Optimal Design for Cushioning Package of a Heavy Electronic Product using Mechanical Drop Analysis (낙하충격해석을 통한 대형 전자제품의 완충포장재 최적설계)
-
- Proceedings of the Korean Society for Noise and Vibration Engineering Conference
- /
- 2003.11a
- /
- pp.677-683
- /
- 2003