• Korean Journal of Materials Research
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• 제28권12호
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• pp.748-757
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• 2018

Inorganic semiconductor compounds, e.g., CIGS and CZTS, are promising materials for thin film solar cells because of their high light absorption coefficient and stability. Research on thin film solar cells using this compound has made remarkable progress in the last two decades. Vacuum-based processes, e.g., co-evaporation and sputtering, are well established to obtain high-efficiency CIGS and/or CZTS thin film solar cells with over 20 % of power conversion. However, because the vacuum-based processes need high cost equipment, they pose technological barriers to producing low-cost and large area photovoltaic cells. Recently, non-vacuum based processes, for example the solution/nanoparticle precursor process, the electrodeposition method, or the polymer-capped precursors process, have been intensively studied to reduce capital expenditure. Lately, over 17 % of energy conversion efficiency has been reported by solution precursors methods in CIGS solar cells. This article reviews the status of non-vacuum techniques that are used to fabricate CIGS and CZTS thin films solar cells.

• Tribology and Lubricants
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• 제37권6호
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• pp.213-223
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• 2021

Electrochemical mechanical planarization (ECMP) was developed to overcome the shortcomings of conventional chemical mechanical planarization (CMP). Because ECMP technology utilizes electrochemical reactions, it can have a higher efficiency than CMP even under low pressure conditions. Therefore, there is an advantage in that it is possible to reduce dicing and erosions, which are physical defects in semiconductor CMP. This paper summarizes the papers on ECMP published from 2003 to 2021 and analyzes research trends in ECMP technology. First, the material removal mechanisms and the configuration of the ECMP machine are dealt with, and then ECMP research trends are reviewed. For ECMP research trends, electrolyte, processing variables and pads, tribology, modeling, and application studies are investigated. In the past, research on ECMP was focused on basic research for the development of electrolytes, but it has recently developed into research on tribology and process variables and on new processing systems and applications. However, there is still a need to increase the processing efficiency, and to this end, the development of a hybrid ECMP processing method using another energy source is required. In addition, ECMP systems that can respond to the developing metal 3D printing technology must be researched, and ECMP equipment technology using CNC and robot technology must be developed.

• Journal of the Korean Society of Industry Convergence
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• 제26권1호
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• pp.105-112
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• 2023

We analyze the global market for flexible electronic circuits, technical considerations, and analyze the market for application areas and regions. In the market analysis of the application field, the display field has the greatest influence in terms of market size and annual growth rate, and the OLE D lighting market size is expected to grow by nearly 50% in 2026. The multilayer flexible electronics, which dependently requires the semiconductor technology, has a larger market size than other structures and its growth rate is relatively large, leading the market and will be further analyzed in depth. The market size of multilayer flexible electronics applied to display field is expected to show an annual growth rate of 21.1% from $2.7 billion in 2017 to $9.8 billion in 2026, and the OLED market is expected to grow by 75.2% during the same periods. Recently, as electronic products have been miniaturized and advanced, and robust installation in a small space is required, companies that preoccupy multilayer structure or rigid flexible electronic circuit technology have an advantage in competitiveness, so many companies are trying to obtain this technology. These efforts are systematically supported by many countries because they can achieve mutual growth by strengthening the competitiveness of the application field and the same industry. In the case of Korea, a support system is established, but it is required to expand and activate it, and to localize manufacturing equipment and materials.

• The Journal of Society for e-Business Studies
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• 제24권3호
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• pp.19-33
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• 2019

Recently, manufacturers have been struggling to efficiently use production equipment as their production methods become more sophisticated and complex. Typical factors hindering the efficiency of the manufacturing process include setup cost due to job change. Especially, in the process of using expensive production equipment such as semiconductor / LCD process, efficient use of equipment is very important. Balancing the tradeoff between meeting the deadline and minimizing setup cost incurred by changes of work type is crucial planning task. In this study, we developed a scheduling model to achieve the goal of minimizing the duedate and setup costs by using reinforcement learning in parallel machines with duedate and work preparation costs. The proposed model is a Deep Q-Network (DQN) scheduling model and is a reinforcement learning-based model. To validate the effectiveness of our proposed model, we compared it against the heuristic model and DNN(deep neural network) based model. It was confirmed that our proposed DQN method causes less due date violation and setup costs than the benchmark methods.

• Asia pacific journal of information systems
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• 제20권3호
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• pp.191-204
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• 2010

Recently, the CO2 emission and energy consumption have become critical global issues to decide the future of nations. Especially, the spread of IT products and the increased use of internet and web applications result in the energy consumption and CO2 emission of IT industry though information technologies drive global economic growth. EU, the United States, Japan and other developed countries are using IT related environmental regulations such as WEEE(Waste Electrical and Electronic Equipment), RoHS(Restriction of the use of Certain Hazardous Substance), REACH(Registration, Evaluation, Authorization and Restriction of CHemicals) and EuP(Energy using Product), and have established systematic green business/IT strategies to enhance the competitiveness of IT industry. For example, the Japan government proposed the "Green IT initiative" for being compatible with economic growth and environmental protection. Not only energy saving technologies but energy saving systems have been developed for accomplishing sustainable development. Korea's CO2 emission and energy consumption continuously have grown at comparatively high rates. They are related to its industrial structure depending on high energy-consuming industries such as iron and steel Industry, automotive industry, shipbuilding industry, semiconductor industry, and so on. In particular, export proportion of IT manufacturing is quite high in Korea. For example, the global market share of the semiconductor such as DRAM was about 80% in 2008. Accordingly, Korea needs to establish a systematic strategy to respond to the global environmental regulations and to maintain competitiveness in the IT industry. However, green competitiveness of Korea ranked 11th among 15 major countries and R&D budget for green technology is not large enough to develop energy-saving technologies for infrastructure and value chain of low-carbon society though that grows at high rates. Moreover, there are no concrete action plans in Korea. This research aims to deduce the priorities of the Korean green business/IT strategies to use multi attribute weighted average method. We selected a panel of 19 experts who work at the green business related firms such as HP, IBM, Fujitsu and so on, and selected six assessment indices such as the urgency of the technology development, the technology gap between Korea and the developed countries, the effect of import substitution, the spillover effect of technology, the market growth, and the export potential of the package or stand-alone products by existing literature review. We submitted questionnaires at approximately weekly intervals to them for priorities of the green business/IT strategies. The strategies broadly classify as follows. The first strategy which consists of the green business/IT policy and standardization, process and performance management and IT industry and legislative alignment relates to government's role in the green economy. The second strategy relates to IT to support environment sustainability such as the travel and ways of working management, printer output and recycling, intelligent building, printer rationalization and collaboration and connectivity. The last strategy relates to green IT systems, services and usage such as the data center consolidation and energy management, hardware recycle decommission, server and storage virtualization, device power management, and service supplier management. All the questionnaires were assessed via a five-point Likert scale ranging from "very little" to "very large." Our findings show that the IT to support environment sustainability is prior to the other strategies. In detail, the green business /IT policy and standardization is the most important in the government's role. The strategies of intelligent building and the travel and ways of working management are prior to the others for supporting environment sustainability. Finally, the strategies for the data center consolidation and energy management and server and storage virtualization have the huge influence for green IT systems, services and usage This research results the following implications. The amount of energy consumption and CO2 emissions of IT equipment including electrical business equipment will need to be clearly indicated in order to manage the effect of green business/IT strategy. And it is necessary to develop tools that measure the performance of green business/IT by each step. Additionally, intelligent building could grow up in energy-saving, growth of low carbon and related industries together. It is necessary to expand the affect of virtualization though adjusting and controlling the relationship between the management teams.

• ETRI Journal
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• 제42권4호
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• pp.480-490
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• 2020

More than 42 000 fires occur nationwide and cause over 2500 casualties every year. There is a lack of specialized equipment, and rescue operations are conducted with a minimal number of apparatuses. Through-the-wall radars (TTWRs) can improve the rescue efficiency, particularly under limited visibility due to smoke, walls, and collapsed debris. To overcome detection challenges and maintain a small-form factor, a TTWR system-on-chip (SoC) and its architecture have been proposed. Additive reception based on coherent clocks and reconfigurability can fulfill the TTWR demands. A clock-based single-chip infrared radar transceiver with embedded control logic is implemented using a 130-nm complementary metal oxide semiconductor. Clock signals drive the radar operation. Signal-to-noise ratio enhancements are achieved using the repetitive coherent clock schemes. The hand-held prototype radar that uses the TTWR SoC operates in real time, allowing seamless data capture, processing, and display of the target information. The prototype is tested under various pseudo-disaster conditions. The test standards and methods, developed along with the system, are also presented.

• KSII Transactions on Internet and Information Systems (TIIS)
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• 제7권5호
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• pp.1014-1035
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• 2013

With recent advances in wireless communication and low-power miniaturized biomedical sensor and semiconductor technologies, wireless body area networks (WBAN) has become an integral part of the disaster aid system. Wearable vital sign sensors can track patients' status and location, thus enhancing disaster rescue efficiency. In the past few years, most of the literatures in the area of disaster aid system based on WBAN have focused on issues concerning wireless sensor design, sensor miniaturization, energy efficiency and communication protocols. In this paper, we will give an overview of disaster aid, discuss about the types of network communication as well as outline related issues. We will emphasize on analyzing six key issues in employing the disaster aid system. Finally, we will also highlight some of the challenges that still need to be addressed in the future in order to help the disaster aid system be truly and widely accepted by the public.

• Journal of the Korean Graphic Arts Communication Society
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• 제28권1호
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• pp.51-63
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• 2010

Ink-jet is part of the non impact printing that shooting the ink drop from the nozzle to paper. It is very silence and express good color. There are two types of printing that continuous and drop on demand. But drop on demand process is becoming the mainstream. these days, LCD, PDP is passed more than semiconductor industry. And we expect organic EL, FED as a next display. But product equipment, main component and technology have a gap between an advanced country and us nevertheless physical development. Expecially, previous process part is depended on imports. Ink-jet printing technology that there isn't complicated photo lithography process is attracted, so ink-jet printing resolution is more embossed. But there were not many of ink-jet resolution thesis but ink-jet head or nozzle. Because, to out of the ink from the nozzle is unseeable and hard to experiment. Therefore this thesis was experimented and simulated how can ink-jet printer improved resolution by flow-3d simulation package program.

• Journal of the Institute of Electronics Engineers of Korea SD
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• 제45권8호
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• pp.11-16
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• 2008

In this paper, firstly we made of the rapid thermal processor equipment with the specifically useful structure to measure wafer stress. Secondly we made of the laser interferometry to inspect the wafer surface curvature based on the large deformation theory. And then the wafer surface fringe image was obtained by experiment, and the full field stress distribution of wafer surface comes into view by signal processing with thining and pitch mapping. After wafer was ground by 1mm and polished from the back side to get easily deformation, and it was heated by three to four times thermal treatments at about 1000 degree temperature. Finally the severe deformation between wafer before and after the heat treatment was shown.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.228-232
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• 2002

The rise throughput and the stability in the device fabrication can be obtained by applying chemical mechanical polishing(CMP) process in 0.18 ${\mu}m$ semiconductor device. However it does have various problems due to the CMP equipment. Especially, among the CMP components, process variables are very important parameters in determining removal rate and non-uniformity. In this paper, We studied the DOE(design of experiment) method for the optimized CMP process. Various process variations, such as table and head speed, slurry flow rate and down force, have investigated in the viewpoint of removal rate and non-uniformity. Through the above DOE results, we could set-up the optimal process parameters.