• Proceedings of the KSME Conference
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• 2001.06e
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• pp.169-174
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• 2001

This paper reports on the development of high aspect ratio structure and 3-D integrated process for MEMS-based micro gas turbines. To manufacture high aspect ratio structures, Deep Reactive Ion Etching (DRIE) process have been developed and optimized. Specially, in this study, structures with aspect ratios greater than 10 were fabricated. Also, wafer direct bonding and Infra-Red (IR) camera bonding inspection systems have been developed. Moreover, using glass/silicon wafer direct bonding, we optimized the 3-D integrated process.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.201-204
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• 2002

A large area inductively coupled plasma which is applicable to LCD processing is built with a modified single loop RF antenna. Combination of parallel and series paths of RF current through the antenna induces local enhancement of plasma density, which in turn provides uniform plasma density near the substrate. The plasma density distribution is measured and compared with that of the conventional single loop antenna. Aisotropic etching of photoresist is performed, and it is found that etch uniformity is improved by 3％ from 15% of the conventional etcher over 350$\times$300mm glass substrates. Photoresist etching rate and uniformity can be further improved by applying a periodic weak axial magnetic fieid.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.7
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• pp.1393-1398
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• 2009

Conventionally, etching is first considered for microelectronics fabrication process and is specially important in process of a-Si:H thin film transistor for LCD. In this paper, we stabilize properties of device by development of wet and dry etching process. The a-Si:H TFTs of this paper is inverted staggered type. The gate electrode is lower part. The gate electrode is formed by patterning with length of 8 ${\mu}$m${\sim}$16 ${\mu}$m and width of 80${\sim}$200 ${\mu}$m after depositing with gate electrode (Cr) 1500 ${\AA}$under coming 7059 glass substrate. We have fabricated a-SiN:H, conductor, etch-stopper and photo resistor on gate electrode in sequence, respectively. The thickness of these thin films is formed with a-SiN:H (2000 ${\mu}$m), a-Si:H(2000 ${\mu}$m) and n+a-Si:H (500 ${\mu}$m), We have deposited n-a-Si:H, NPR(Negative Photo Resister) layer after forming pattern of Cr gate electrode by etch-stopper pattern. The NPR layer by inverting pattern of upper gate electrode is patterned and the n+a-Si:H layer is etched by the NPR pattern. The NPR layer is removed. After Cr layer is deposited and patterned, the source-drain electrode is formed. In the fabricated TFT, the most frequent problems are over and under etching in etching process. We were able to improve properties of device by strict criterion on wet, dry etching and cleaning process.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.35-39
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• 2018

In order to improve the coupling efficiency, a collimator lens that collects the light emitted from the laser diode at a wide angle to the core of the optical fiber is essential. Glass mold method using a mold is widely used as a collimator lens currently used. Although this method is inexpensive to produce, it is difficult to form precisely and quality problems such as spherical aberration. In this study, the precision of surface processing was improved by replacing the existing glass mold method with the semiconductor process, and the material of the lens was changed to silicon suitable for the semiconductor process. The semiconductor process consists of a photolithography process using PR and a dry etching process using plasma. The optical coupling efficiency was measured using an ultra-precision alignment system for the evaluation of the optical characteristics of the silicon lens. As a result, the optical coupling efficiency was 50% when the lens diameter was $220{\mu}m$, and the optical coupling property was 5% or less with respect to the maximum optical coupling efficiency in the lens diameter range of $210-240{\mu}m$.

• Restorative Dentistry and Endodontics
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• v.23 no.1
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• pp.183-196
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• 1998

The purpose of this study was to determine the effect of bleaching technique on the shear bond strength of esthetic restorative materials to bovine enamel. The bleaching agent was used 35% $H_2O_2$(Hi-Lite, Shofu, U.S.A.). Experimental groups were divided into two divisions as group A and B. Experimental A groups for the effect of number of bleaching were as follows ; Group Al : no bleaching Group A2 : bleaching 1 time ( for 5 minutes ) Group A3 : bleaching 3 times ( each for 5 minutes ) Group A4 : bleaching 6 times ( each for 5 minutes ) Group A5 : bleaching 9 times ( each for 5 minutes ) Experimental B groups for the effect of storage period in artificial saliva were as follows ; Group B1 : not stored in artificial saliva after bleaching Group B2 : stored in artificial saliva for 1 day after bleaching Group B3 : stored in artificial saliva for 1 week after bleaching Group B4 : stored in artificial saliva for 2 weeks after bleaching Group B5 : stored in artificial saliva for 4 weeks after bleaching Composite resin and glass ionomer cement were bonded to all specimens, and the shear bond strength between enamel and r~storative material were measured in Instron Universal Testing Machine(Instron, 4467, U.S.A,), Additionally, the bleached enamel specimens were examed after etching with 37.4% $H_3PO_4$ for 1 min under SEM(S-2300, Hitachi Co., Japan) to observe the effect of bleaching procedure on enamel surface morphology. The result were as follows ; 1. In SEM findings, bleached bovine enamel was found to be superficially rough. 2. In bleached bovine enamel, the effect of acid etching was reduced with the increase of number of bleaching. 3. The mean shear bond strength of composite resin and glass ionomer cement to bleached enamel surface tended to be lower than those to non-bleached enamel surface. 4. With the increase of number of bleaching, the shear bond strength of composite resin and glass ionomer cement to bleached enamel were progressively decreased. 5. Increasing the, storage period in artificial saliva after bleaching, the shear bond strength of composite resin and glass ionomer cement to bleached enamel were progressively increased. 6. The mean shear bond strength of glass ionomer cement to bleached bovine enamel tended to be clearly lower than that of composite resin.

• The Journal of Korean Academy of Prosthodontics
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• v.37 no.5
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• pp.658-671
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• 1999

The major influencing factors on the strength of all-ceramic crowns are types of dental ceramics, fabrication techniques, methods of abutment preparation and cementation modes of all-ceramic restorations. Zinc phosphate cement and glass-ionomer cement were used as an early lot-ing media for all-ceramic crowns. Recently many studies have reported that resin cements have more advantages in increasing the fracture strength of restorations comparing with zincphosphate cement and glass-ionomer cement. The purpose of this study is to investigate the effect of etching, silane treatment, sandblasting and dentin bonding agents on fracture strengths of dental ceramics. 40 flat dentin specimens and 40 ceramic discs of 1.5mm thickness and 8mm diameter were fabricated, and divided into 4 groups according to surface treatments. Surface treatments before cementation were as follows Group I : (ceramic) : HF etching - silane treatment - application of bonding resin (dentin) : application of dentin bonding agent Group II : (ceramic) : sandblasting - application of bonding resin (dentin) : application of dentin bonding agent Group III : (ceramic) : application of bonding resin (dentin) : application of dentin bonding agent Group IV : (ceramic) : HF etching - silane treatment - application of bonding resin (dentin) : no dentin bonding procedure Dentin specimens and ceramic discs were cemented with dual cure resin cement, and went through thermocycling. Compressive stress es were loaded on the centers of ceramic discs with Instron test-ing machine, and fracture strengths resistance for catastrophic fracture were measured The results were as follows. 1. The group I showed the highest fracture resistance. The next was group II And group III, IV followed. 2. There was a significant difference in the mean value of fracture strengths between group I and group III (p<0.05), but no significant differences between group I and group II, and group II and group III (p>0.05). 3. There was a significant difference in the mean value of fracture strengths between group I and group IV (p<0.05).

• Clean Technology
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• v.18 no.3
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• pp.280-286
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• 2012

The dry etching of sacrificial $SiO_2$ was performed in supercritical carbon dioxide. The etching of boron phosphor silica glass (BPSG), tetraethyl orthosilicate (TEOS), thermal $SiO_2$, and Si-nitride (SiN) was investigated by using a two chamber system with HF/py etchant and alcohol additives. The etch rate of sacrificial $SiO_2$ increased upon the addition of methanol. The etch selectivity of BPSG with respect to SiN was highest with IPA although the highest etch rate was resulted from methanol except BPSG. The etch rate increased with the temperature in HF/py/MeOH system. Especially the increase of the etch rate was much higher for BPSG with an increase in the reaction temperature. The etch residue was not reduced apparently upon the addition of alcohol cosolvents to HF/py. While the etch rate in HF/$H_2O$ was higher than HF/py/alcohol system, the rate decreased with the addition of alcohols to HF/$H_2O$. The cantilever beam structure of high aspect ratios was released by the dry ething in supercritical carbon dioxide without damage.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.349-354
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• 2001

In this study, we investigated the effect of the impacting ang1e of particles, the scanning times and the stand-off distance on the surface roughness and the weight-loss rate of samples with no mask, and the wall profile and overetching of samples with different mask pattern in powder blasting of soda-lime glass. The varying parameters were the different impact angles between 50$^{\circ}$ and 90$^{\circ}$, scanning times of nozz1e up to 40 and the stand-off distances 70mm and 100mm. The widths of mask pattern were 0.2mm, 0.5mm and 1mm. The powder was alumina sharp particles, WA#600. The mass flow rate of powder during the erosion test was fixed constant at 175g/min and the blasting pressure of powder at 0.2MPa

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2007.11a
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• pp.225-228
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• 2007

Micro solid propellant thruster is the most feasible for development with current MEMS. Basic components of micro solid propellant thruster are diverging nozzle, micro igniter, combustion chamber, and solid propellant. Micro nozzles and micro chambers were fabricated using photosensitive glass by anisotropic wet etching technique. Micro Pt heaters on glass membrane which ignited solid propellant were developed. Components of thruster were integrated. Successful ignition was observed.

• Biotechnology and Bioprocess Engineering:BBE
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• v.8 no.4
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• pp.240-245
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• 2003

The use of microfabricated microfluidic devices offers significant advantages over current technologies including fast analysis time and small reagent requirements. In the context of proteomic research, the possibility of using affinity-based separations for prefractionation of samples using microfluidic devices has significant potential. We demonstrate the use of microscale devices to achieve affinity separations of proteins using a device fabricated from borosilicate glass wafers. Photolithography and wet etching are used to pattern individual glass wafers and the wafers are fusion bonded at 650$^{\circ}C$ to obtain enclosed channels. A polymer has been successfully polymerized in situ and used either as a frit for packing beads or, when derivatized with Cibacron Blue 3GA, as a separation matrix. Both of these technologies are based on in situ UV photopolymerization of glycidyl methacrylate (GMA) and trimethylolpropane trimethacrylate (TRIM) in channels.