• 한국진공학회지
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• 제7권2호
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• pp.88-93
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• 1998

본 연구에서는 기계-화학적 연마(Chemical-Mechanical-Polishing: CMP)공정을 이용 하여 게이트 전극을 가지는 실리콘 전계방출 소자를 제작하였으며, 또한 그 전자방출 특성 을 분석하였다. 실리콘 전계방출 소자를 제작하기 위해 실리콘을 두단계로 이루어진 건식식 각과 산화공정으로 팁을 뾰족하게 만들었으며, 게이트를 형성하기 위하여 고 선택비를 가지 는 CMP공정을 사용하였으며, 연마 시간과 연마 압력의 변화로 게이트 높이와 개구의 직경 을 쉽게 조절할 수 있었다. 또한, CMP공정시 발생되는 디싱(dishing)문제를 산화막 마스킹 을 사용함으로 해결하여 자동 정렬된 게이트전극의 개구를 깨끗하게 형성할 수 있었다. 제 작된 에미터의 높이와 팁끝의 반경은 각각 1.1$\mu$m, 100$\AA$정도이며, 제작된 2809개의 팁 어 레이로 80V의 게이트전압에서 31$\mu$A의 방출전류를 얻을 수 있었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2007년도 춘계학술발표회 초록집
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• pp.78-79
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• 2007

In this study, chemical dry characteristics of silicon nitride layers were investigated in the $F_2/N_2/Ar$ remote plasma. A toroidal-type remote plasma source was used for the generation of remote plasmas. The effects of additive $N_2$ gas on the etch rates of various silicon nitride layers deposited using different deposition techniques and precursors were investigated by varying the various process parameters, such as the $F_2$ flow rate, the addition $N_2$ flow rate and the substrate temperature. The etch rates of the various silicon nitride layers at the room temperature were initially increased and then decreased with the $N_2$ flow increased, which indicates an existence of the maximum etch rates. The etch rates of the silicon oxide layers were also significantly increased with the substrate temperature increased. In the present experiments the $F_2$ gas flow, addition $N_2$ flow rate and the substrate temperature were found to be the critical parameters in determining the etch rate of the silicon nitride layers

• 열처리공학회지
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• 제35권3호
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• pp.121-129
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• 2022

Recently the growth of the renewable energy production has caused the flexible operation in LNG combined cycle power plant. Due to the rapid start and stop operations, large CrMoV castings used for turbine casings and valve bodies could be distorted and lead to replacement or welding repair. This study was performed to find out the characteristics of the repair welding for a damaged CrMoV casting steel. A typical field repair method (arc & TIG welding) was applied to making specimens. The degraded N2 packing head sample from the steam turbine was used. The evaluations of weldments were carried out in terms of microstructural characterization, microhardness measurements, tensile, creep-rupture and fatigue tests. Color etching was also applied for better understanding of welding microstructures. As the boundary between HAZ and base material was deteriorated by welding, it caused microstructural changes formed during PWHT and the shortening of the remaining residual life. By comparing the properties according to repair welding method, it was possible to derive what important welding factors were. As a result, arc welding method is more suitable for repair welding on CrMoV castings.

• 반도체디스플레이기술학회지
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• 제21권1호
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• pp.95-102
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• 2022

Since the organic light-emitting diodes (OLEDs) have been widely investigated as next-generation displays, it has been successfully commercialized as a flexible and rollable display. However, there is still wide room and demand to improve the device characteristics such as power efficiency and lifetime. To solve this issue, there has been a wide research effort, and among them, the internal and the external light extraction techniques have been attracted in this research field by its fascinating characteristic of material independence. In this study, a micro-nano composite structured external light extraction layer was demonstrated. A reactive ion etching (RIE) process was performed on the surfaces of hexagonally packed hemisphere micro-lens array (MLA) and randomly distributed sphere diffusing films to form micro-nano composite structures. Random nanostructures of different sizes were fabricated by controlling the processing time of the O₂ / CHF₃ plasma. The fabricated device using a micro-nano composite external light extraction layer showed 1.38X improved external quantum efficiency compared to the reference device. The results prove that the external light extraction efficiency is improved by applying the micro-nano composite structure on conventional MLA fabricated through a simple process.

• 한국포장학회지
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• 제29권3호
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• pp.223-228
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• 2023

Sustainable energy supplies without the recharging and replacement of the charge storage device have become increasingly important. Among various energy harvesters, the triboelectric nanogenerator (TENG) has attracted considerable attention due to its high instantaneous output power, broad selection of available materials, eco-friendly and inexpensive fabrication process, and various working modes customized for target applications. In this study, the amount of voltage and current generated was measured by applying the PSD profile random vibration test of the electronic vibration tester and ISTA 3A according to the time of Anodized Aluminum Oxide (AAO) pore widening of the manufactured TENG device Teflon and AAO. The discharge and charging tests of the integrated module during the random simulated transport environment and the recognition distance of RFID were measured while agricultural products (onion) were loaded into the returnable folding plastic box. As a result, it was found that AAO alumina etching processing time to maximize TENG performance was optimal at 31 min in terms of voltage and current generation, and the integrated module applied with the TENG module showed a charging effect even during the continuous use of RFID, so the voltage was kept constant without discharge. In addition, the RFID recognition distance of the integrated module was measured as a maximum of 1.4 m. Therefore, it was found that the surface condition of AAO, a TENG element, has a great influence on the power generation of the integrated module, and due to the characteristics of TENG, the power generation increases as the surface dries, so it is judged that the power generation can be increased if the surface drying treatment (ozone treatment, etc.) of AAO is applied in the future.

• 대한기계학회논문집B
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• 제34권2호
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• pp.113-120
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• 2010

마이크로채널 열교환기에서 R-134a의 증발열전달 특성에 관하여 실험적 연구를 수행하였다. 마이크로채널은 금속박판인 SUS304에 포토에칭 공정으로 식각되었으며, 13개의 금속박판은 차례로 적층되어 확산접합공정을 통하여 접합되었다. 본 연구에서는 R-134a의 증발온도, 질량유속 그리고 물의 입구온도의 변화에 따른 열전달 특성을 대향류 조건에서 실험하였다. 실험결과 R-134a와 물의 입구온도차가 클수록 증발열전달량은 증가하였으며, 증발열전달계수는 0.67 kW/$m^2{\cdot}^{\circ}C$에서 6.23 kW/$m^2{\cdot}^{\circ}C$이었다. 아울러 마이크로채널 열교환기에서 R-134a와 물의 열교환에 따른 증발열전달 특성에 영향을 미치는 Reynold수와 무차원 온도비 $\Theta$를 도출하여 Nusselt수에 관한 실험적 상관식을 제안하였다.

• 한국결정성장학회지
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• 제28권1호
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• pp.9-13
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• 2018

본 연구에서는 고휘도 고출력 광학소자 제조에 GaN 기판으로서의 적용가능 여부를 평가하고자 HVPE 법으로 성장된 bulk GaN 결정의 두께 증가에 따른 광학적 특성 변화를 분석하였다. HVPE를 이용하여 다양한 두께(0.4, 0.9, 1.5 mm 이상)의 2인치 GaN 기판을 제작한 뒤, 화학 습식 에칭, Raman, PL 등을 이용하여 기판의 결함밀도와 잔류응력 변화에 따른 광학적 특성을 분석하였다. 이를 통해 제작된 GaN 기판의 결정 두께와 광학적 특성과의 상관관계를 확인하였으며, 동종기판의 제작을 통한 고성능 광학소자로의 응용가능성을 확인하였다.

• 한국진공학회지
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• 제6권3호
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• pp.220-226
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• 1997

실리콘 미세가공기술로 형성된 프레임 모양의 실리콘 기판에 의해 지지되는 -$Si_3N_4/300 nm-SiO_2/150 nm-Si_3N_4$ 광반사막을 제조하였으며, 이것을 광섬유와 결합하여 강도형 다모드 광섬유 압력센서를 제작하고 그 특성을 조사하였다. $Si_3N_4/SiO_2/Si_3N_4$다아아 프램을 광반사막으로 사용하기 위하여 이 다이아프램의 뒷면에 NiCr 및 Au 박막을 각각 진 공증착하여 광반사막에서의 광투과에 의한 광손실을 수%로 감소시킬 수 있었다. 유전체 다 이아프램의 상하에 각각 있는 $Si_3N_4$막은 KOH 수용액에 의한 실리콘 이방성 식각시 자동식 각 정지층 역할을 하여 다이아프램 두께의 재현성이 우수하였다. 다이아프램의 크기가 3$\times$ 3$\textrm{mm}^2$, 4$\times$4$\textrm{mm}^2$ 및 5$\times$5$\textrm{mm}^2$인 센서는 각각 0~126.64kPa, 0~79.98kPa 및 0~46.66kPa의 압력범위에서 선형적인 광출력-압력 특성을 나타내었으며, 이들 센서의 압력감도는 각각 약 20.69nW/kPa, 26.70nW/kPa 및 39.33nW/kPa로서, 다이아프램의 크기가 증가할수록 압력감 도도 증가하였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1999년도 추계학술발표회 초록집
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• pp.49-49
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• 1999

In this study, $Cl_2/BCI_3$ magnetized inductively coupled plasmas (MICP) were used to etch GaN and the effects of magnetic confinements of inductively coupled plasmas on the GaN etch characteristics were investigated as a function of $Cl_2/BCI_3$. Also, the effects of Kr addition to the magnetized $Cl_2/BCI_3$ plasmas on the GaN etch rates were investigated. The characteristics of the plasmas were estimated using a Langmuir probe and quadrupole ma~s spectrometry (QMS). Etched GaN profiles were observed using scanning electron microscopy (SEM). The small addition of $Cl_2/BCI_3$ (10-20%) in $Cl_2$ increased GaN etch rates for both with and without the magnetic confinements. The application of magnetic confinements to the $Cl_2/BCI_3$ inductively coupled plasmas (ICP) increased GaN etch rates and changed the $Cl_2/BCI_3$ gas composition of the peak GaN etch rate from 10% $BCI_3$ to 20% $BCI_3$. It also increased the etch selectivity over photoresist, while slightly reducing the selectivity over $Si0_2$. The application of the magnetic field significantly increased positive $BCI_2{\;}^+$ measured by QMS and total ion saturation current measured by the Langmuir probe. Other species such as CI, BCI, and CI+ were increased while species such as $BCl_2$ and $BCI_3$ were decreased with the application of the magnetic field. Therefore, it appears that the increase of GaN etch rate in our experiment is related to the increased dissociative ionization of $BCI_3$ by the application of the magnetic field. The addition of 10% Kr in an optimized $Cl_2/BCI_3$ condition (80% $Cl_2/$ 20% $BCI_3$) with the magnets increased the GaN etch rate about 60%. More anisotropic GaN etch profile was obtained with the application of the magnetic field and a vertical GaN etch profile could be obtained with the addition of 10% Kr in an optimized $Cl_2/BCI_3$ condition with the magnets.

• 센서학회지
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• 제7권3호
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• pp.147-153
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• 1998

$Si_{3}N_{4}/SiO_{2}/Si_{3}N_{4}$(N/O/N) 다이아프램과 결합된 고감도의 광섬유 Fabry-Peort 압력센서를 개발하여 스트레인 및 그 응답특성을 조사하였다. 먼저, 44 wt% KOH 수용액을 이용한 실리콘 이방성식각기술로 600 nm 두께의 N/O/N 다이아프램을 제조하였으며, 제조된 다이아프램과 광섬유 Fabry-Perot 간섭계를 결합하여 광섬유 압력센서를 구성하였다. 단일모드 광섬유(SMF)내에 $TiO_{2}$ 유전체 박막을 용융접합하여 공극의 길이가 약 2 cm인 광섬유 Fabry-Perot 간섭계를 제작하였다. 광섬유 Fabry-Perot 간섭계의 한쪽 끝은 N/O/N 다이아프램과 결합하였으며, 나머지 한쪽을 3 dB 광결합기를 통해 광측정장치에 연결하였다. $2{\times}2\;mm^{2}$ 및 $8{\times}8\;mm^{2}$ 크기의 N/O/N 다이아프램에 대해 응답특성을 조사한 결과, 각각 약 0.11 rad/kPa과 1.57 rad/kPa의 압력감도를 나타내었으며, 선형오차는 0.2 %FS이내였다.