• Smart Media Journal
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• v.12 no.1
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• pp.17-23
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• 2023

Design-For-Security (DFS) methodology is to protect integrated circuits from physical attacks, and that can be implemented by adding a security circuit to detect abnormal external access. Among the abnormal accesses called invasive attack, microprobing and FIB circuit editing are classified as the most powerful methods because they have direct access. Microprobing deliberately inject defects into the wire of circuit through probes, or reads and changes data. FIB circuit editing is methods of reconnecting or destroying circuits to neutralize security circuits or to access data. Previous DFS methodology have responded to the attacks by detecting arrival time asymmetry between the two signals or by comparing input/output data based on encrypted communication. This study conducted to reduce hardware overhead, and the proposed circuit detects the reflected signal asymmetry generated through probe or FIB circuit editing and detects the attacks through comparison. Since the proposed security circuit reduces the size and test cycle of the circuit compared to previous studies, the cost used for security can be reduced.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.8
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• pp.966-974
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• 2011

The use of ion beams in the micro/nano scale is greatly increased by technology development. Especially, focused ion beams (FIBs) have a great potential to fabricate the device in sub micro scale. Nevertheless, FIB has several limitations, surface swelling in low ion dose regime, precipitation of incident ions, and the redeposition effect due to the sputtered atoms. In this research, we demonstrate a way which can be used to fabricate mold structures on a silicon substrate using FIBs. For the purpose of the demonstration, two essential subjects are necessary. One is that focused ion beam diameter as well as shape has to be measured and verified. The other one is that the accurate rotational symmetric model of ion-solid interaction has to be mathematically developed. We apply those two, measured beam diameter and mathematical model, to fabricate optical lenses mold on silicon. The characteristics of silicon mold fabrication will be discussed as well as simulation results.

• Proceedings of the Materials Research Society of Korea Conference
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• 2008.11a
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• pp.5.1-5.1
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.365-366
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• 2008

• 한국초전도학회:학술대회논문집
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• v.15
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• pp.31-31
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• 2005

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.229-233
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• 2004

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. This paper was carried out some experiments of the micro plasma electrode fabrications using FIB. The sputtering of FIB has one major problem that is redeposited by sputtered material including $Ga^+$ ion source. Therefore we have verified the effect of the reposition by EDX. And the optimal condition is suggested to machine the micro plasma electrode.

• Journal of the Korean Vacuum Society
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• v.2 no.3
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• pp.304-313
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• 1993

집속 이온빔 기술은 고해상도의 이온빔 리토그라피, 마스크가 필요없는 이온주입, 그리고 Ion beam induced deposition 등 반도체 소자의 미세가공에 널리 이용되어 왔다. 좋은 안정도와 높은 전류밀도, 적은 에너지 퍼짐 그리고 낮은 에미턴스와 높은 선명도를 갖는 집속 이온빔 장비를 위한 액체 갈륨 이온원이 한국에서 개발 시업되었다. 이온빔의 전압이 15kV, 렌즈전압이 7kV 그리고 렌즈상단에 위치한 aperture의 직경이 0.2mm일 때, 0.1$mu extrm{m}$의 빔 직경으로 집속되는 정전 einzel렌즈가 설계 조립되었고, FIB 진공 chamber는 렌즈부와의 차 등 진공시스템으로 구성되어 설계제작되었다. FIB 장비가 조만간 한국에서 이온빔 밀링, ion beam induced deposition 그리고 잘못된 부분의 수정 등 반도체 제작공정에서의 응용에 큰 기여를 할 것이라 기대된다.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.466-471
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• 2004

In focused-ion-beam (FIB) application of micromachining and device transplantation, four kinds of FIB processes, namely FIB sputtering, FIB-induced etching, redeposition, and FIB-induced deposition, are well utilized. As with FIB systems, scanning electron microscopes(SEMs) were extensively used in the semiconductor industry. They are the tools of choice for defect review and providing the image resolution needed for process monitoring. The enhanced capabilities of a dual-column on one chamber system are quickly becoming realized by the nano industry for performing a wide range of application.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.318-321
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• 2005

FIB (Focused ion Beam) milling on a 500-nm-thick silicon nitride membrane was studied in order to fabricate a high-resolution shadow mask, or called a nanostencil. The silicon nitride membrane was fabricated by MEMS processes of LPCVD, photolithography, ICP etching and bulk silicon etching. The apertures made by FIB milling and normal photolithography were compared. The square metal pattern deposited through FIB milled shadow mask showed 6 times smaller comer radius than the case of photolithography. The results show high resolution patterning could be achieved by local deposition through FIB milled shadow-mask.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.19-23
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• 2005

In order to develop a high brightness ion source using plasma, the ion beam extraction system with an aperture of $100{\mu}m$ in diameter has been designed and constructed. It is observed that over 500nA of He ion beam current can be extracted. With such an optimized condition, $\~10^3\;A/cm^2sr$ beam brightness can be measured by emittance scanner, which is believed to be a promising result for developing next generation FIB.