• Title/Summary/Keyword: FR4PCB

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A Comparison of High Frequency Properties of LTCC Substrate Systems (LTCC 기판 시스템의 고주파 특성 비교)

  • 이영신;김경철;박성대;박종철
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.3
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    • pp.7-12
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    • 2002
  • In the measurement of the RF properties, the LTCC substrate must be considered as a system including various conductor patterning processes. In this paper, the LTCC substrate system is compared with a conventional PCB(Printed Circuit Board) substrate such as FR-4, Duroid and Teflon, etc. The microstrip resonator method is employed for the measurement of the RF properties in the range of DC to 20 GHz. Experimental results show that the ring resonator method is suitable for system loss measurement, and the series gap resonator method for dielectric constant measurement. The process of conductor patterning and its effect on the system loss were also studied.

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Effects on Impedance Mismatch by Dk Variation with Operating Frequency (동작 주파수에 따른 Dk의 변화가 임피던스 부정합에 미치는 영향)

  • Lee, Jong-Hak;Kim, Chang-Gyun;Ra, Young-Eun;Lee, Keon-Min;Lee, Seongsoo
    • Journal of IKEEE
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    • v.23 no.4
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    • pp.1473-1476
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    • 2019
  • Accurate material information is very important in PCB (Printed Circuit Board) design. In an integrated mast of a battleship, heat reduction is essential for stealth functionality. So heat dissipation from internal control equipments should be reduced as much as possible. Control equipments mostly consist of PCBs, but it often suffers from impedance mismatching due to imprecise Dk (Dielectric Constant), which significantly increases heat dissipation. In this paper, measurement methods of Dk is investigated. Also, effects on impedance mismatch by Dk variation with operating frequency is investigated.

Flip Chip Solder Joint Reliability of Sn-3.5Ag Solder Using Ultrasonic Bonding - Study of the interface between Si-wafer and Sn-3.5Ag solder (초음파를 이용한 Sn-3.5Ag 플립칩 접합부의 신뢰성 평가 - Si웨이퍼와 Sn-3.5Ag 솔더의 접합 계면 특성 연구)

  • Kim Jung-Mo;Kim Sook-Hwan;Jung Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.1 s.38
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    • pp.23-29
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    • 2006
  • Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

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Fabrication and Evaluation of Heat Transfer Property of 50 Watts Rated LED Array Module Using Chip-on-board Type Ceramic-metal Hybrid Substrate (Chip-on-board 형 세라믹-메탈 하이브리드 기판을 적용한 50와트급 LED 어레이 모듈의 제조 및 방열특성 평가)

  • Heo, Yu Jin;Kim, Hyo Tae
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.149-154
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    • 2018
  • This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

Design of Simplified Wideband Sleeve Monopole Antenna (광대역 슬리브 모노폴 안테나의 단순화 설계)

  • Hwang, Hee-yong;Choi, Kyoung
    • Journal of IKEEE
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    • v.23 no.3
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    • pp.1100-1103
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    • 2019
  • This paper presents the design method of a planar sleeve monopole antenna on PCB, which has wider bandwidth compared to that of the conventional sleeve monopole antenna, by showing the fact that the sleeve of the conventional antenna can be simplified in structure. The designed and fabricated planar sleeve monopole antenna's structure is very simple, with a monopole adjacent to a small square sleeve on FR4 PCB. The antenna shows 46% wider bandwidth compared to the corresponding 3-dimensional one with nearly omni-directional radiation property.

Development of the Insufflator for Endoscopic Surgery using the Fluidic System in Printed Circuit Board (유공압 부품이 내장된 인쇄회로기판을 활용한 내시경 수술용 기복기의 개발)

  • Lee, Hee-Nam;Kim, In-Young;Chee, Young-Joon
    • Journal of Biomedical Engineering Research
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    • v.32 no.1
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    • pp.32-36
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    • 2011
  • The insufflators in endoscopic surgery supply carbon dioxide to make the air-filled cavity in the abdomen. It contains many kinds of pneumatic and electronic parts and they are connected with the air tubes and electrical wires. The printed circuit boards (PCB) perform wiring, holding and cooling tasks in electronic systems. In this study, the PCB is used as the air channel for insufflators to decrease the cost, volume, and the malfunction according to aging of the device. Three layers of PCB made of FR4 are combined with prepreg as adhesive which has the internal airway channel according to the design. By mounting the pressure sensors and valves, the PCB based fluidic system is implemented. After calibration of flow sensor, the flow rate of the gas also can be measured. The climate test, temperature test, and biocompatibility test showed this idea can be used in insufflators for laparoscopic surgery.

The Study on the Embedded Active Device for Ka-Band using the Component Embedding Process (부품 내장 공정을 이용한 5G용 내장형 능동소자에 관한 연구)

  • Jung, Jae-Woong;Park, Se-Hoon;Ryu, Jong-In
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.3
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    • pp.1-7
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    • 2021
  • In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (Pin) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.

PCB Plane Model Including Frequency-Dependent Losses for Generic Circuit Simulators (범용 회로 시뮬레이터를 위한 손실을 반영한 PCB 평판 모형)

  • Baek, Jong-Humn;Jeong, Yong-Jin;Kim, Seok-Yoon
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.41 no.6
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    • pp.91-98
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    • 2004
  • This paper proposes a PCB plane model for generic SPICE circuit simulators. The proposed model reflects two frequency-dependent losses, namely skin and dielectric losses. After power/ground plane pair is divided into arrays of unit-cells, each unit-cell is modeled using a transmission line and two loss models. The loss model is composed of a resistor for DC loss, series HL ladder circuit for skin loss and series RC ladder circuit for dielectric loss. To verify the validity of the proposed model, it is compared with SPICE ac analysis using frequency-dependent resistors. Also, we show that the estimation results using the proposed model have a good correlation with that of VNA measurement for the typical PCB stack-up structure of general desktop PCs. With the proposed model, not only ac analysis but also transient analysis can be easily done for circuits including various non-linear/linear devices since the model consists of passive elements onl.

Reconfigurable Beam-Steering Antenna Using Dipole and Loop Combined Structure for Wearable Applications

  • Ha, Sang-Jun;Jung, Young-Bae;Kim, Yong-Jin;Jung, Chang-Won
    • ETRI Journal
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    • v.34 no.1
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    • pp.1-8
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    • 2012
  • This paper proposes a reconfigurable beam-steering antenna using a bended dipole and a loop. The radiation patterns of the two antennas are cancelled or compensated, and headed towards a specific direction when the dipole and loop antenna are combined at a reasonable ratio. The proposed antenna can steer the beam directions by controlling the operation of two artificial switches. The proposed antenna was manufactured on a PCB (FR-4) and a flexible PCB (polyimide). In the case of the antenna that was fabricated on a PCB, the maximum beam directions were $+50^{\circ}$, $0^{\circ}$, and $-50^{\circ}$ in the azimuth direction using the two artificial switches, and the antenna gain was 1.96 dBi to 2.48 dBi in the operation bandwidth of 2.47 GHz to 2.53 GHz. Also, the antenna was fabricated on a flexible PCB and measured under various bending conditions for wearable applications.

Parasitics analysis of a grounded bondwire for low-cost plastic packaging of microwave devices (초고주파소자의 저가 플라스틱 실장을 위한 접지된 본딩와이어의 기생특성 해석)

  • 윤상기;이해영
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.34D no.2
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    • pp.21-26
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    • 1997
  • The dielectric effects on the parasitics of bondwires buried in slightly-lossy dielectric materials hav been investigated over a wide frequency range using the method of moments with incorporation of ohmic and dielectric losses. The FR-4 composite is widely used as a basis material for PCB and plastic packages, because of it sinherent electricl and chemical stbility and low cost. The cole-cole model, which is representative complex permittivity model of epoxy polymers, has been applied to consider the dielectric effects in the MoM calculation. The prasitic impedance of a grounded bondwire in FR-4 composite is greatly increased due to the dielectric loading effect enhanced by the radiation at high frequencies. These calculation results will be helpful for designing and packaging of high-frequency low-cost IC's.

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