• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 학술회의 논문집 정보 및 제어부문 A
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• pp.291-294
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• 2003

In this paper, 2D and 3D inspection algorithm for printed solder on PCB is introduced. The aim of inspection is the detection of error such as rich solder poor solder and missing solder. For Inspection, laser distance sensor is used. For 2D inspection, laser image that is created by normalizing laser data between 0 and 255 are used. Reference Image is made using gerber file. Image processing algorithm is used for 2D inspection. By adding thickness of metal stencil to laser image, volume for solder can be calculated and 3D inspection is carried out.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 추계종합학술대회 논문집
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• pp.507-510
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• 1999

Inspection of BGAs presents several challenges for modem measurement equipment. No only must these systems be fast and accurate, they must deal with the special challenges presented by very small shiny metal spheres. For accurate measurement, we propose an algorithm which fits for estimating the accurate ball height using 2-D curve-fitting algorithm. The real boundary between two adjacent pixels and the real ball diameter are measured with subpixel accuracy Experimental results show that the proposed method calculates the ball height and diameter with subpixel accuracy and is robust in local noise with low measurement error.

• 제어로봇시스템학회논문지
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• 제15권9호
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• pp.916-921
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• 2009

The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(4)
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• pp.223-226
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• 2000

In this paper, we report detects system algorithm, adapted a perimetric mask and a generalized symmetry system, to detect a transformable material and find out a minute error cannot be noticed by a naked eye. In this thesis, supposed a stable detecting system applied a general image processing theory and perimetric mash algorithm to detect badness. And finally, detected some vague errors with the application of symmetry transform algorithm that accumulate a symmetry of minute error and put stress on it.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1996년도 춘계학술대회 논문집
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• pp.24-29
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• 1996

The seniconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip effect on the functions of the semiconductors. The defects of the chip surface is crack or void. Because general inspection method requires many inspection processes, the inspection system which searches immediately and preciselythe defects of the semiconductor chip surface. We propose the inspection method by using the computer vision system. This study presents an image processing algorithm for inspecting the surface defects(crack, void)of the semiconductor test samples. The proposed image processing algorithm aims to reduce inspection time, and to analyze those experienced operator. This paper regards the chip surface as random texture, and deals with the image modeling of randon texture image for searching the surface defects. For texture modeling, we consider the relation of a pixel and neighborhood pixels as noncasul model and extract the statistical characteristics from the radom texture field by using the 2D AR model(Aut oregressive). This paper regards on image as the output of linear system, and considers the fidelity or intelligibility criteria for measuring the quality of an image or the performance of the processing techinque. This study utilizes the variance of prediction error which is computed by substituting the gary level of pixel of another texture field into the two dimensional AR(autoregressive model)model fitted to the texture field, estimate the parameter us-ing the PAA(parameter adaptation algorithm) and design the defect detection filter. Later, we next try to study the defect detection search algorithm.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2005년도 춘계학술대회논문집
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• pp.437-442
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• 2005

In this paper, we proposed the 2-dimensional inspection algorithm for micro-BGA(Ball Grid Array) device using a vision system. The proposed method uses the subpixel algorithm for high precision. The proposed algorithm preferentially extracts the package area of device in the input image. After the extraction of package area, each ball areas are extracted by ball search window method. The parameters for inspection are calculated for the extracted ball area. In the simulation results, we have the average error within $17{\mu}m$.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.140.2-140
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• 2001

In this paper, we develop the system which inspects the metal mask using area scan camera and belu type xy-table and introduce its inspection algorithm. Thes whole area of the metal mask is divides into several inspection block and the sixe of a inspection block is decided by FOV(Field of View). To compare with the camera image of each block, the reference image is made by gerber file. The ratation angle of the metal mask is calculated through the linear equation that is substituted two end points of horizontal boundary of a specific hole in a camera image for. To calculate the position error caused by belt type xy-table, hough-transform using the distances among the holes in two images os used. The center of the reference image is moved as much as the calculated position error to be coincide with the camera image ...

• 한국정밀공학회지
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• 제14권11호
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• pp.84-92
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• 1997

The purpose of this study is to develop a geometric error model and path compensation algorithm for rotating axes of the 5-axis machine tools, by a method to calibrate a rotary table using one master ball and three LVDTs. It was developed a new methodology to measure 3 translation errors of the rotary table and with a compensation procedure for setup errors of the master ball. The method is experimentally verified using a ball-table and on-machine inspection method. The results showed that the geometric error models with the path compensation strategy can be practically used as a means for improving the accuracy of the machine tools with rotary table.

• 제어로봇시스템학회논문지
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• 제20권10호
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• pp.1030-1035
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• 2014

Machine vision inspection systems have replaced human inspectors in defect inspection fields for several decades. However, the inspection results of machine vision are often affected by small changes of illumination. When small changes of illumination appear in image histograms, the influence of illumination can be decreased by transformation of the histogram. In this paper, we propose an enhanced histogram matching algorithm which corrects distorted histograms by variations of illumination. We use the resolution resizing method for an optimal matching of input and reference histograms and reduction of quantization errors from the digitizing process. The proposed algorithm aims not only for improvement of the accuracy of defect detection, but also robustness against variations of illumination in machine vision inspection. The experimental results show that the proposed method maintains uniform inspection error rates under dramatic illumination changes whereas the conventional inspection method reveals inconsistent inspection results in the same illumination conditions.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.444-449
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• 1996

The semiconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip affect on the functions of the semiconductors. The defects of the chip surface are cracks or voids. As general inspection method requires many inspection procedure, the inspection system which searches immediately and precisely the defects of the semiconductor chip surface is required. We suggest the detection algorithm for inspecting the surface defects of the semiconductor surface. The proposed algorithm first regards the semiconductor surface as random texture and point spread function, and secondly presents the character of texture by linear estimation theorem. This paper assumes that the gray level of each pixel of an image is estimated from a weighted sum of gray levels of its neighbor pixels by linear estimation theorem. The weight coefficients are determined so that the mean square error is minimized. The obtained estimation window(two-dimensional estimation window) characterizes the surface texture of semiconductor and is used to discriminate the defects of semiconductor surface.