• Restorative Dentistry and Endodontics
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• v.27 no.3
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• pp.257-269
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• 2002

Objective : The purpose of this study was to evaluate the resin infiltration into dentin of one-bottle adhesive systems and self-etching primer bonded to Class V cavities using confocal laser scanning microscope(CLSM). Material and Methods : Forty Class V cavities were prepared from freshly extracted caries-free Human teeth. These teeth were divided into two groups based on the presence of cervical abrasion: Group I, cervical abrasion : Group II, wedge-shaped cavity preparation. Resin-dentin interfaces were produced with two one-bottle dentin bonding systems-ONE COAT BOND(OCB; Coltene$^R$) and Syntac$^R$SPrint$^{TM}$(SS; VIVADENT)-, one self-etching priming system-CLEARFIL$^{TM}$ SE BOND (SB : KURARAY)- and one multi-step dentin bonding system-Scotchbond$^{TM}$Multi-Purpose (SBMP, 3M Dental Products)-as control according to manufacturers' instructions. Cavities were restored with Spectrum$^{R}$(Dentsply). Specimens were immersed in saline for 24 hours and sectioned longitudinally with a low-speed diamond disc. The resin-dentin interfaces were microscopically observed using CLSM. The quality of resin-infiltrated dentin layers were evaluated by five dentists using 0~4 scale. Results : Confocal laser scanning microscopal investigations using primer labeled with rhodamine B showed that the penetration of the primer occurred along the cavity margins. Statistical analysis using one-way ANOVA followed by Duncan's Multiple Range test revealed that the primer penetration of the group 2(wedge-shaped cavity preparation) was more effective than group 1(cervical abrasion) and that of the gingival interfaces was more effective than the occlusal interfaces. In the one-bottle dentin bonding systems, the resin penetration score of OCB was compatible to SBMP, but those of SS and self-etching priming system, SB were lower than SBMP.

• Restorative Dentistry and Endodontics
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• v.33 no.3
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• pp.224-234
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• 2008

The purpose of this study was to compare the normal and two times of application time of six self-etching primers applied to enamel using microshear bond strength (uSBS) test and the finding of scanning electronic microscope (SEM). Crown of sixty human molars were bisected mesiodistally and buccal and lingual enamel of crowns were partially exposed and polished with 600 grit SiC papers. They were divided into one of two equal groups subdivided into one of six equal groups (n = 10) by self-etching primer adhesives. After the same manufacture's adhesive resin and composites were bonded on the enamel surface of each group, the bonded specimens were subjected to uSBS testing and also observed under SEM. In conclusion, generally two times of primer application time increased the enamel uSBS, especially with the statistical increase of bond strength in adhesives involving high-pH primers.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.9
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• pp.701-709
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• 2011

In semiconductor wafer fabrication, etching is one of the most critical processes, by which a material layer is selectively removed. Because of difficulty to correct a mistake caused by over etching, it is critical that etch should be performed correctly. This paper proposes a new approach for etch endpoint detection of small open area wafers. The traditional endpoint detection technique uses a few manually selected wavelengths, which are adequate for large open areas. As the integrated circuit devices continue to shrink in geometry and increase in device density, detecting the endpoint for small open areas presents a serious challenge to process engineers. In this work, a high-resolution optical emission spectroscopy (OES) sensor is used to provide the necessary sensitivity for detecting subtle endpoint signal. Partial Least Squares (PLS) method is used to analyze the OES data which reduces dimension of the data and increases gap between classes. Support Vector Machine (SVM) is employed to detect endpoint using the data after PLS. SVM classifies normal etching state and after endpoint state. Two data sets from OES are used in training PLS and SVM. The other data sets are used to test the performance of the model. The results show that the trained PLS and SVM hybrid algorithm model detects endpoint accurately.

• The Journal of Korean Academy of Prosthodontics
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• v.43 no.4
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• pp.415-425
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• 2005

Statement of problem : Fracture of composite resin core will be occulted by progress of crack. Bonding interface of different materials has large possibility of starting point of crack line. Therefore, the bond strength of glass fiber post to composite resin core is important for prevention of fracture. Purpose: This in vitro study tried to find out how to get the higher strength of glass fiber post to composite resin core through surveying the maximum load that fractures the post and cote complex. Materials and methods: 40 specimens made with glass fiber Posts(Style $post^{(R)}$, Metalor, Swiss) and composite resin core ($Z-100^{(R)}$, 3M, USA) were prepared and loaded to failure with push-out type shear-bond strength test in a universal test machine. The maximum fracture load and fracture mode were investigated in the specimens that were restored with four different surface treatments. With the data. ANOVA test was used to validate the significance between the test groups, and Bonferroni method was used to check if there is any significant statistical difference between each test group. Evely analysis was approved with 95% reliance. Results: On measuring the maximum fracture load of specimens, both the treatments of sandblasted and acid-etched one statistically showed the strength increase rather than the control group (p<0.005). The scanning electric microscope revealed that sand blasting made more micro-retention form not only on the resin matrix but on the glass fiber, and acid-etching contributed to increase in surface retention form, eliminated the inorganic particles in resin matrix. Specimen fracture modes investigation represented that sand blasted groups showed lower bonding failure than no-sand blasted groups. Conclusion: Referring to the values of maximum fracture load of specimens, the bonding strength was increased by sand blasting and acid-etching.

• Clean Technology
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• v.23 no.4
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• pp.393-400
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• 2017

In this study, we have developed a process for separating and recovering Ni and Fe in solution through a new solvent instead of TBP and Alamine336, which are solvents used in the conventional solvent extraction method. Experimental conditions were optimized through lab test and a $10L\;h^{-1}$ pilot plant was constructed for commercialization. In addition, the process data for mass production were obtained through pilot experiment and it was confirmed that there is no problem in product quality that can be used through the corrosion test of ferric chloride.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.58-62
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• 2003

Silicon carbide (SiC) was etched in a $NF_3/CH_4$ inductively coupled plasma. The etch process was modeled by using a neural network called generalized regression neural network (GRNN). For modeling, the process was characterized by a $2^4$ full factorial experiment with one center point. To test model appropriateness, additional test data of 16 experiments were conducted. Particularly, the GRNN predictive capability was drastically improved by a genetic algorithm (GA). This was demonstrated by an improvement of more than 80% compared to a conventionally obtained model. Predicted model behaviors were highly consistent with actual measurements. From the optimized model, several plots were generated to examine etch rate variation under various plasma conditions. Unlike the typical behavior, the etch rate variation was quite different depending on the bias power Under lower bias powers, the source power effect was strongly dependent on induced dc bias. The etch rate was strongly correated to the do bias induced by the gas ratio. Particularly, the etch rate variation with the bias power at different gas ratio seemed to be limited by the etchant supply.

• Clean Technology
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• v.13 no.3
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• pp.188-194
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• 2007

In the present study, we developed a methodology to minimize a waste solution produced in the etching process. The condition for the optimization of the GRS process was studied on the basis of laboratory experiment and field test as well as pilot test. Through the study, we analyse the relation of the main process variables and the yield of the GRS process. The application of the new operation condition and the reactor internal modification results in 10% yield improvement in the GRS process and accordingly decreases a wasted solution.

• Polymer(Korea)
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• v.26 no.6
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• pp.718-727
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• 2002

In this work, an Ar+ beam was irradiated on carbon fiber surfaces to improve the interfacial shear strength (IFSS) of the resulting composites using an ion assisted reaction (IAR) method h single fiber pull-out test was executed to investigate the basic characteristics of the single Carbon fiber/matrix interface. Based on Greszczuk's geometrical model, the debonding force for pull-out of the fiber from the resins was discussed with the applied ion beam energy as a result, it was known that an ion beam treatment produced the functional groups on fiber surface and etching lines along the fiber axis direction, resulting in increasing the adhesion forces between fibers and matrix, which caused the improvement of the IFSS in a composite system. And, it was also found that the maximum IFSS was shown at 0.8 keV ion beam energy in this system.

• The korean journal of orthodontics
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• v.28 no.5 s.70
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• pp.803-812
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• 1998

The purpose of this study was to evaluate the shear bond strength and failure mode of ceramic brackets according to the surface treatment of porcelain. Sixty Porcelain samples were randomly divided into six groups of ten samples. Then they were treated as follows: Group 1(silane only), Group 2(etching+silane), Group 3(stone+silane), Group 4(sandblasting+silane), Group 5(stone +etching+silane), Group 6(sandblasting+etching+silane) After surface treatment of porcelain, sixty Transcend 6000 brackets were bonded to the prepared porcelain surface and they were stored in $37^{\circ}C$ saline for 24 hours. An Instron universal testing machine was used to test the shear bond strength of ceramic brackets to porcelain. After debonding, bases of ceramic brackets and porcelain surfaces were examined under scanning electron microscope(SEM) to determine failure mode. Statistical analysis of the data was carried out with one-way ANOVA and Duncan's multiple range test. The results were as follows : 1. The shear bond strength of surface-treated groups 2 to 6 was higher than that of only silane-treated group 1, and there was statistical significance. (P<0.05) 2. There was no significant difference among the groups 3 to 6. (P>0.05) 3. The shear bond strength of etching-surface treated group 2 was significantly lower than those of sandblasting-surface treated group 4, complex surface treated group 5 and group 6. 4. According to the scanning electromicroscopic images, the surface roughness of sandblasting-surface treated group 4 was less than those of the group 5 and 6, but there was no significant difference in the shear bond strength. (P>0.05) As a conclusion we can have a clinically adequate bond strength when an application of silane is done after the treatment of porcelain surface with more than one way to bond ceramic bracket on the porcelain. Also, it is considered that the sandblasting and application of silane is effective for the simplication and convenience of the treatment.

• Journal of Welding and Joining
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• v.20 no.4
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• pp.498-504
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• 2002

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.