• Title/Summary/Keyword: Etching test

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The Influence of Surface Treatments on Shear Bond Strength between Zirconia Core and Heat Press Ceramic Interface (지르코니아 코어의 표면처리방법이 열 가압 세라믹과의 전단결합강도에 미치는 영향)

  • Park, Hang-Min;Chung, In-Sung
    • Journal of Technologic Dentistry
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    • v.31 no.2
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    • pp.23-30
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    • 2009
  • All-ceramic restorations have gained acceptance among clinicians and patients because of their superior esthetics. Most all-ceramic systems have a 2-layer structure, using a weak veneering ceramic over a strong supporting core. often, failure of all-ceramic restorations occurs when the veneering ceramic fractures, exposing the core material. The purpose of this study was to compare the shear bond strength of heat press ceramic system (Zirpress) to zirconia core with various surface treatments. 10 metal cores and 50 zirconia cores were fabricated and divided into six groups according to surface treatment such as Zirliner application, aluminium oxide blasting, and 9.5% HF etching. Sixty specimens were prepared using Zirpress, veneered 8mm height and 3mm in diameter, over the zirconia cores (n=10). The shear bond strength test was performed in a universal testing machine with a crosshead speed of 1/min. Ultimate shear bond strength data were analyzed with One-way ANOVA and the Scheffe's test (p=.05). Within the limits of this study, the following conclusions were drawn: The mean shear bond strengths (MPa) were: 12.93 for $110{\mu}m$ aluminium oxide blasting/Rexillium III/IPS e.Max Zirpress; 14.92 for $50{\mu}m$ aluminium oxide blasting ${\pm}9.5%$ HF etching/Zirconis core/IPS e.Max Zirpress; 16.37 for $110{\mu}$ aluminium oxide blasting + 9.5% HF etching/Zirconis core/IPS e.Max Zirpress; 12.89 for $200{\mu}$ aluminium oxide blasting + 9.5% HF etching/Zirconis core/IPS e.Max Zirpress; 19.30 for 9.5% HF etching/Zirconis core/IPS e.Max Zirpress; 19.55 for Zirliner/Zirconis core/IPS e.Max Zirpress. The mean shear bond strength for ZNTZH (Zirliner/Zirconis core) and ZNTEH (9.5% HF etching/Zirconis core) were significantly superior to MS110H ($110{\mu}$ aluminium oxide blasting/Rexillium III) and ZS200EH ($200{\mu}$ aluminium oxide blasting + 9.5% HF etching/Zirconis core) (p<0.05).

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The effect of zirconia surface architecturing technique on the zirconia/veneer interfacial bond strength

  • Her, Soo-Bok;Kim, Kyoung Hun;Park, Sang Eun;Park, Eun-Jin
    • The Journal of Advanced Prosthodontics
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    • v.10 no.4
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    • pp.259-264
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    • 2018
  • PURPOSE. The purpose of this study was to evaluate the effect of the zirconia surface architecturing technique (ZSAT) on the bond strength between veneering porcelain and zirconia ceramic. MATERIALS AND METHODS. 20 sintered zirconia ceramic specimens were used to determine the optimal surface treatment time, and were randomly divided into 4 groups based on treatment times of 0, 1, 2, and 3 hours. After etching with a special solution, the surface was observed under scanning electron microscope, and then the porcelain was veneered for scratch testing. Sixty 3 mol% yttria-stabilized tetragonal zirconia polycrystal ceramic blocks were used for tensile strength testing; 30 of these blocks were surface treated and the rest were not. Statistical analysis was performed using ANOVA, the Tukey post-hoc test, and independent t-test, and the level of significance was set at ${\alpha}=.05$. RESULTS. The surface treatment of the zirconia using ZSAT increased the surface roughness, and tensile strength test results showed that the ZSAT group significantly increased the bond strength between zirconia and veneering porcelain compared to the untreated group (36 MPa vs. 30 MPa). Optimal etching time was determined to be 2 hours based on the scratch test results. CONCLUSION. ZSAT increases the surface roughness of zirconia, and this might contribute to the increased interfacial bond strength between zirconia and veneering porcelain.

EFFECTS OF VARIOUS ETCHING TIMES ON DEPTH OF ETCH AND SHEAR BOND STRENGTH OF AN ORTHODONTIC RESIN TO BOVINE ENAMEL (부식시간이 소의 법랑질 부식깊이와 교정용 레진의 전단결합강도에 미치는 영향)

  • Kim, Jeong-Hoon;Lee, Ki-Soo;Park, Young-Guk
    • The korean journal of orthodontics
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    • v.23 no.1 s.40
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    • pp.75-88
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    • 1993
  • Recent reports indicate that shorter etching times than 60 seconds can be adopted without affecting the bond strength and clinical disadvantages. The purpose of this in vitro study was to compare the shear bone strength and to measure depth of etch at different etching time length. One hundred and eight extracted bovine lower central incisors were embedded each in a tooth cup with cold-cure acrylic resin. The facial surfaces of the teeth were ground wet with 600-, 800-, 1000-, and 1200-grit Sic papers, and finally polished with a water slurry of extrafine silicon carbide powder, washed with tap water, and dried with hot air. Nine groups of nine prepared teeth were etched with a commercial($38\%$ phosphoric acid solution) for 0, 5, 10, 15, 20, 30, 60, 90, and 120 seconds, respectively, rinsed with tap water, and dried with hot air. One conditioned teeth from every group was selected randomly for the scanning electron microscopic examination, and the remaining eight teeth of the groups were used for measuring the push shear bond strength after bonding brackets and immensing them in the $36.5^{\circ}C$ water for 24 hours. Another nine groups of three teeth were used for measuring the depth of etch and surface roughness with a surface profilometer. after pieces of adhesive tape of 3mm inner diameter positioned on the ground enamel surfaces, and etched with the above mentioned. The data obtained form the above expeiments were analysed statistically with one way ANOVA and Dunkan's multiple range test with the $95\%$ confidence level. The results and conclusion of the study were as follows; 1. The results of shear bond strength for the given experimental etching times were not statistically different, but showed the tendency of decreasing shear bone strength after over 60 seconds etching times. 2. On the scanning election microscopic examination, it was observed that the morphological patterns of etched enamel surface for 5 to 20 seconds were similar and consitent, and those for 30 to 120 seconds showed increasing over-etched patterns depending on the length of etching times. 3. The depth of etch was increased almost proportionally by the length of etching times, but it was not associated with the shear bond strength. 4. The surface roughness increased depending on the length of etching times, but it was not associated with the shear bond strength. 5. This experiment indicated that proper etching time with $38\%$ phosphoric acid solution is in the range of 5 to 30 seconds.

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High-Speed, High-Reliability Planar-Structure InP/InGaAs Avalanche Photodiodes for 10Gb/s Optical Receivers with Recess Etching (수광영역의 식각을 통한 단일확산 공정의 고속 평판형 InP/InGaAs 10Gb/s 광 검출기의 신뢰성)

  • Jung, Ji-Houn;Kwon, Yong-Hwan;Hyun, Kyung-Sook;Yun, Il-Gu
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07b
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    • pp.1022-1025
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    • 2002
  • This paper presents the reliability of planar InP/InGaAs avalanche photodiodes (APD's) with recess etching, which is very crucial for the commercial 10-Gb/s optical receiver application. A versatile design for the planar InP/InGaAs APD's and bias-temperature tests to evaluate long-term reliability at temperature from 200 to $250^{\circ}C$. The reliability is examined by accelerated life tests by monitoring dark current and breakdown voltage. The lifetime of the APD's is estimated by a degradation activation energy. Based on the test results, it is concluded that the planar InP/InGaAs APD's with recess etching shows the sufficient reliability for practical 10-Gb/s optical receivers.

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Fabrication of Glass Etching Mask using Various Polymers and Metals and Test of it in Glass Micromaching (폴리머와 금속을 이용한 유리 식각 마스크의 저작 및 이를 이용한 유리 가공)

  • Jeon, Do-Han;Sim, Woo-Young;Yang, Sang-Sik
    • Proceedings of the KIEE Conference
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    • 2004.11a
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    • pp.268-270
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    • 2004
  • This paper reports a novel masking method with various mask materials for wet etching of glass. Various mask materials such as Cr/Au, Ti/Au, Polyimide and thick SU-8 photoresist were investigated for borosilicate glass (Borofloat33) etching in concentrated hydrofluoric acid (48% HF). Polyimide and thick SU-8 photoresist are not suitable as masking material due to its poor adhesion to glass surfaces. Titanium has good adhesion is suitable as the first layer to make multi-protective layers. The best protection was obtained with a combination of Ti/Au, polyimide and Ti/Au as masking material with etch depth of $350{\mu}m$ achieved.

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Tooth surface treatment strategies for adhesive cementation

  • Rohr, Nadja;Fischer, Jens
    • The Journal of Advanced Prosthodontics
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    • v.9 no.2
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    • pp.85-92
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    • 2017
  • PURPOSE. The aim of this study was to evaluate the effect of tooth surface pre-treatment steps on shear bond strength, which is essential for understanding the adhesive cementation process. MATERIALS AND METHODS. Shear bond strengths of different cements with various tooth surface treatments (none, etching, priming, or etching and priming) on enamel and dentin of human teeth were measured using the Swiss shear test design. Three adhesives (Permaflo DC, Panavia F 2.0, and Panavia V5) and one self-adhesive cement (Panavia SA plus) were included in this study. The interface of the cement and the tooth surface with the different pre-treatments was analyzed using SEM. pH values of the cements and primers were measured. RESULTS. The highest bond strength values for all cements were achieved with etching and primer on enamel ($25.6{\pm}5.3-32.3{\pm}10.4MPa$). On dentin, etching and priming produced the highest bond strength values for all cements ($8.6{\pm}2.9-11.7{\pm}3.5MPa$) except for Panavia V5, which achieved significantly higher bond strengths when pre-treated with primer only ($15.3{\pm}4.1MPa$). Shear bond strength values were correlated with the micro-retentive surface topography of enamel and the tag length on dentin except for Panavia V5, which revealed the highest bond strength with primer application only without etching, resulting in short but sturdy tags. CONCLUSION. The highest bond strength can be achieved for Panavia F 2.0, Permaflo DC, and Panavia SA plus when the tooth substrate is previously etched and the respective primer is applied. The new cement Panavia V5 displayed low technique-sensitivity and attained significantly higher adhesion of all tested cements to dentin when only primer was applied.

INFLUENCE OF APPICATION TIME OF SELF-ETCHING PRIMERS ON DENTINAL MICROTENSILE BOND STRENGTH (자가 산부식 프라이머의 적용시간이 상아질의 미세인장 결합강도에 미치는 영향)

  • Cho, Young-Gon;Lee, Young-Gon;Kim, Jong-Uk;Park, Byung-Cheul;Kim, Jong-Jin;Choi, Hee-Young;Jin, Cheul-Hee;Yoo, Sang-Hoon
    • Restorative Dentistry and Endodontics
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    • v.29 no.5
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    • pp.430-438
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    • 2004
  • This study evaluated the influence of application time of self-etching primers on microtensile bond strength (${\mu}$TBS) to dentin using three self-etching primer adhesive systems. Dentin surfaces were exposed from forty-eight human molars. They were conditioned with three self-etching primers (Clearfil SE Bond [SE], Unifil Bond [UF], Tyrian SPE + One Step Plus [TY]) and different primining times (10s, 20s, 30s and 40s). Composite resins were bonded to dentin surfaces and specimens were made. ${\mu}TBS$ was tested and statistically compared using by one-way ANOVA and Tukey's Test. The results of this study presented that priming time for 10s in SE and UF groups and for 30s and 40s in TY group was highly decreased ${\mu}TBS$ to dentin.

HNO3 Etching Properties of BaO-B2O3-ZnO-P2O5 System of Barrier Ribs in PDP (플라스마 디스플레이 패널의 격벽용 BaO-B2O3-ZnO-P2O5계의 HNO3를 이용한 에칭 특성)

  • Jeon, J.S.;Kim, J.M.;Kim, N.S.;Kim, H.S.
    • Korean Journal of Materials Research
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    • v.16 no.4
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    • pp.235-240
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    • 2006
  • We investigated the effect of ZnO filler on the microstructure of $BaO-B_2O_3-ZnO-P_2O_5$ glass system to find an etching mechanism of barrier ribs. The sintering behavior of composites heated in the temperature range $560-600^{\circ}C$ was studied by volumetric shrinkage rate and microstructure. The etching test was carried out in $HNO_3$ solution at $50^{\circ}C$ for 10 min. The volumetric shrinkage of sintered sample decreased with the increased firing temperature because of the formation of two crystals. Glass and ZnO filler react forming the $BaZn_2(PO_4)_2$ crystal phases during the sintering process. Etching phenomenon of sintered samples by $HNO_3$ showed that the $BaZn_2(PO_4)_2$ crystal phase was strongly leached compared to glass matrix, crystal phases and fillers. Therefore, the control of interface by condition of sintering is so important to achieve etching effect in barrier ribs.

A Study for Stable End Point Detection in 90 nm WSix/poly-Si Stack-down Gate Etching Process (90 nm급 텅스텐 폴리사이드 게이트 식각공정에서 식각종말점의 안정화에 관한 연구)

  • Ko, Yong-Deuk;Chun, Hui-Gon;Lee, Jing-Hyuk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.3
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    • pp.206-211
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    • 2005
  • The device makers want to make higher density chips on the wafer through scale-down. The change of WSix/poly-Si gate film thickness is one of the key issues under 100 nm device structure. As a new device etching process is applied, end point detection(EPD) time delay was occurred in DPS+ poly chamber of Applied Materials. This is a barrier of device shrink because EPD time delay made physical damage on the surface of gate oxide. To investigate the EPD time delay, the experimental test combined with OES(Optical Emission Spectroscopy) and SEM(Scanning Electron Microscopy) was performed using patterned wafers. As a result, a EPD delay time is reduced by a new chamber seasoning and a new wavelength line through plasma scan. Applying a new wavelength of 252 nm makes it successful to call corrected EPD in WSix/poly-Si stack-down gate etching in the DPS+ poly chamber for the current and next generation devices.

Real-time malfunction detection of plasma etching process using EPD signal traces (EPD 신호궤적을 이용한 플라즈마 식각공정의 실시간 이상검출)

  • Cha, Sang-Yeob;Yi, Seok-Ju;Koh, Taek-Beom;Woo, Kwang-Bang
    • Journal of Institute of Control, Robotics and Systems
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    • v.4 no.2
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    • pp.246-255
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    • 1998
  • This paper presents a novel method for real-time malfunction detection of plasma etching process using EPD signal traces. First, many reference EPD signal traces are collected using monochromator and data acquisition system in normal etching processes. Critical points are defined by applying differentiation and zero-crossing method to the collected reference signal traces. Critical parameters such as intensity, slope, time, peak, overshoot, etc., determined by critical points, and frame attributes transformed signal-to symbol of reference signal traces are saved. Also, UCL(Upper Control Limit) and LCL(Lower Control Limit) are obtained by mean and standard deviation of critical parameters. Then, test EPD signal traces are collected in the actual processes, and frame attributes and critical parameters are obtained using the above mentioned method. Process malfunctions are detected in real-time by applying SPC(Statistical Process Control) method to critical parameters. the Real-time malfunction detection method presented in this paper was applied to actual processes and the results indicated that it was proved to be able to supplement disadvantages of existing quality control check inspecting or testing random-selected devices and detect process malfunctions correctly in real-time.

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