• 제목/요약/키워드: Equilibrium contact angle

검색결과 32건 처리시간 0.025초

Finite Element Analysis of Electrical Double Layers near Triple Contact Lines

  • Kang Kwan Hyoung;Kang In Seok;Lee Choung Mook
    • 대한기계학회:학술대회논문집
    • /
    • 대한기계학회 2002년도 학술대회지
    • /
    • pp.491-494
    • /
    • 2002
  • To assess the electrostatic interaction of surfaces at the triple contact line, the electrostatic field is analyzed by using the finite element method. The Helmholtz free energy is used as a functional which should be minimized under an equilibrium condition. The numerical results are compared with the nonlinear analytical solution for a two-dimensional charged interface and linear solution for a wedge shaped geometry, which shows fairly good agreement. The method is applied to the analysis of electrostatic influence on the contact angle on a charged substrate. The excess free energy found to increase drastically as the contact angle approaches to zero. This excess free energy Plays an opposite role to the Primary electrocapillary effect, as the contact angle gets smaller. This enables an alternative explanation for the contact-angle saturation phenomenon occurring in electrical control of surface tension and contact angle.

  • PDF

접촉각 측정에 의한 표면의 특성연구( II ) -섬유나 막대의 직경이 접촉각에 미치는 영향- (Characterization of Surfaces by Contact Angle Goniometry - II . Effect of Curvature on Contact Angle -)

  • 박정희
    • 한국의류학회지
    • /
    • 제15권4호
    • /
    • pp.437-445
    • /
    • 1991
  • The effect of diameter of rods or fibers on contact angle was studied in a vertical rod configuration. A contact angle measuring device described in the previous paper was optimized for the measurement of small-diameter fibers. It was shown that contact angles of water and hexadecane on nylon 6 monofilsments and glass rods increased with decrease of diameter below a critical diameter, which varied from one system to another. Beyond the critical value, contact angle of the liquid on the vertical glass rod reached to an equilibrium value which is equal to the unique value of the contact angle of the liquid drop on the horizontal glass plate.

  • PDF

평판 위에서 움직이는 물방울에 대한 분자동역학 시뮬레이션 (A molecular dynamics simulation for the moving water droplet on a solid surface)

  • 홍승도;하만영
    • 대한기계학회:학술대회논문집
    • /
    • 대한기계학회 2008년도 추계학술대회A
    • /
    • pp.1891-1895
    • /
    • 2008
  • Water covers 70% of the earth's surface and the human body consist of 75% of it. It is clear that water is one of the prime elements responsible for life on earth. Over the last 30 years or so, numerous studies have attempted to find out more about the water microscopically. In this paper, we investigated how the receding and advancing contact angle of the moving water droplet changes on a solid surface having various LJ epsilon parameters. To observe the dynamic contact angle history, a body force applied to all water molecules after obtained the water droplet in equilibrium with the solid surface. We obtained the density profile and receding and advancing contact angle of the moving water droplet

  • PDF

주기적 줄무늬 구조물 위의 물 액적에 관한 연구 (A Study for the Water Droplet on a Stripe-patterned Surface)

  • 최호진;홍승도;하만영;윤현식
    • 설비공학논문집
    • /
    • 제22권2호
    • /
    • pp.64-69
    • /
    • 2010
  • We investigated the variation in contact angle of a nano-sized water droplet on a nano stripe-patterned surface using molecular dynamics simulation. By changing the height and width of the stripe pillar, and the gap width of the stripes, we observed the contact angle of water droplet in equilibrium. When the surface energies were 0.1 and 0.3 kcal/mol, the calculated contact angles were in good agreement with the Cassie and Baxter equation. However, when the surface energy is 0.5 kcal/mol, the contact angles are observed to be perturbed along the Cassie and Baxter equation.

비등점의 가열 표면에서 나노유체 액적의 증발 특성 (Characteristics for Nanofluid Droplet Evaporation on Heated Surface at Boiling Temperature of Base Liquid)

  • 김대윤;정정열;이성혁
    • 한국분무공학회지
    • /
    • 제20권4호
    • /
    • pp.236-240
    • /
    • 2015
  • This study aims to experimentally investigate the evaporation characteristics of nanofluid droplet on heated surface at boiling temperature of DI-water. In particular, textured surface was used to examine the effect of wettability on evaporation. At the initial stage of evaporation process, dynamic contact angle (DCA) of nanofluid droplet with 0.01 vol.% concentration on textured surface rapidly increased over its equilibrium contact angle by generated large bubble inside the droplet due to lower wettability. However, contact angle of nanofluid droplet with higher concentration on textured surface decreased with surface tension. In addition, total evaporation time of droplet on textured surface was considerably delayed due to reduction of contact area between droplet and solid surface. Thus, evaporation characteristics were highly affected by the nanofluid concentration and surface wettability.

A Study on the Comparison of Solderability Assessment

  • Salam, B.;Ekere, N.N.;Jung, J.P.
    • 한국표면공학회지
    • /
    • 제35권2호
    • /
    • pp.129-137
    • /
    • 2002
  • The purpose of solderability assessment is to predict the effectiveness of soldering process. It is important for companies pursuing zero defects manufacturing because poor solderability is the major cause of two third of soldering failures. The most versatile solderability method is wetting balance method. However, there exist so many indices for wettability in the wetting balance test e.g. time to reach 2/3 values of maximum wetting force, tine to reach zero wetting force, maximum withdrawal force. In this study, three solderability assessment methods, which were the maximum withdrawal force, the wetting balance and the dynamic contact angle (DCA), were evaluated by comparing each other. The wetting balance technique measures the solderability by recording the forces exerted from the specimen after being dipped into the molten solder. Then the force at equilibrium state can be used to calculate a contact angle, which is known as static contact angles. The DCA measures contact angles occurred during advancing and withdrawing of the specimen and the contact angles are known as dynamic contact angles. The maximum withdrawal force uses the maximum force during withdrawal movement and then a contact angle can be calculated. In this study, the maximum withdrawal force method was found to be an objective index for measuring the solderability and the experiment results indicated good agreement between the maximum withdrawal force and the wetting balance method.

A Study of a Hydrophobic Surface: Comparing Pure Water and Contaminated Water

  • Ambrosia, Matthew Stanley;Lee, Chang-Han
    • 한국환경과학회지
    • /
    • 제22권4호
    • /
    • pp.407-413
    • /
    • 2013
  • The flow of sewage has been studied for hundreds of years. Reducing drag in pipes can allow sewer to be removed easily and quickly. Drag reduction is not only a macroscale issue. Physical and chemical properties of the nano-scale can affect flow at the macroscopic scale. In this paper the predictability of hydrophobicity at the nano-scale is studied. Molecular dynamics simulations were used to calculate the range of contact angles of water droplets in equilibrium on a pillared graphite surface. It was found that at a pillar height of two graphite layers there was the largest range of contact angles. It is observed that at this height the droplet begins to transition from the Wenzel state to the Cassie-Baxter state. Surfaces with larger pillar heights have much larger contact angles corresponding to a more hydrophobic surface. Silicon dioxide was also simulated in the water droplet. The contaminant slight decreased the contact angle of the water droplet.

평형해법에 의한 스탬핑 공정의 단면 해석 (Sectional analysis of stamping processes using Equilibrium approach)

  • 윤정환;유동진;송인섭;양동열;이장희
    • 한국정밀공학회지
    • /
    • 제11권4호
    • /
    • pp.58-68
    • /
    • 1994
  • An equilibrium approach is suggested as an effective tool for the analysis of sheet metal forming processes on the basis of force balance together with geometric relations and plasticity theroy. In computing a force balance equation, it is required to define a geometric curve approximating the shape of the sheet metal at any step of deformation from the geometric interaction between the die and the deforming sheet. Then the geometic informations for contacting and non-contacting sections of the sheet metal such as the number and length of both non-contact region, contact angle, and die radius of contact section are known from the geometric forming curve and utilized for optimization by force balance equation. In computation, the sheet material is assumed to be of normal amisotropy and rigid-phastic workhardening. It has been shown that there are good agreements between the equilibrium approach and FEM computation for the benchmark test example and auto-body panels whose sections can be assumed in plane-strain state. The proposed equilibrium approach can thus be used as a robust computational method in estimating the forming defects and forming severity rather quickly in the die design stage.

  • PDF

고중량의 원통형 작업대상물 파지용 집게형 그리퍼의 슬립 조건과 이를 반영한 설계 및 해석 (Slip Considered Design and Analysis Pincers-type Gripper for Seizing Heavy-weighted Cylindrical Objects)

  • 최정현;안진웅;이상문;장명언
    • 로봇학회논문지
    • /
    • 제10권4호
    • /
    • pp.193-199
    • /
    • 2015
  • This paper dealt with a pincers-type gripper being able to grip a heavy-weighted cylindrical object having various size with itself. This gripper should be designed to seize the objects without any change of jaw shape. Grasping achieved equilibrium after the object slipped on the jaw while grasping it. To cope with this situation, we suggested the slip considered gripper design procedure based on grasping equilibrium. The obtained slip condition can provide a limit friction coefficient depending on the contact angle when initiating contact between jaw and object. Consequently, the gripping force and the required actuating force can be calculated. In order to verify the proposed slip condition, the simulations were performed using a dynamic software.

二次元 切削時 칩-工具 마찰상태에 따른 剪斷角 변화 (Shear Angle Variation Depending on Chip-Tool Friction in Orthogonal Cutting)

  • 이영문;송지복
    • 대한기계학회논문집
    • /
    • 제12권2호
    • /
    • pp.252-261
    • /
    • 1988
  • 본 연구에서는 강의 2차원 적삭실험을 행하고 칩의 두께측정으로부터 구한 전단각 해에 의한 전단각 값의 비교를 통하여 이들 전단각 해의 한계성을 고찰하였으며,Zorev에 의한 제한된 전단과정과 마찰과정의 상호 의존성에 입각한 정역학적인 평형조건 과 공구경사면에 작용하는 응력분포의 가정하에서 전단각.PHI.의 새로운 해를 유도하고 이의 실현성을 검토하였다.