• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.14-14
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• 2011

Graphene is known to possess excellent thermal properties, including high thermal conductivity, that make it a prime candidate material for heat management in ultra large scale integrated circuits. For device applications, the key parameters are the thermal expansion coefficient and the thermal conductivity. There has been no reliable experimental determination on the thermal expansion coefficient of graphene whereas the estimates of the thermal conductivity vary widely. In this work, we estimate the thermal expansion coefficient of graphene on silicon dioxide by measuring the temperature dependence of the Raman spectrum. The shift of the Raman peaks due to heating or cooling results from both the intrinsic temperature dependence of the Raman spectrum of graphene and the strain on the graphene film due to the thermal expansion mismatch with silicon dioxide. By carefully comparing the experimental data against theoretical calculations, it is possible to determine the thermal expansion coefficient. The thermal conductivity is measured by estimating the thermal profile of a graphene film suspended over a circular hole of the substrate.

• 대한치과기공학회지
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• 제30권2호
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• pp.17-22
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• 2008

The purpose of this study was to observe the thermal expansion of the inlay waxes at temperature. Inlay pattern wax shows not only a high coefficient of expansion but also a tendency to warp or distort when allowed to stand unrestrained. The thermal expansion of inlay waxes was tested according to the treatment conditions for 10 minutes at $40^{\circ}C$ The thermal expansion of inlay waxes at various temperatures was measured with an electro dial gauge. The results were as fellows: 1. It is shown that the rate of thermal expansion of wax A is 0.2%, wax B is 0.29%, wax C is 0.38%, and wax D is 0.22% at $40^{\circ}C$ 2. It is shown that the coefficient of thermal expansion of wax A is $106{\times}10^{-6}/^{\circ}C$, wax B is $152{\times}10^{-6}/^{\circ}C$, wax C is $199{\times}10^{-6}/^{\circ}C$, and wax D is $116{\times}10^{-6}/^{\circ}C$ at $40^{\circ}C$ 3. The thermal expansion of the inlay waxes at $40^{\circ}C$ was shown to increase in the order of wax C, B, D, A.

• 한국세라믹학회지
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• 제40권1호
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• pp.93-97
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• 2003

치과용 재료를 포함한 생체재료로 각광을 받고 있는 알루미나-유리복합체에 사용되는 유리침투재의 적정 조성은 열팽창계수가 중요 인자로, 적합한 열팽창계수를 가지는 적정 조성 유리 개발을 효율적으로 달성하기 위하여 다구치 실험계획법을 도입하였다. 이러한 방법을 이용하여 유리 침투재의 열팽창에 가장 많은 영향을 미치는 알칼리 산화물과 알칼리 토류 산화물의 영향을 관찰하였다. 치과용 유리침투재의 제성분들을 고려할 때 유리의 열팽창계수에 미치는 영향은 $Na_2$O≫K$_2$O≫MgO≒CaO의 순서로 $Na_2$O의 영향력은 MgO, CaO의 약 8배로 나타났으며 $K_2$O의 영향력은 MgO, CaO의 약 4배로 계산되었다. 또 각 인자간의 교호작용(interaction affects) 중 $K_2$O-CaO의 교호 작용이 가장 유의하게 나타났으며 각 인자와 교호 작용의 수준별 기여율을 계산하여 특성 조성의 열팽창 특성치를 예측하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 춘계학술대회 논문집
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• pp.355-356
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• 2009

The change of thermal expansion and mechanical behaviors by cold working has been investigated in Fe-29%Ni-17%Co low thermal expansion Kovar alloy. Fe-29%Ni-17%Co alloy was cold rolled gradually and prepared to plates having reduction ratio of 0%, 20%, 40%, 60%, and 80%. Annealing effect on the properties was also studied. Thermal expansion was measured from $25^{\circ}C$ to $600^{\circ}C$ with a heating rate of $5^{\circ}C$/min by using vacuum differential dilatometer. It was found that thermal expansion coefficient ($\alpha_{30{\sim}400}$) slightly decreased (reduction ration of 20%) and then remarkably increased (above reduction ration of 40%) with increasing reduction ratio of cold rolling. Thermal expansion coefficient ($\alpha_{30{\sim}400}$) was sharply decreased after annealing heat-treatment. Yield and tensile strengths were continuously increased and elongation was decreased by cold roiling. Microstructural observation and X-ray diffraction analysis results showed that the $\alpha$ phase significantly increased as the reduction ratio increased. The slight decrease of thermal expansion coefficient bellow reduction ration of 20% could be explained by the destroying short-range ordering and the decreasing of grain size. The significant increase of thermal expansion coefficient with cold rolling mainly attributed to the appearance of $\alpha$ phase. The correlation between the microstructural cause and invar phenomena for the low thermal expansion behavior was also discussed.

• 한국재료학회지
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• 제31권11호
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• pp.626-634
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• 2021

Cu matrix composites reinforced with chopped carbon fiber (CF), which is cost effective and can be well dispersed, are fabricated using electroless plating and hot pressing, and the effects of content and alignment of CF on the thermal properties of CF/Cu composites are studied. Thermal conductivity of CF/Cu composite increases with CF content in the in-plane direction, but it decreases above 10% CF; this is due to reduction of thermal diffusivity related with phonon scattering by agglomeration of CF. The coefficient of thermal expansion decreases in the in-plane direction and increases in the through-plane direction as the CF content increases. This is because the coefficient of thermal expansion of the long axis of CF is smaller than that of the Cu matrix, and the coefficient of thermal expansion of its short axis is larger than that of the Cu matrix. The thermal conductivity is greatly influenced by the agglomeration of CF in the CF/Cu composite, whereas the coefficient of thermal expansion is more influenced by the alignment of CF than the aggregation of CF.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 C
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• pp.1599-1601
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• 2000

To study invar alloy as a core material for large ampacity over-head transmission line which have high strength and low thermal expansion coefficient simultaneously, thermal expansion coefficient, physical properties and hardness of Fe-Ni-Co-xC alloy have been studied. It is necessary that invar alloy possess low thermal expansion coefficient and high strength for increased capacity over-head transmission line. In this paper we tried to find out the effect of carbon addition related with mechanical and physical properties. It was found that the thermal expansion coefficient and hardness were increased with carbon addition for whole composition range but the saturation magnetization was decreased except for the range of 0.1$\sim$0.4%C.

• 한국전기전자재료학회논문지
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• 제21권10호
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• pp.954-960
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• 2008

The effects of elastic modulus coefficient and linear expansion coefficient of overhead distribution power line(ACSR $58 mm^2$) on sag behavior in distribution line have been investigated to clarify the difference between specification and experimental level. The elastic modulus coefficients of Al wire and steel wire were $5,182.6 kgf/mm^2,\;18,348.8 kgf/mm^2$, respectively Therefore, the computational composition elastic modulus coefficient of the power line was $7,063.5 kgf/mm^2$, while that of experimentally measured was $7681.1 kgf/mm^2$. As a result, we found that elastic modulus coefficient which was experimentally measured was higher than that of computational by 8.7 %. However, when planner designs the sag of disoibution line, the elastic modulus coefficient of power line $8,400 kgf/mm^2$ should be generally adopted. These two different using values lead to the sag difference of 0.62 m. The other results will be discussed.

• Archives of Metallurgy and Materials
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• 제67권3호
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• pp.909-912
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• 2022

The thermal expansion of a ZrO₂-20 mol% Gd₂O₃ pellet has been systematically investigated using a thermo-mechanical analyzer in the temperature range of 293-1773 K. Variations in the thermal expansion coefficient and density upon temperature change were calculated using the thermal expansion data. The average linear thermal expansion coefficient of the ZrO₂-20 mol% Gd₂O₃ pellet was found to be 9.522 × 10^-6 K^-1 in the range of 298-1073 K. This value is smaller than that of ZrO₂ and larger than that of Gd₂O₃. Further, with an increase in temperature to 1773 K, the density of ZrO₂-20 mol% Gd₂O₃ pellet was found to decrease to 94.98 % of the initial density at 293 K.

• 한국재료학회지
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• 제30권2호
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• pp.93-98
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• 2020

Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10^-6/℃) than did the monolithic synthesized Cu sintered body.

• 한국세라믹학회지
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• 제17권4호
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• pp.213-216
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• 1980

A glass-ceramics material of composition %SiO_2$: 38.50, $Al_2O_3$: 26.00, $Na_2O$: 18.00, CaO: 6.00, MgO: 4.00, $TiO_2$: 7.50 was strengthened by coating a series of glazes$(SiO_2-B_2O_3-Al_2O_3-CaO-PbO-Na_2O-)$, which has lower thermal expansion coefficient than that of the glass-ceramics. The thermal expansion coefficient of the glazes ranges $80~90{\times}10^{-7}$cm/cm/$^{\circ}C$, whereas that of the glass-ceramics is $115{\times}10^{-7}$cm/cm/$^{\circ}C$. The glass-ceramics was identified to be composed of nepheline, carnegieite low form, and meta sodium silicate crystal by X-ray diffraction phase analysis. The glaze, having lower melting point and appropriate thermal expansion coefficient, was tried to be stable and good at secondary heat treatment.