• Journal of Korea Multimedia Society
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• v.3 no.4
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• pp.407-415
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• 2000

The ultimate goal of flow control in the semiconductor fabrication process, one of the most equipment-intensive and complex manufacturing process, is to reduce lead time and work in process. In this paper, we propose stand alone layout in the form of job shop using group technology to improve the Productivity and eliminate the inefficiency in FMS (flexible manufacture system). The performance of stand alone layout and in-line layout are analyzed and compared while varying number of device variable chanties. The analysis of in-line layout is obtained by examining its adoption in the memory products of semiconductor factory. The comparison is performed through simulation using ProSys; a window 95 based discrete system simulation software, as a tool for comparing performance of two proposed layouts. The comparison demonstrates that when the number of device variable change is small, in-line layout is more efficient in terms of production Quantity. However, as the number of device variable change is more than 14 times, stand alone layout prevails over in-line layout.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.5
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• pp.1074-1081
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• 2009

The importance of improving semiconductor fab layout has been increased with the necessity of a large-scale capital investment and the increase of manufacturing complexity of the system. For the present, most semiconductor fab takes the form of a bay type layout where the same types of machines has been laid at the same bay. The bay type layout has many disadvantages in respect of material flow control even though it has merits of flexibility. To overcome the drawbacks of the bay type layout, a new room type semiconductor layout which integrates bays without a center spine and maintains the flexibilities of the bay type has been presented and compared with existing layouts. The results of test show that the room type layout is superior to the existing layouts from standpoints of transportation number and time, foot-print, number of stocker being passed and material flow time.

• Journal of the Korea Society for Simulation
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• v.21 no.2
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• pp.41-50
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• 2012

In this study we first explain details of the semiconductor manufacturing processes and cluster tools. Then we discuss the problems in current fab layout and cluster tool architecture. As a solution to these problems, we propose the ILE (In-Line EFEM) architecture in which wafer movements are conducted through interconnected EFEMs (Equipment Front End Modules) instead of AMHS (Automated Material Handling System). Then we model the pilot ILE system using discrete event simulation and analyze the cycle time. Finally we compare three different scenarios of equipment layout in the ILE system in terms of cycle time.

• Proceedings of the Korea Society for Simulation Conference
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• 2001.10a
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• pp.269-273
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• 2001

Semiconductor wafer fabrication is a business of high capital investment and fast changing nature. To be competitive, the production in a fab needs to be effectively planned and scheduled starting from the ramping up phase, so that the business goals such as on-time delivery, high output volume and effective use of capital intensive equipment can be achieved. In this paper, we propose Stand Alone layout and In-Line layout are analyzed and compared while varying number of device variable changes. The comparison is performed through simulation using ProSys; a window 98 based discrete system simulation software, as a tool for comparing performance of two proposed layouts. The comparison demonstrates that when the number of device variable change is small, In-Line layout is more efficient in terms of production quantity. However, as the number of device variable change is more than 14 titles, Stand Alone layout prevails over In-Line layout.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.41 no.3
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• pp.120-128
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• 2018

OLED Display fabrication system is one of the most complicated discrete processing systems in the world. As the glass size grows from $550{\times}650mm$ to $1,500{\times}1,850mm$ in recent years, the efficiency of Automated Material Handling System (AMHS) has become very important and OLED glass manufacturers are trying to improve the overall efficiency of AMHS. Aiming to meet the demand for high efficiency of transportation, various kind of approaches have been applied for improving dispatching rules and facility layout, while simultaneously considering the system parameters such as glass cassettes due date, waiting time, and stocker buffer status. However, these works did not suggest the operational policy and conditions of distribution systems, especially for handling unnecessary material flows such as detour. Based on this motivation, in this paper, we proposed an efficient algorithm for improving detour transportation in OLED FAB. Specifically, we considered an OLED FAB simplifying OLED production environment in a Korean company, where four stockers are constructed for the delivery of Lot in a bay and linked to processing equipments. We developed a simulation model using Automod and performed a numerical experiment using real operational data to test the performance of three operation policies under considerations. We showed that a competitive policy for assigning alternative stocker in case of detour was superior to the current dedicated policy using a specified stocker and other considered policies.

• Transactions on Electrical and Electronic Materials
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• v.17 no.5
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• pp.280-288
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• 2016

Microelectronic product consumers may already be expecting another paradigm shift with smarter phones over smart phones, but the current status of microelectronic manufacturing engineering education (MMEE) in universities hardly makes up the pace for such a fast moving technology paradigm shift. The purpose of MMEE is to educate four-year university graduates to work in the microelectronics industry with up-to-date knowledge and self-motivation. In this paper, we present a comprehensive curriculum for a four-year university degree program in the area of microelectronics manufacturing. Three hands-on experienced-based courses are proposed, along with a methodology for undergraduate students to acquire hands-on experience, towards integrated circuits (ICs) design, fabrication and packaging, are presented in consideration of manufacturing engineering education. Semiconductor device and circuit design course for junior level is designed to cover how designed circuits progress to micro-fabrication by practicing full customization of the layout of digital circuits. Hands-on experienced-based semiconductor fabrication courses are composed to enhance students’ motivation to participate in self-motivated semiconductor fab activities by performing a series of collaborations. Finally, the Microelectronics Packaging course provides greater possibilities of mastered skillsets in the area of microelectronics manufacturing with the fabrication of printed circuit boards (PCBs) and board level assembly for microprocessor applications. The evaluation of the presented comprehensive curriculum was performed with a students’ survey. All the students responded with “Strongly Agree” or “Agree” for the manufacturing related courses. Through the development and application of the presented curriculum for the past six years, we are convinced that students’ confidence in obtaining their desired jobs or choosing higher degrees in the area of microelectronics manufacturing was increased. We confirmed that the hypothesis on the inclusion of handson experience-based courses for MMEE is beneficial to enhancing the motivation for learning.