• JSTS:Journal of Semiconductor Technology and Science
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• 제5권2호
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• pp.131-135
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• 2005

The effect of different surface passivation films on blue or green (465-505 nm) InGaN/GaN multi-quantum well light-emitting diodes (LEDs) die were examined. $SiO_2$ or $SiN_x$ deposited by plasma enhanced chemical vapor deposition, or $Sc_2O_3$ or MgO deposited by rf plasma enhanced molecular beam epitaxy all show excellent passivation qualities. The forward current-voltage (I-V) characteristics were all independent of the passivation film used, even though the MBE-deposited films have lower interface state densities ($3-5{\times}10^{12}\;eV^{-1}\;cm^{-2}$) compared to the PECVD films (${\sim}10^{12}\;eV^{-1}\;cm^{-2}$), The reverse I-V characteristics showed more variation, hut there was no systematic difference for any of the passivation films, The results suggest that simple PECVD processes are effective for providing robust surface protection for InGaN/GaN LEDs.

• Journal of the Korean Institute of Telematics and Electronics D
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• 제36D권5호
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• pp.21-28
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• 1999

A new method of making high speed self-aligned ESD (Elevated Source/Drain) MOSFET is proposed. Different from the conventional LDD (Lightly-Doped Drain) structure, the proposed ESD structure needs only one ion implantation step for the source/drain junctions, and makes it possible to modify the depth of the recessed channel by use of dry etching process. This structure alleviates hot-carrier stress by use of removable nitride sidewall spacers. Furthermore, the inverted sidewall spacers are used as a self-aligning mask to solve the self-align problem. Simulation results show that the impact ionization rate ($I_{SUB}/I_{D}$) is reduced and DIBL (Drain Induced Barrier Lowering) characteristics are improved by proper design of the structure parameters such as channel depth and sidewall spacer width. In addition, the use of removable nitride sidewall spacers also enhances hot-carrier characteristics by reducing the peak lateral electric field in the channel.

• New & Renewable Energy
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• 제9권2호
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• pp.30-39
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• 2013

Multi-crystalline silicon solar cells is not exist a specific crystal direction different from single crystalline silicon solar cells. In functional materials, therefore, isotropic wet etching of mc-Si solar cell is easy the acid solution rather than the alkaline solution. The reflectance of wet texturing process is about 25% and the reflectance of RIE texturing process is achieved less than 10%. In addition, wet texturing has many disadvantages as well as reflectance. So wet texturing process has been replaced by a RIE texturing process. In order to apply BIPV, RIE and wet textured multi-crystalline silicon solar cell modules was manufactured by different kind of EVA sheet. Moreover, in case of BIPV, the short circuit current characteristics according to the angle of incidence is more important, because the installation of BIPV is fixed location. In this study, we has measured SEM image and I-V curve of RIE and wet textured silicon solar cell and PV module. Also we has analyzed quantum efficiency characteristics of RIE and wet textured silicon solar cell for PV modules depending on incidence angle.

• Journal of the Korean Vacuum Society
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• 제7권4호
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• pp.397-402
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• 1998

$SiO_2$ etch characteristics were studied as a function of the basic parameters, such as the main RF power and the operating pressure in a helicon plasma. $SiO_2$ etch characteristics were improved as the main RF power was increased and the operating pressure was decreased. $SiO_2$ etch selectivity over silicon increased from 2.9 to 25.33 when the RF input power increased from 300 W to 2 kW and from 2.3 to 16.21 when the operating pressure decreased from 10 mTorr to 1.5 mTorr with $C_4F_8$ plasma. We used a quadrupole mass spectrometer to measure the relative abundancies of various ionic and radical species to explain the experimental results and found that when the operating pressure is low and the RF input power is high, the highly selective $SiO_2$ etch is achieved as a result of density increment of the densities of various ionic species.

• Transactions of the Korean Society of Mechanical Engineers A
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• 제36권2호
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• pp.173-178
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• 2012

Currently, active research is being performed on printing of electronic devices such as RFID devices, flexible displays, solar cells, and e-paper. This technique has several advantages over existing technologies such as lithography and etching. In particular, RFID devices, flexible displays, solar cells, and e-paper require flexibility and a mass production system. Thus, attention is being focused on the roll-to-roll process. High quality should be guaranteed in the roll-to-roll printed electronics systems, and good thickness and roughness qualities must be ensured. Experimental design was applied to this problem to analyze the main effects and interaction effects of various factors. Matching technology between the nip roll characteristics and the quality of the print pattern in roll-to-roll printed electronics systems was proposed to improve the printing quality.

• Korean Chemical Engineering Research
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• 제54권4호
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• pp.459-464
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• 2016

In this study, the electrochemical characteristics of porous silicon/carbon composite anode were investigated to improve the cycle stability and rate performance in lithium ion batteries. In this study, the effect of TEOS and $NH_3$ concentration, mixing speed and temperature on particle size of nano silica was investigated using $St{\ddot{o}}ber$ method. Nano porous Si/C composites were prepared by the fabrication processes including the synthesis of nano $SiO_2$, magnesiothermic reduction of nano $SiO_2$ to obtain nano porous Si by HCl etching, and carbonization of phenolic resin. Also the electrochemical performances of nano porous Si/C composites as the anode were performed by constant current charge/discharge test, cyclic voltammetry and impedance tests in the electrolyte of $LiPF_6$ dissolved inorganic solvents (EC:DMC:EMC=1:1:1vol%). It is found that the coin cell using nano porous Si/C composite has the capacity of 2,006 mAh/g and the capacity retention ratio was 55.4% after 40 cycle.

• Proceedings of the KIEE Conference
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.863-866
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• 1999

(Ba,Sr)$TiO_3$ thin films have attracted groat interest as new dielectric materials of capacitors for ultra-large-scale integrated dynamic random access memories (ULSI-DRAMs) such as 1 Gbit or 4 Gbit. In this study, inductively coupled $BCl_3/Cl_2$/Ar plasmas was used to etch (Ba,Sr)$TiO_3$ thin films. RF power/dc bias voltage = 600 W/-250 V and chamber pressure was 10 mTorr. The $Cl_2/(Cl_2+Ar)$ was fixed at 0.2, the (Ba,Sr)$TiO_3$ thin films were etched adding $BCl_3$. The highest (Ba,Sr)$TiO_3$ etch rate is 480$\AA/min$ at 10 % $BCl_3$ adding to $Cl_2$/Ar. The characteristics of the plasmas were estimated using optical emission spectroscopy (OES). The change of Cl, B radical density measured by OES as a function of $BCl_3$ percentage in $Cl_2$/Ar. The highest Cl radical density was shown at the addition of 10% $BCl_3$ to $Cl_2$/Ar. To study on the surface reaction of (Ba,Sr)$TiO_3$ thin films was investigated by XPS analysis. Ion enhancement etching is necessary to break Ba-O bond and to remove $BaCl_2$. There is a little chemical reaction between Sr and Cl, but Sr is removed by physical sputtering. There is a chemical reaction between Ti and Cl, and Tic14 is removed with ease. The cross-sectional of (Ba,Sr)$TiO_3$ thin film was investigated by scanning electron microscopy (SEM), the etch slope is about $65\;{\sim}\;70$.

• Journal of the Korean Vacuum Society
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• 제6권1호
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• pp.91-96
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• 1997

The electrical characteristics and the plasma parameters of planar inductively coupled plasmas (ICP) have been measured. The resistance of the total load including the coil and the plasma varied from 1 to 4 W and the inductance from 1.5 m to 2 mH when the power was changed from 100 to 1000 W and the pressure from 1 to 10 mTorr. The density of electron measured by Langmuir probe was over $10^{11}/\textrm{cm}^3$ and the temperature varied between 3 and 5 eV as the process conditions were changed. Bias modulation was adopted as a new method to improve the selectivity of $SiO_2$on Si in $C_4F_8$ (octafluorocyclobutane) plasma. The selectivity was improved as the duty ratio decreased, but the etch rate of $SiO_2$decreased below 400$\AA$/min. $H_2$addition to $C_4F_8$ plasma showed that the etch selectivity could be higher than 50 and the etch rate of $SiO_2$over 2000$\AA$/min when 60% $H_2$was added.

• Journal of Sensor Science and Technology
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• 제9권1호
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• pp.9-14
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• 2000

Dielectric characteristics of P(VDF/TrFE) film manufactured using spin coating technique have been investigated. To improve the crystallinity and quality of film, the film was three step annealed. Simple etching process and conditions for P(VDF/TrFE) film were established using top electrode as a mask. Poling is performed by several steps. $1.87\;{\mu}m$ thick P(VDF/TrFE) films were obtained with conditions such that the solution of 10 wt% concentration was spun at 3000rpm for 30 seconds. Before poling, dielectric constant and dielectric loss of P(VDF/TrFE) film were 13.5 and 0.042, respectively. After poling, dielectric constant and dielectric loss of P(VDF/TrFE) film were 11.5 and 0.037, respectively.

• Corrosion Science and Technology
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• 제2권3호
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• pp.117-126
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• 2003

Due to excellent corrosion resistance and mechanical properties, austenitic stainless steel is widely used as the material for chemical plants. nuclear power plants, and food processing facilities. But, the zone affected by heat in the range of 400 to $800^{\circ}C$ during welding loses corrosion resistance and tensile strength since Cr-carbide precipitation like $Cr_{23}C_6$ forms at the grain boundary and thereby takes place the intergranular corrosion. In this study, AISI 304 stainless steel with the added Nb of 0.3 to 0.7 wt% was solutionized at $1050^{\circ}C$ and sensitized at $650^{\circ}C$. Specimen was welded by MIG. The phase and the microstructure of the specimens were examined by an optical microscope, a scanning electron microscope, and a x-ray diffractometer. The corrosion characteristics of specimens were tested by electrolytic etching and by double loop electrochemical potentiokinetic reactivation method(EPR) in the mixed solution of 0.5M $H_2SO_4$ + 0.01M KSCN. The melting zone had dendritic structure constituted of austenitic phase and $\delta$-ferrite phase. Cr carbide at the matrix did not appear, as Nb content increased. At the grain boundaries of the heat affected zone, the precipitates decreased and the twins appeared. The hardness increased, as Nb content increased. The hardness was highest in the order of the heat affected zone>melted zone>matrix. According to EPR curve, as the Nb content decreased, the reactivation current density(Ir) and the activation current density(la) were highest in the order of the melted zone