Preform Using CIM)

  • 신호용;김종호;장종수;백승민;임종인
    • 한국세라믹학회지
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    • 제46권6호
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    • pp.700-707
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    • 2009
  • This paper described finite element analysis (FEA) for fabrication processes of PZT perform using ceramic injection molding (CIM). The viscosity and the PVT characteristics of the manufactured PZT feedstock were measured. The filling patterns, pressure and temperature distributions of the preform were analyzed with TIMON 3D packages during CIM process. The geometrical variables such as gate type, location, and base thickness of the preform were considered. Also the fabrication conditions of the preform were optimized during the entire CIM process. Based on the simulated results, the various good perform was easily fabricated with the CIM process.

수산화알루미늄으로부터 수열법을 이용한 활성 알루미나 제조에 관한 연구 (Fabrication of Activated Alumina Using Aluminum Hydroxide by a Hydrothermal Process)

  • 배현철;이상진
    • 한국세라믹학회지
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    • 제50권6호
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    • pp.384-389
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    • 2013
  • Activated alumina was fabricated with aluminum hydroxide in this study. High-purity alumina gel and boehmite were prepared from aluminum hydroxide by a hydrothermal process and fired to activate alumina having a surface area of 380 ~ 480 $m^2/g$ with less loss of ignition. The aging and drying condition during the fabrication process affected the loss of ignition, the sedimentation time of the alumina suspension, as well as the surface area of the activated alumina. For pellet-type activated alumina, the pre-fired alumina gel and boehmite were press-formed and fired at $400^{\circ}C$ and $550^{\circ}C$ for 6 h, respectively. The fired pellets showed a low density of 2.0 ~ 2.2 $g/cm^3$ with 20% firing shrinkage and sufficient handling strength. In this study, a new fabrication process for high-quality activated alumina with aluminum hydroxide is introduced. The effects of the processing parameters on the activated alumina properties are also examined.

Micro-Pressing 방법과 Dicing 방법에 의해 제조된 PZT Ultrasonic Transducer Array의 특성 (Properties of PZT Ultrasonic Transducer Array Fabricated by Micro-Pressing and Dicing method)

  • 박준식;홍성제;조진우;박순섭;한진호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2000년도 하계학술대회 논문집 C
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    • pp.2248-2250
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    • 2000
  • We investigated properties of PZT composite for medical ultrasonic transducer array (briefly UTA) for medicine applications fabricated by micro pressing and dicing method. Dicing method was the fabrication process of conventional ultrasonic transducer array by dicing sintered PZT sheet. Micro pressing method was the proposed process using pressing PZT green sheet by PMMA micro mold from LIGA process. Microstructures, electrical and electro -mechanical properties of fabricated UTAs of two cases were analyzed. Thickness mode electro-mechanical coupling coefficient of two cases have same values of 51%. Sintered PZT Microstructures of them showed dense and uniform. Micro pressing method was very mass productive process because of using batch type LIGA process. From results, we found micro pressing method was more competitive than dicing method for UTA fabrication. For further study, uniformity of microstructures and electro-mechanical properties of large scale, and fabrication processes of Ni plating and PMMA molding should be improved and investigated.

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소형공작기계를 이용한 광커넥터용 V 홈 가공에 관한 연구 (A Study on Machining of A V-groove on the Optical Fiber Connector Using a Miniaturized Machine Tool)

  • 이재하;박성령;양승한;이영문
    • 한국정밀공학회지
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    • 제21권5호
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    • pp.38-45
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    • 2004
  • As optical communication is being substituted for telecommunication, the demand of a large variety of fiber optic components is increasing. V-groove substrates, one of the module components, are used to connect optical fibers to optical planar circuits and to arrange fibers. Their applications are multi-channel optical connectors and optical waveguide fiber coupling, etc. Because these substrates are a critical part of the splitter in a multiplexer and a multi fiber connector, precise and reliable fabrication process is required. For precisely aligning core pitch between fibers, machined core pitch tolerance should be within sub-microns. Therefore, these are generally produced by state-of-the-art micro-fabrication like MEMS. However, most of the process equipment is very expensive. It is also difficult to change the process line for custom designs to meet specific requirements using various materials. For various design specifications such as different values of the V angle and low-priced process, the fabrication method should be flexible and low cost. To achieve this goal, we have suggested a miniaturized machine tool with high accuracy positioning system. Through this study, it is shown that this cutting process can be applied to produce V-groove subtracts. We also show the possibility of using a miniaturized machining system for producing small parts.

CMOS 표준 공정을 통한 SPM 프로브의 제작 및 그 성능 평가 (Fabrication of the FET-based SPM probe by CMOS standard process and its performance evaluation)

  • 이훈택;김준수;신금재;문원규
    • 센서학회지
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    • 제30권4호
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    • pp.236-242
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    • 2021
  • In this paper, we report the fabrication of the tip-on-gate of a field-effect-transistor (ToGoFET) probe using a standard complementary metal-oxide-semiconductor (CMOS) process and the performance evaluation of the fabricated probe. After the CMOS process, I-V characteristic measurement was performed on the reference MOSFET. We confirmed that the ToGoFET probe could be operated at a gate voltage of 0 V due to channel ion implantation. The transconductance at the operating point (Vg = 0 V, Vd = 2 V) was 360 ㎂/V. After the fabrication process was completed, calibration was performed using a pure metal sample. For sensitivity calibration, the relationship between the input voltage of the sample and the output current of the probe was determined and the result was consistent with the measurement result of the reference MOSFET. An oxide sample measurement was performed as an example of an application of the new ToGoFET probe. According to the measurement, the ToGoFET probe could spatially resolve a hundred nanometers with a height of a few nanometers in both the topographic image and the ToGoFET image.

PIM을 이용한 PZT 프리폼의 제조에 대한 연구 (Fabrication Studies for PZT Preform Using PIM)

  • 신호용;김종호;장종수;임종인
    • 한국음향학회지
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    • 제28권8호
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    • pp.796-805
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    • 2009
  • 본 논문에서는 분말사출성형공정 (PIM)을 이용하여 1-3형 압전복합체용 PZT 프리폼 (preform)의 제조에 대한 연구를 수행하였다. PZT 분말을 이용해 제조한 피드스탁 (feedstock)의 점도 및 PVT 특성을 측정하였다. 또한 상용 프로그램인 3D-Timon 프로그램을 이용하여 PIM 제조공정 중 사출 성형체의 충진패턴 온도, 압력분포 및 성형 결함 등을 분석하고, 금형 시스템 및 제조공정을 최적화하였다. 최적화된 PIM 제조공정 조건을 사용하여 PZT rod가 균일하게 분포된 1-3형 압전복합체용 PZT 프리폼을 제조할 수 있었다.