• Restorative Dentistry and Endodontics
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• v.37 no.1
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• pp.9-15
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• 2012

Objectives: This study evaluated the effect of 2% chlorhexidine digluconate (CHX) with different application times on microtensile bonds strength (MTBS) to dentin in class I cavities and intended to search for ideal application time for a simplified bonding protocol. Materials and Methods: Flat dentinal surfaces with class I cavities ($4mm{\times}4mm{\times}2mm$) in 40 molar teeth were bonded with etch-and-rinse adhesive system, Adper Single Bond 2 (3M ESPE) after: (1) etching only as a control group; (2) etching + CHX 5 sec + rinsing; (3) etching + CHX 15 sec + rinsing; (4) etching + CHX 30 sec + rinsing; and (5) etching + CHX 60 sec + rinsing. Resin composite was builtup with Z-250 (3M ESPE) using a bulk method and polymerized for 40 sec. For each condition, half of the specimens were immediately submitted to MTBS test and the rest of them were assigned to thermocycling of 10,000 cycles between $5^{\circ}C$ and $55^{\circ}C$ before testing. The data were analyzed using two-way ANOVA, at a significance level of 95%. Results: There was no significant difference in bond strength between CHX pretreated group and control group at the immediate testing period. After thermocycling, all groups showed reduced bond strength irrespective of the CHX use. However, groups treated with CHX maintained significantly higher MTBS than control group (p < 0.05). In addition, CHX application time did not have any significant influence on the bond strength among groups treated with CHX. Conclusion: Application of 2% CHX for a short time period (5 sec) after etching with 37% phosphoric acid may be sufficient to preserve dentin bond strength.

• The Journal of Korean Academy of Prosthodontics
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• v.51 no.1
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• pp.20-26
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• 2013

Purpose: The purpose of this study was to evaluate the bond strengths between the latest CAD/CAM ceramic inlay and various resin cements which are used primarily for esthetic restoration. Materials and methods: Cylindrical ceramic blocks(Height: 5 mm, diameter: 3 mm) were fabricated by using Cerec3 and bonded on the dentin of the ninety extracted caries-free molars using three different kinds of resin cement(Unicem$^{(R)}$, Biscem$^{(R)}$, and Variolink II$^{(R)}$) according to the manufacturer's instructions. Ninety specimens were divided into 3 groups according to three different kinds of resin cement. Half of each group were conducted thermocycling under the conditions of the $5-55^{\circ}C$, 5,000 cycle but the other half of them weren't. All specimens were kept in normal saline $37^{\circ}C$, for 24 hours before measuring the bond strength. The shear bond strength was measured by Universal testing machine with a cross head speed of 0.5 mm/min. The results were analyzed statistically by t-test and one-way ANOVA. Results: Unicem$^{(R)}$ group showed the highest shear bond strength despite a slight decline by thermocycling. The shear bond strength of Unicem$^{(R)}$ group and ValiolinkII$^{(R)}$ group were significantly influenced by thermocycling, whereas Biscem$^{(R)}$ group was not influenced (P<.05). There were no significant differences in the bond strength between the three groups without thermocycling, but there was significant differences between Unicem$^{(R)}$ group and Valiolink II$^{(R)}$ group with thermocycling(P<.05). Conclusion: It has been shown to be clinically effective when the self-adhesive resin cements Unicem$^{(R)}$ and Biscem$^{(R)}$ were used instead of the etch-and-rinse resin cement Valiolink II$^{(R)}$ during the bonding of CAD/CAM ceramic inlay restorations with teeth.

• Journal of Korean Dental Science
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• v.7 no.2
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• pp.49-57
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• 2014

Purpose: To evaluate the effect of different surface treatment methods (yttria-tetragonal zirconia polycrystal [Y-TZP] primers, air-abrasion, and tribochemical surface treatment) on the shear bond strength between (Y-TZP) ceramics and etch-and-rinse non-10-methacryloyloxydecyl dihydrogen phosphate (MDP)-containing resin cements. Materials and Methods: Y-TZP ceramic surfaces were ground flat with 600-grit silicone carbide abrasives paper and then divided into seven groups of ten. They were treated as the following: untreated (control), Monobond Plus (IvoclarVivadent), Z-PRIME Plus (Bisco Inc.), ESPE Sil with CoJet (3M ESPE), air-abrasion, Monobond Plus with air-abrasion, and Z-PRIME Plus with air-abrasion. The surface of Y-TZP specimens was analyzed under a scanning electron microscope (SEM). Non-MDP-containing cements were placed on the surface-treated Y-TZP specimens. After thermocycling, shear bond strength test was performed. Bond strength values were statistically analyzed using one-way analysis of variance and Student-Newman-Keuls multiple comparison test (P<0.05). Result: The Z-PRIME Plus treatment in combination with air-abrasion produced the highest bond strength ($14.94{\pm}1.70MPa$) followed by Monobond Plus combined with air-abrasion ($10.70{\pm}1.71MPa$), air-abrasion ($10.47{\pm}1.60MPa$), ESPE Sil after CoJet treatment ($10.38{\pm}0.87MPa$), Z-PRIME Plus application ($10.00{\pm}1.70MPa$), and then Monobond Plus application ($9.25{\pm}0.86MPa$). The control ($6.70{\pm}1.49MPa$) indicated the lowest results (P<0.05). The SEM results showed different surface morphologies according to surface treatment methods compared with the Y-TZP control. Conclusion: The shear bond strength between the Y-TZP ceramic and the non-MDP-containing resin cement was the greatest when the surface was treated with air-abrasion and MDP-containing Z-PRIME Plus primer.

• Korean Journal of Dental Materials
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• v.45 no.4
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• pp.301-310
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• 2018

The purpose of this study is to evaluate the compatibility of universal adhesives with two dual-cured resin cements. Eighty human molars were divided into eight groups. Tooth was embedded in self-curing acrylic resin and sectioned horizontally to exposure dentine surface. After polishing with 600-grit SiC paper, adhesives were applied. All-Bond Universal (Bisco), G-premio bond (GC), Scotch-bond universal (3M ESPE), Scotch-bond Multipurpose (3M ESPE) were used in this study. Calibra (Dentsply) as a conventional dual-curing resin cement and RelyX Ultimate (3M ESPE) as an amine free resin cement were used. The adhesives and the cements were applied according to the manufacturer's instructions. Final specimens were cylinder (diameter 2mm, height 3mm) shape. After storing in distilled water at $37^{\circ}C$ for 7 days the shear bond strength (SBS) test was performed. There was no significant difference in shear bond strength between the adhesives when RelyX Ultimate was used (p>0.05). However, when Calibra used with Scotch-bond Multipurpose and All-Bond Universal were used, statistically higher SBS was observed, as compared to the groups which Calibra cements with G-premio bond and Scotch-bond universal adhesive (p<0.05) were used. Within the limitations of this study, RelyX Ultimate resin cement was compatible with universal adhesives of various pH. All-Bond Universal adhesive was compatible with a resin cement containing the tertiary amine.

• Restorative Dentistry and Endodontics
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• v.33 no.1
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• pp.9-19
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• 2008

The purpose of this study was: (1) to compare nanoleakage patterns of a conventional 3-step etch and rinse adhesive system and two experimental hydrophobic adhesive systems and (2) to investigate the change of the nanoleakage patterns after load cycling. Two kinds of hydrophobic experimental adhesives, ethanol containing adhesive (EA) and methanol containing adhesive (MA), were prepared. Thirty extracted human molars were embedded in resin blocks and occlusal thirds of the crowns were removed. The polished dentin surfaces were etched with a 35 % phosphoric acid etching gel and rinsed with water. Scotchbond Multi-Purpose (MP), EA and MA were used for bonding procedure. Z-250 composite resin was built-up on the adhesive-treated surfaces. Five teeth of each dentin adhesive group were subjected to mechanical load cycling. The teeth were sectioned into 2 mm thick slabs and then stained with 50 % ammoniacal silver nitrate. Ten specimens for each group were examined under scanning electron microscope in backscattering electron mode. All photographs were analyzed using image analysis software. Three regions of each specimen were used for evaluation of the silver uptake within the hybrid layer. The area of silver deposition was calculated and expressed in gray value. Data were statistically analyzed by two-way ANOVA and post-hoc testing of multiple comparisons was done with the Scheffe's test. Silver particles were observed in all the groups. However, silver particles were more sparsely distributed in the EA group and the MA group than in the MP group (p < .0001). There were no changes in nanoleakage patterns after load cycling.

• Journal of Dental Rehabilitation and Applied Science
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• v.29 no.1
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• pp.37-44
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• 2013

Sodium hypochlorite and ethylene diamine tetra acetic acid are substances usually used during endodontic treatment. Several studies found that the bonding was negated with certain irrigants and some of the used irrigants have demineralizing and chealating effects, so it was advocated to omit the etching step in etch and rinse adhesive systems. The purpose of this in vitro study was to evaluate the influence of NaOCl & EDTA on the bonding strength of ethanol wet bonding. Thirty human molars were selected and mesiodistally sectioned into halves, thus providing sixty specimens. The specimens were randomly assigned to 4 groups(n=15) according to the irrigant regimen used : (1) irrigated with distilled water for 10min (control); (2) irrigated with 5.25% NaOCl(10min), flushed with 5.25% NaOCl(1min) (3) irrigated with 5.25% NaOCl, flushed with 17% EDTA (4) irrigated with 5.25% NaOCl, flushed with 17% EDTA. Each group was acid-etched with 37% phosphoric acid(except group 4) and had their dentin surfaces dehydrated with ethanol solutions : 50%, 70%, 80%, 95%, 3x100%, 30s for each application. After dehydration, a primer( 50% all bond 3 resin + 50% ethanol) was used, followed by the adhesive(ALL-BOND 3 RESIN) application. Resin composite build-ups were then prepared using an incremental technique. Specimens were sectioned into beams and submitted to a tensile load using a Micro Tensile Tester(Bisco Inc.). The data were statistically analyzed using one-way ANOVA and Tukey HSD at p<0.5 level. There was no significant difference on G1(control) and G2(irrigated with NaOCl only ). (p>0.05). G3(flushed with EDTA) showed significantly high tensile bonding strength compared to the G2 (p<0.05). G4( treated with EDTA but no acid-etching) was significantly lower value than G3. (p<0.05) Although there was no significant difference, 5.25% NaOCl seemed to have an adverse effect on the bonding strength of ethanol wet bonding. The flushing with EDTA after NaOCl irrigation prevents the decrease of bonding strength. The use of 17% EDTA as a final flush can enhance the bonding strength but EDTA flushing can't substitute for a acid-etching.

• Korean Chemical Engineering Research
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• v.53 no.5
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• pp.557-564
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• 2015

The previous etching, rinsing and drying processes of wafers for MEMS (microelectromechanical system) using SC-$CO_2$ (supercritical-$CO_2$) consists of two steps. Firstly, MEMS-wafers are etched by organic solvent in a separate etching equipment from the high pressure dryer and then moved to the high pressure dryer to rinse and dry them using SC-$CO_2$. We found that the previous two step process could be applied to etch and dry wafers for MEMS but could not confirm the reproducibility through several experiments. We thought the cause of that was the stiction of structures occurring due to vaporization of the etching solvent during moving MEMS wafer to high pressure dryer after etching it outside. In order to improve the structure stiction problem, we designed a continuous process for etching, rinsing and drying MEMS-wafers using SC-$CO_2$ without moving them. And we also wanted to know relations of states of carbon dioxide (gas, liquid, supercritical fluid) to the structure stiction problem. In the case of using gas carbon dioxide (3 MPa, $25^{\circ}C$) as an etching solvent, we could obtain well-treated MEMS-wafers without stiction and confirm the reproducibility of experimental results. The quantity of rinsing solvent used could be also reduced compared with the previous technology. In the case of using liquid carbon dioxide (3 MPa, $5^{\circ}C$, we could not obtain well-treated MEMS-wafers without stiction due to the phase separation of between liquid carbon dioxide and etching co-solvent(acetone). In the case of using SC-$CO_2$ (7.5 Mpa, $40^{\circ}C$), we had as good results as those of the case using gas-$CO_2$. Besides the processing time was shortened compared with that of the case of using gas-$CO_2$.