• 제목/요약/키워드: Fab layout

검색결과 6건 처리시간 0.018초

반도체 FAB 공정에서의 효율적 흐름제어를 위한 시뮬레이션 (Simulation of Efficient Flow Control for FAB of Semiconductor Manufacturing)

  • 한영신;전동훈
    • 한국멀티미디어학회논문지
    • /
    • 제3권4호
    • /
    • pp.407-415
    • /
    • 2000
  • 설비 집약적이며 복잡한 생산 시스템중의 하나인 반도체 FAB 공정은 제품의 흐름시간과 대기시간, 공정 중 재고를 줄이는 것이 흐름제어의 가장 중요한 목표이다. 이에 본 연구에서는 소품종 다랑 생산 시스템에서 발생하는 비경제성을 줄이고 생산성을 향상시키기 위하여 현재 반도체 양산 회사에서 주로 채택하고 있는 In-Line Layout을 분석하고 새로운 제안 방식인 그룹테크놀로지를 이용한 Job Shop 형태의 Stand Alone Layout과 함께 각각의 모델로 구축하고 시뮬레이션 함으로써 일별 생산 계획상의 회수 변화에 따른 각Layout의 특성을 비교, 분석하였다. 이 때 사용한 시뮬레이션 툴은 모델 구축 및 시뮬레이션이 용이하고 범용적인 (이산형 제조 시스템용) ProSys를 사용하였다. 연구 결과로는 일별 생산 계획상의 회수 초기에는 In-Line Layout이 Stand Alone Layout보다 대체로 생산량 측면에서 우세하지만 일별 생산계획상의 회수가 증가된 14회부터는 Stand Alone Layout이 더 우세한 것으로 나타났다

  • PDF

반도체 공정시스템 개선을 위한 레이아웃 비교 연구 (A Layout Comparison Study for Improving Semiconductor Fab System)

  • 서정대
    • 한국산학기술학회논문지
    • /
    • 제10권5호
    • /
    • pp.1074-1081
    • /
    • 2009
  • 반도체 공정시스템의 레이아웃은 대규모 자본 투자의 필요성과 제조 공정의 복잡성의 증가와 함께 그 중요성이 점점 증가하고 있다. 오늘날 대부분의 반도체 공정시스템은 같은 유형의 장비가 동일한 bay에 배치되는 bay 타입의 레이아웃 형태를 취하고 있다. Bay 타입 레이아웃은 유연성의 장점을 가지고 있지만 물류 흐름의 제어 측면에서는 많은 단점을 가지고 있다. 본 논문에서는 이러한 bay 타입 레이아웃의 단점을 보완하고자 bay 타입의 유연성은 유지하되 conter spine이 없고 bay를 통합한 형태의 새로운 반도체 레이아웃 개념인 room 타입에 대해서 비교, 연구한다. 이를 위하여 본 논문에서는 새로운 room 타입 레이아웃의 형태를 제시하고 이를 기존의 레이아웃과 반송필요 횟수와 시간, foot-print, 경유 stocker, 그리고 물류흐름 시간 등의 성과척도를 비교하여 room 타입 레이아웃의 우수성을 보인다.

인라인 EFEM 클러스터 장비 아키텍처의 모델링 및 분석 사례 연구 (A Case Study for Modeling and Simulation Analysis of the In-Line EFEM Cluster Tool Architecture)

  • 한용희
    • 한국시뮬레이션학회논문지
    • /
    • 제21권2호
    • /
    • pp.41-50
    • /
    • 2012
  • 본 연구에서는 반도체 제조공정 및 클러스터 장비에 대한 상세히 설명하고 현 팹 레이아웃 및 클러스터 장비 아키텍처상의 문제점을 제시하였다. 또한 현 아키텍처상의 대안으로서 클러스터 장비간의 웨이퍼 이동이 상호 연결된 인라인 EFEM(Equipment Front End Module) 을 통해 이루어지는 ILE (In-Line EFEM) 아키텍처의 개념을 제시하였다. 마지막으로 해당 아키텍처를 실제 적용하여 구현된 파일럿 시스템을 시뮬레이션 을 통해 사이클 타임 관점에서 비교 분석하였다.

Simulation of Efficient FlowControl for Photolithography Process Manufacturing of Semiconductor

  • Han, Young-Shin;Lee, Chilgee
    • 한국시뮬레이션학회:학술대회논문집
    • /
    • 한국시뮬레이션학회 2001년도 The Seoul International Simulation Conference
    • /
    • pp.269-273
    • /
    • 2001
  • Semiconductor wafer fabrication is a business of high capital investment and fast changing nature. To be competitive, the production in a fab needs to be effectively planned and scheduled starting from the ramping up phase, so that the business goals such as on-time delivery, high output volume and effective use of capital intensive equipment can be achieved. In this paper, we propose Stand Alone layout and In-Line layout are analyzed and compared while varying number of device variable changes. The comparison is performed through simulation using ProSys; a window 98 based discrete system simulation software, as a tool for comparing performance of two proposed layouts. The comparison demonstrates that when the number of device variable change is small, In-Line layout is more efficient in terms of production quantity. However, as the number of device variable change is more than 14 titles, Stand Alone layout prevails over In-Line layout.

  • PDF

효율적인 OLED FAB 경유 반송 개선 알고리즘 (An Efficient Algorithm for Improving Detour in OLED FAB)

  • 김동소;최진영
    • 산업경영시스템학회지
    • /
    • 제41권3호
    • /
    • pp.120-128
    • /
    • 2018
  • OLED Display fabrication system is one of the most complicated discrete processing systems in the world. As the glass size grows from $550{\times}650mm$ to $1,500{\times}1,850mm$ in recent years, the efficiency of Automated Material Handling System (AMHS) has become very important and OLED glass manufacturers are trying to improve the overall efficiency of AMHS. Aiming to meet the demand for high efficiency of transportation, various kind of approaches have been applied for improving dispatching rules and facility layout, while simultaneously considering the system parameters such as glass cassettes due date, waiting time, and stocker buffer status. However, these works did not suggest the operational policy and conditions of distribution systems, especially for handling unnecessary material flows such as detour. Based on this motivation, in this paper, we proposed an efficient algorithm for improving detour transportation in OLED FAB. Specifically, we considered an OLED FAB simplifying OLED production environment in a Korean company, where four stockers are constructed for the delivery of Lot in a bay and linked to processing equipments. We developed a simulation model using Automod and performed a numerical experiment using real operational data to test the performance of three operation policies under considerations. We showed that a competitive policy for assigning alternative stocker in case of detour was superior to the current dedicated policy using a specified stocker and other considered policies.

Hands-On Experience-Based Comprehensive Curriculum for Microelectronics Manufacturing Engineering Education

  • Ha, Taemin;Hong, Sang Jeen
    • Transactions on Electrical and Electronic Materials
    • /
    • 제17권5호
    • /
    • pp.280-288
    • /
    • 2016
  • Microelectronic product consumers may already be expecting another paradigm shift with smarter phones over smart phones, but the current status of microelectronic manufacturing engineering education (MMEE) in universities hardly makes up the pace for such a fast moving technology paradigm shift. The purpose of MMEE is to educate four-year university graduates to work in the microelectronics industry with up-to-date knowledge and self-motivation. In this paper, we present a comprehensive curriculum for a four-year university degree program in the area of microelectronics manufacturing. Three hands-on experienced-based courses are proposed, along with a methodology for undergraduate students to acquire hands-on experience, towards integrated circuits (ICs) design, fabrication and packaging, are presented in consideration of manufacturing engineering education. Semiconductor device and circuit design course for junior level is designed to cover how designed circuits progress to micro-fabrication by practicing full customization of the layout of digital circuits. Hands-on experienced-based semiconductor fabrication courses are composed to enhance students’ motivation to participate in self-motivated semiconductor fab activities by performing a series of collaborations. Finally, the Microelectronics Packaging course provides greater possibilities of mastered skillsets in the area of microelectronics manufacturing with the fabrication of printed circuit boards (PCBs) and board level assembly for microprocessor applications. The evaluation of the presented comprehensive curriculum was performed with a students’ survey. All the students responded with “Strongly Agree” or “Agree” for the manufacturing related courses. Through the development and application of the presented curriculum for the past six years, we are convinced that students’ confidence in obtaining their desired jobs or choosing higher degrees in the area of microelectronics manufacturing was increased. We confirmed that the hypothesis on the inclusion of handson experience-based courses for MMEE is beneficial to enhancing the motivation for learning.