• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.2430-2434
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• 2005

Automatic FPC punching instrument for the improvement of working condition and cost saving is introduced in this paper. FPC(flexible printed circuit) is used to detect the contact position of K/B and button like a cellular phone. Depending on the quality of the printed ink and position of reference punching point to the FPC, the resistance and current are varied to the malfunctioning values. The size of reference punching point is 2mm and the above. Because the punching operation is done manually, the accuracy of the punching degree is varied with operator's condition. Recently, The punching accuracy has deteriorated severely to the 2mm punching reference hall so that assembly of the K/B has hardly done. To improve this manual punching operation to the FPC, automatic FPC punching system is introduced. Precise mechanical parts like a 5-step stepping motor and ball screw mechanism are designed and tested and low cost PC camera is used for the sake of cost down instead of using high quality vision systems for the FA. 3D Mechanical design tool(Pro/E) is used to manage the exact tolerance circumstances and avoid design failures. Simulation is performed to make the complete vision based punching machine before assembly, and this procedure led to the manufacturing cost saving. As the image processing algorithms, dilation, erosion, and threshold calculation is applied to obtain an exact center position from the FPC print marks. These image processing algorithms made the original images having various noises have clean binary pixels which is easy to calculate the center position of print marks. Moment and Least square method are used to calculate the center position of objects. In this development circumstance, Moment method was superior to the Least square one at the calculation of speed and against noise. Main control panel is programmed by Visual C++ and graphical Active X for the whole management of vision based automatic punching machine. Operating modes like manual, calibration, and automatic mode are added to the main control panel for the compensation of bad FPC print conditions and mechanical tolerance occurring in the case of punch and die reassembly. Test algorithms and programs showed good results to the designed automatic punching system and led to the increase of productivity and huge cost down to law material like FPC by avoiding bad quality.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.2 s.117
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• pp.111-117
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• 2007

In this paper, a new marchand balun using broadside-coupled coplanar waveguide(CPW) on flexible printed circuit (FPC) is proposed. The proposed balun is designed based on the coupled line theory. The fabricated balun shows compact size and improved performance compared to the conventional microstrip line marchand balun. Measured amplitude and phase imbalance between the two balanced output ports are within 0.2 dB and $1^{\circ}$ respectively in a wide frequency range($1.63{\sim}3.44$ GHz). The proposed balun is expected to be used between various antennas and RF front-ends as a functional interconnection.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.459-462
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• 2002

This paper presents the development or a keypad test system for the improvement or the working environment and productivity improvement using the microprocessor PIC16F877 Chip. In order to detect the fault of keypad products, the design of hardware and software is performed in this system. All controls of the system is implemented by the 8 bit one chip micro-controller PIC. This keypad test system can also recognizes the work process, the work result and the fault position of the keypad which is made by the method of a flexible printed circuit (FPC) and construct the database about test results using personal computer. The experimental results show the effective performance of the keypad test system.

• Korean Journal of Materials Research
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• v.9 no.1
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• pp.65-72
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• 1999

In order to minimize flexible printed circuit(FPC), which is used in computer, communication, medical facility, aviation space industry, it is required to improve the interfacial adhesion of polymide/epoxy or polyimide/polyimide consists of FPC. In this study, it was considered to improve the adhesion strength of polyimide/epoxy joint by introducing functional group on polyimide film and improving mechanical property of epoxy. Functional group on polyimide film was introduced by changing polyimide film surface to polyamic acid in KOH aqueous solution. The optimum conditions for surface modification were the concentration of 1M KOH and treatment time of 5min. Also, the optimum adhesion strength of polyimide/epoxy joint was obtained using rubber modified epoxy and polyamic acid as a base resin and curing agent of epoxy adhesive, respectively. The degree of surface modification of polyimide film examined with contact angle measurement of FTIR, thus modification of polyimide to polyamic acid was identified. Fracture surface of plymide/epoxy joint was analyzed by scanning electron microscopy, and modified polyamic acid reimidezed to polymide as increasing curing temperature.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.16-17
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• 2006

We researched by the characteristic of a anisotropic etching of Si wafer and the Si career concerning the flip chip solder bump. Connectors and Anisotropic Conductive Film (ACF) method was already applied to board-to-board interconnection. In place of them, we have focused on board to board interconnection with solder bump by Si carrier, which has been used as Flip chip bonding technology. A major advantage of this technology is that the Flexible Printed Circuit (FPC) is connected in the same solder reflow process with other surface mount devices. This technology can be applied to semiconductors and electronic devices for higher functionality, integration and reliability.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.3
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• pp.347-353
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• 2012

Recently, multi-functionalization (as in smart phones) has been in demand, and the connectors connecting the electrical signals of each board in a cellular phone have become key components. The miniaturization of these connectors is required to achieve a finer pitch design and enhance the electrical signal transfer capacity. However, the miniaturization of connectors reduces the structural safety, and a finer pitch design may cause contact problems under external impact. In this paper, a preliminary design for miniaturized, finer-pitch connectors is suggested for a product with 50 pins and a thickness of 0.2 mm. The assembly process of the FPCB (Flexible Printed Circuit Board) and connector was simulated to ensure the holding force between the two components and avoid overstressing. The design optimization process was performed with the Taguchi method. Fatigue analysis was also conducted to predict the fatigue life of the terminal, and the theoretical and experimental results were compared.