• Structural Engineering and Mechanics
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• v.50 no.4
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• pp.441-457
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• 2014

This paper presents a finite element based numerical model to solve two dimensional bi-material problems. A bi-material beam consisting of two phase materials ceramic and metal is modelled by finite element method. The beam is subjected simultaneously to mechanical and thermal loadings. The main objective of this study is the analysis of crack deviation located in the brittle material near the interface. The effect of temperature gradient, the residual stresses and applied loads on crack initiation, propagation and deviation are examined and highlighted.

• Journal of Welding and Joining
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• v.17 no.3
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• pp.90-95
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• 1999

The increase in high speed, multi-function and high I/O pin semiconductor devices highly demands high pin count, very thin, and high density packages. BGA is one of the solutions, but the package has demerits in package reliability, surface mounting problems due to the PCB warpage and solder joint crack related with TCE mismatch between the materials. On this study to verify the thermal fatigue lifetime of the solder joint FEM and experiments were performed after surface mounting BGA with different solder composition and reliability conditions. FEM showed optimum composition of Ag3.2-Sn96.5 and under the composition minimum creep deformation of the solder joint was calculated, and the thermal fatigue lifetime was improved. In view of temperature cycle condition, the conditions of $-65^{\circ}C$to $150^{\circ}C$ showed minimum lifetime and t was 1/3 of $0^{\circ}C$ to $125^{\circ}C$ condition. Test board was prepared and solder joint crack was verified. Until 1000cycle on soder joint crack was observed.

• Structural Engineering and Mechanics
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• v.47 no.1
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• pp.1-25
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• 2013

A combined thermal and mechanical action in roller compacted concrete (RCC) dam analysis is carried out using a three-dimensional finite element method. In this work a numerical procedure for the simulation of construction process and service life of RCC dams is presented. It takes into account the more relevant features of the behavior of concrete such as hydration, ageing and creep. A viscoelastic model, including ageing effects and thermal dependent properties is adopted for the concrete. The different isothermal temperature influence on creep and elastic modulus is taken into account by the maturity concept, and the influence of the change of temperature on creep is considered by introducing a transient thermal creep term. Crack index is used to assess the risk of occurrence of crack either at short or long term. This study demonstrates that, the increase of the elastic modulus has been accelerated due to the high temperature of hydration at the initial stage, and consequently stresses are increased.

• Journal of the Korea Concrete Institute
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• v.26 no.1
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• pp.57-62
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• 2014

In this study, the vertical pipe cooling method was developed to propose the pipe cooling method suited for the vertically long mass concrete structures. FEM (finite element method) analysis was carried out to investigate the validity of the vertical pipe cooling method, and the temperature, the behavior of tensile stress of concrete and the crack index were investigated. In result, it was confirmed that the vertical pipe cooling method was effective in the thermal cracking control of mass concrete member.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.14 no.2
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• pp.75-82
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• 2005

Recently the needs of high reliable substances of high strength and high ductility are gradually increased with the development of aerospace industry. The characteristics of maraging steel has high ductililty, formability, corrosion resistant and high temperature strength and is easy to fabricate, weld and treat with heat, and maintain an invariable size even after heat treatment. e steels are furnished in the solution annealed condition and they achieve full properties through martensitic precipitation aging a relatively simple, low temperature heat treatment. As is true of the heat treating procedures, aging is a time/temperature dependent reaction. Therefore, the objective of this stud)'was consideration of fatigue characteristics according as Nb(niobium) content and time/temperature of heat treatment change. Also the stress analysis, fatigue lift, and stress intensity factor were compared with experiment results and FEA(finite element analysis) result. The maximum ftresses of)( Y, and Z axis direction showed about $2.12\times$10$^{2}$MPa, $4.40\times$10$^{2}$MPa and $1.32\times$10$^{2}$MPa respectively. The fatigue lives showed about $7\%$ lower FEA result than experiment result showing almost invariable error every analyzed cycle. Stress intensity factor of the FEA result was lower about $3.5~ 10\%$ than that of the experiment result showing that the longer fatigue crack ten添 the hi인or error. It considered that the cause for the difference was the modeled crack tip having always the same shape and condition regardless of the crack growth.

• Transactions of the Korean Society of Automotive Engineers
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• v.19 no.6
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• pp.126-132
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• 2011

Fatigue cracks of the turbocharger are often observed for high performance engines under thermal shock tests. Maximum exhaust gas temperature of recently developed gasoline engines could reach approximately $950^{\circ}C$. It's very important to estimate transient temperature histories during thermal shock cycles to predict the stress and the fatigue life of the turbocharger. With these temperature profiles, temperature-dependent material properties and boundary conditions, we could identify critical locations by the application of finite element simulation technologies. In this paper, we applied the reliable analysis approach to the actual turbocharger to predict the weak locations due to the repetitions of plastic strains and compared the results with the crack locations under physical engine test.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2000.04a
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• pp.67-70
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• 2000

The tool life is not long enough under sever forming condition in warm forging. The tool life is affected by wear heat fatigue plastic deformation and so on. Especially wear is one of the most serious factors for tool life. To increase tool life we should consider various factors like processing design die design die materials lubrication and cooling system This study design to obtain the steady state temperature of die by FEM analysis under several conditions of cooling. There are four cooling conditions in this study no cooling internal cooling external cooling and both internal and external cooling. With above obtained temperatures tool life is predicted using Archard's model that is considered softening of die. The effect of internal cooling system is better than that of externally cooled die. To predict the die life the steady state temperature is calculated by using mean temperature of die. Considering only wear the die life much longer as the cooling effect is bigger. The more accurate die life will be predicted if we consider heat crack as well as wear.

• Journal of Mechanical Science and Technology
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• v.19 no.11
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• pp.1988-1997
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• 2005

This study is concerned with structural integrity evaluations for the interference-fit flywheels in reactor coolant pumps (RCPs) of nuclear power plants. Stresses in the flywheel due to the shrinkage loads and centrifugal loads at the RCP normal operation speed, design overspeed and joint-release speed are obtained using the finite element method (FEM), where release of the deformation-controlled stresses as a result of structural interactions during rotation is considered. Fracture mechanics evaluations for a series of cracks assumed to exist in the flywheel are conducted, considering ductile (fatigue) and non-ductile fracture, and stress intensity factors are obtained for the cracks using the finite element alternating method (FEAM). From analysis results, it is found that fatigue crack growth rates calculated are negligible for smaller cracks. Meanwhile, the material resistance to non-ductile fracture in terms of the critical stress intensity factor (K$_{IC}$) and the nil-ductility transition reference temperature (RT$_{NDT}$) are governing factors for larger cracks.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.