• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
• /
• pp.185.2-185.2
• /
• 2016

The plasma density is an essential plasma parameter describing plasma physics. Furthermore, it affects the throughput and uniformity of plasma processing (etching, deposition, ashing, etc). Therefore, a novel technique for plasma density measurement has been attracting considerable attention. Microwave probe is a promising diagnostic technique. Various type of cutoff, hairpin, impedance, transmission, and absorption probes have been developed and investigated. Recently, based on the basic type of probes, modified flat probe (curling and multipole probes), have been developing for in situ processing plasma monitoring. There is a need for comparative study between the probes. It can give some hints on choosing the reliable probe and application of the probes. In this presentation, we make attempt of numerical study of different kinds of microwave probes. Characteristics of frequency spectrum from probes were analyzed by using three-dimensional electromagnetic simulation. The plasma density, obtained from the spectrum, was compared with simulation input plasma density. The different microwave probe behavior with changes of plasma density, sheath and pressure were found. To confirm the result experimentally, we performed the comparative experiment between cutoff and hairpin probes. The sheath and collision effects are corrected for each probe. The results were reasonably interpreted based on the above simulation.

• 한국대기환경학회지
• /
• 제20권5호
• /
• pp.625-632
• /
• 2004

Perfluorocompounds ($PFC_s$), such as tetrafluoromethane ($CF_4$) and hexafluoroethane ($C_2F_6$), have been widely used as plasma etching and chemical vapor deposition (CVD) gases for semiconductor manufacturing processes. Since these $PFC_s$ are known to cause a greenhouse effect intensively, there has been a growing interest in reducing $PFC_s$ emissions. Among various $CF_4$ decomposing techniques, a dielectric barrier discharge (DBD) is considered as one of a promising candidate because it has been successfully used for generating ozone ($O_3$) and decomposing nitrogen oxide (NO). Firstly, optimal concentration of oxygen for $CF_4$ decomposition was found to figure out how many primary and secondary reactions are associated with DBD process. Secondary, to find effective discharge method for $CF_4$ decomposition, a streamer and a glow mode in DBD are experimentally compared, which includes (i) coaxialcylinder DBD, (ii) DBD reactor packed with glass beads. and (iii) a glow mode operation with a helium gas. The test results showed that optimal concentration of oxygen was ranged 500 ppm~1% for treating 500 ppm of $CF_4$ and helium glow discharge was the most efficient one to decompose $CF_4$.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2009년도 추계학술발표대회
• /
• pp.49.2-49.2
• /
• 2009

투명전극은 디스플레이, 태양전지와 같은 광전자 소자에 필수적이며, 지금까지 개발된 재료 중에는 ITO가 가장 투명하면서 전기전도도가 높고 생산성도 좋기 때문에 투명전극의 재료로 사용하고 있다. ITO는 낮은 비저항(${\sim}10^{-4}{\Omega}cm$) 과 높은 투과율 (~85 %), 상대적으로 넓은 밴드갭 에너지 (3.5 eV) 의특성과 같이 뛰어난 전기적 광학적 특성에 반해서 높은 원자재 가격, 불안정한 공급량 등으로 인한 문제점이꾸준히 제기되고 있다. 따라서 $In_2O_3$:Sn, ZnO:Al, ZnO:Ga, ZnO:F, ZnO:B, TiN 등과 같은 물질들로대체하려는 연구가 활발하게 진행되고 있다. ZnO는 ITO보다원자재의 수급이 원활하기 때문에 원가가 낮으며, 상대적으로 낮은 온도에서도 제작이 가능하다. 또한 화학적으로 안정적이므로 ZnO에 Al, Ga 등의 3족 원소를 도핑함으로써 낮은 비저항의 박막 제작이 가능하고, ITO 박막과 비교하여 etching이 쉬우며 기판과의 접착성이 좋으며, sputtering 공정시 plasma 분위기에서의 안정성이 뛰어나고 박막증착율이 높기 때문에 투명전극으로 적합한 재료이다. 본 연구에서는 cylindrical type의 Aldoping된 ZnO single target을 사용하여 박막 증착 압력의 변화를 주어 유리기판 위에 DC sputtering을 하였다. Fieldemission scanning electron microscope (FESEM)을 통해 ZnO:Al 박막의 표면의 형상과 두께를 확인하였으며, X-ray diffraction (XRD) 분석을 통해 박막의 결정학적 특성을 관찰하였다. 투명전극용 물질로서 ZnO:Al 박막의 적합성 여부를 확인하기 위하여 Van der Pauw 방법을 이용하여 박막의 비저항, 전자 이동도, 캐리어 농도를 측정하였으며, 박막의 기계적 성질 및 표면 접착성을 확인하기 위하여 nano-indentaion 분석을 하였다. 또한 UV-vis spectrophotometer를 이용하여 ZnO:Al 박막의 투과율을 분석하여 투명전극으로의 응용 가능성을 확인하였다.

• 한국광학회지
• /
• 제8권4호
• /
• pp.327-332
• /
• 1997

2단계 메사 식각 공정과 유기 금속 화학 증착방법으로 높은 비저항을 갖는 Fe-도핑된 반절연 InP층의 전류 차단층을 갖는 10 Gb/s 광통신용 초고속 1.55.mu.m 궤환형 반도체 레이저 다이오드를 제작하였다. 제작된 DFB-LD의 특성은 발진 임계전류~15 mA, slope efficiency ~0.13 mW/mA, 동 저항 ~6.0.OMEGA.이었고, 발진 파장은 1.546 .mu.m이며, 6 Ith까지의 전류에도 인접 모우드 억압비, SMSR>40dB 이상 (CW상태)으로써 안정된 단일 모우드 동작을 보였다. DFB-LD의 소신호 주파수 특성으로 27 mA의 작은 구동전류에서 이미 -3dB 대역폭이 10 GHz에 도달하였음을 보여주었고, 또한 최대 -3dB 대역폭으로 구동전류 90 mA에서 ~18 GHz까지 얻는 우수한 소신호 주파수 특성을 보여주었다. 10 Gb/s DFB-LD 모듈 전송시험에 있어서, 1.55.mu.m 파장의 레이저 다이오드 모듈로 일반 단일모우드 광섬유와 분산천이 광섬유에 대해서 전송시험한 결과 에러평탄면(error floor)없이 각각 10 km, 80 km를 전송할 수 있었다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 춘계학술대회 논문집
• /
• pp.1223-1227
• /
• 2005

Fine microgroove is the key component to fabricate micro-grating, micro-grating lens and so on. Conventional groove fabrication methods such as etching and lithography have some problems in efficiency and surface integrity. This study deals with the creation of ultra-precision micro grooves using non-rotational diamond tool and CNC machining center. The shaping type machining method proposed in the study allows to produce V-shaped grooves of $40\mu{m}$ in depth with enough dimensional accuracy and surface. For the analysis of machining characteristics in micro V-grooving, three components of cutting forces and AE signal are measured and processed. Experimental results showed that large amplitude of cutting forces and AE appeared at the beginning of every cutting path, and cutting forces had a linear relation with the cross-sectional area of uncut chip thickness. From the results of this study, proposed micro V-grooving technique could be successfully applied to forming the precise optical parts like prism patterns on light guide panel of TFT-LCD.

• 한국재료학회지
• /
• 제24권12호
• /
• pp.682-688
• /
• 2014

Physical and chemical changes in a polished wafer and in $2.5{\mu}m$ & $4{\mu}m$ epitaxially grown Si layer wafers (Epilayer wafer) after surface treatment were investigated. We characterized the influence of surface treatment on wafer properties such as surface roughness and the chemical composition and bonds. After each surface treatment, the physical change of the wafer surface was evaluated by atomic force microscopy to confirm the surface morphology and roughness. In addition, chemical changes in the wafer surface were studied by X-ray photoemission spectroscopy measurement. Changes in the chemical composition were confirmed before and after the surface treatment. By combined analysis of the physical and chemical changes, we found that diluted hydrofluoric acid treatment is more effective than buffered oxide etching for $SiO_2$ removal in both polished and Epi-Layer wafers; however, the etch rate and the surface roughness in the given treatment are different among the polished $2.5{\mu}m$ and $4{\mu}m$ Epi-layer wafers in spite of the identical bulk structural properties of these wafers. This study therefore suggests that independent surface treatment optimization is required for each wafer type, $2.5{\mu}m$ and $4{\mu}m$, due to the meaningful differences in the initial surface chemical and physical properties.

• 한국재료학회지
• /
• 제28권4호
• /
• pp.208-213
• /
• 2018

Epitaxial ($11{\bar{2}}0$) a-plane GaN films were grown on a ($1{\bar{1}}02$) R-plane sapphire substrate with photoresist (PR) masks using metal organic chemical vapor deposition (MOCVD). The PR mask with striped patterns was prepared using an ex-situ lithography process, whereas carbonization and heat treatment of the PR mask were carried out using an in-situ MOCVD. The heat treatment of the PR mask was continuously conducted in ambient $H_2/NH_3$ mixture gas at $1140^{\circ}C$ after carbonization by the pyrolysis in ambient $H_2$ at $1100^{\circ}C$. As the time of the heat treatment progressed, the striped patterns of the carbonized PR mask shrank. The heat treatment of the carbonized PR mask facilitated epitaxial lateral overgrowth (ELO) of a-plane GaN films without carbon contamination on the R-plane sapphire substrate. Thhe surface morphology of a-plane GaN films was investigated by scanning electron microscopy and atomic force microscopy. The structural characteristics of a-plane GaN films on an R-plane sapphire substrate were evaluated by ${\omega}-2{\theta}$ high-resolution X-ray diffraction. The a-plane GaN films were characterized by X-ray photoelectron spectroscopy (XPS) to determine carbon contamination from carbonized PR masks in the GaN film bulk. After $Ar^+$ ion etching, XPS spectra indicated that carbon contamination exists only in the surface region. Finally, the heat treatment of carbonized PR masks was used to grow high-quality a-plane GaN films without carbon contamination. This approach showed the promising potential of the ELO process by using a PR mask.

• 한국정보통신학회논문지
• /
• 제3권2호
• /
• pp.471-475
• /
• 1999

$N{_2}O$ 게이트 산화막을 사용한 nMOSFET가 금속 플라즈마 식각 피해에 대한 면역도가 동일한 두께의 순수한 산화막을 갖는 nMOSFET보다 향상됨을 보여준다. Area Antenna Ratio(AAR)를 증가시킴에 따라 $N{_2}O$ 산화막을 갖는 nMOSFET는 좁은 초기 분포 특성과 정전계 스트레스하에서 더 작은 열화특성을 보이는 데 이는 Si기판과 산화막 계면에서의 질소기의 영향으로 설명되어진다. 또한 $N{_2}O$ 게이트 산화막을 사용하면 순수한 게이트 산화막을 사용할 때 보다 금속 Area Antenna Ratio(AAR)과 Perimeter Area ratio(PAR) 의 최대 허용 크기를 더 증가할 수 있다. 이러한 $N{_2}O$ 게이트 산화막을 갖는 NMOSFET의 개선은 Si기판과 $N{_2}O$ 산화막 계면에 있는 질소기에 의한 계면 강도의 영향 때문으로 판단된다.

• Transactions on Electrical and Electronic Materials
• /
• 제14권3호
• /
• pp.133-138
• /
• 2013

Acrylonitrile-butadiene-styrene (ABS) plastic is a polymer material extensively used in electrical and electronic applications. Nickel (Ni) thin film was deposited on ABS by electroless plating, after its surface was treated and modified with atmospheric plasma generated by means of dielectric barrier discharges (DBDs) in air. The method in this study was developed as a pre-treatment for electroless plating using DBDs, and is a dry process featuring fewer processing steps and more environmentally friendliness than the chemical method. After ABS surfaces were modified, surface morphologies were observed using a scanning electron microscope (SEM) to check for any physical changes of the surfaces. Cross-sectional SEM images were taken to observe the binding characteristics between metallic films and ABS after metal plating. According to the SEM images, the depths of ABS by plasma are shallow compared to those modified by chemically treatment. The static contact angles were measured with deionized (DI) water droplets on the modified surfaces in order to observe for any changes in chemical activities and wettability. The surfaces modified by plasma showed smaller contact angles, and their modified states lasted longer than those modified by chemical etching. Adhesion strengths were measured using 3M tape (3M 810D standard) and by 90° peel-off tests. The peel-off test revealed the stronger adhesion of the Ni films on the plasma-modified surfaces than on the chemically modified surfaces. Thermal shock test was performed by changing the temperature drastically to see if any detachment of Ni film from ABS would occur due to the differences in thermal expansion coefficients between them. Only for the plasma-treated samples showed no separation of the Ni films from the ABS surfaces in tests. The adhesion strengths of metallic films on the ABS processed by the method developed in this study are better than those of the chemically processed films.

• 한국진공학회지
• /
• 제7권3호
• /
• pp.169-175
• /
• 1998

HBr/$Cl_2/He-O_2$ 반응 기체를 이용한 반응성 이온 식각후, 폴리실리콘 표면에 형성된 잔류막을 x-선 광전자 분광법(x-ray photoelectron spectroscopy, XPS)과 전자 현미경 (scanning electron mocroscopy, SEM)을 이용하여 관찰하였다. 그 결과 잔류물은 패턴된 폴 리실리콘의 맨 윗부분에 자존하고 있었으며, 화학 결합 상태는 실리콘 산화물임이 밝혀졌다. 잔류물인 실리콘 산화물의 형성 메카니즘을 규명하기 위하여 원래의 혼합 기체 성분중 한가 지씩의 반응 기체를 제외시켜 가면서 실험하였다. 비록 플라즈마 성질이 다를지라도, 잔류물 은 산소의 존재하에서 잘 형성됨을 알 수 있었는데, 이는 휘발성이 낮은 실리콘-할로겐 화 합물이 산소에 의해 산화됨으로써 형성되는 것으로 이해하게 되었다. 또한 반응성 이온 식 각후 형성된 잔류층은 소자의 전기적 특성과 후처리 공정에 영향을 미치는 것으로 알려져 있어서, 이를 제거하기 위해 습식과 건식 후처리 공정을 도입하여 비교하였다. 그 결과 건식 공정의 경우 기체에 의해 새로운 잔류물이 형성됨을 XPS를 통하여 관찰하였다. 따라서 잔 류물을 제거하고 깨끗한 표면을 얻기 위해서는 습식 공정이 더 적합함을 알았다.