• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.6
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• pp.1943-1948
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• 2010

Two kind of $\beta$-SiC powders of different particle sizes (${\sim}1.7\;{\mu}m$ and ${\sim}30\;nm$), containing 7 wt% $Y_2O_3$, 2 wt% $Al_2O_3$ and 1 wt% MgO as sintering additives, were prepared by hot pressing at $1800^{\circ}C$ for 1 h under applied pressures, and then were hot-forged at $1950^{\circ}C$ for 6 h under 40 MPa in argon. All the hot-pressed specimens consisted of equiaxed grains and were developed grain growth after hot-forging. The smaller starting powder was developed the finer microstructure. The microstructures on the surfaces parallel and perpendicular to the pressing direction of the hot-forged SiC were similar to each other, and no texture development was observed because of the lack of massive $\beta$ to $\sigma$ phase transformation of SiC. The fracture toughness (${\sim}3.9\;MPa{\cdot}m^{1/2}$), hardness (~ 25.2 GPa) and flexural strength (480 MPa) of hot-forged SiC using larger starting powder were higher than those of the other.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.751-757
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• 2003

Rapid densification of a SiC-30 wt% TiC powder with additive 10 wt% A1$_2$O$_3$-Y$_2$O$_3$-CaO was conducted by Spark Plasma Sintering(SPS). The fully-densified materials can be obtain through the SPS process with very fast heating rate and short holding time. In the present work, the heating rate and applied pressure were kept to be $100^{\circ}C$/min and 40 MPa, while sintering temperature varied from $1600^{\circ}C$ to $1800^{\circ}C$ for 10 min. The full densification of SiC-30 wt% TiC composites with the addition of $Al_2$O$_3$, $Y_2$O$_3$ and CaO was achieved at the temperature above $1700^{\circ}C$ by spark plasma sintering. The XRD found that 3C-SiC and TiC were maintained the entire SPS process temperature, without phase transformation of SiC and formation of YAG phase to $1800^{\circ}C$. The microstructures of the rapidly densified SiC-30 wt% TiC composites consisted of smaller equiaxed SiC grains and larger TiC grains. The biaxial strength of 635.2 MPa and fracture toughness of 6.12 MPaㆍ$m^{1/2}$ were found for the specimen prepared at $1750^{\circ}C$.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.6 no.2
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• pp.238-246
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• 1996

High-density SiC-AIN solid solutions were fabricated from powder mixtures of $\beta$-SiC and AIN by hot-pressing in the 1870 to $2030^{\circ}C$ temperature range. The reaction of AIN and $\beta$-SiC (3C) powder transformed to the 2 H (wurzite) structure appeared to depend on the temperature and SiC/A1N ratio and seeds present. The crystalline phases consisted of a SiC-rich solid-solution phase and an A1N-rich solid-solution phase. At $2030^{\circ}C$ for 1 h, for a composition of 50 % AIN/50 % SiC with a seeding of $\alpha$-SiC, the complete solid solution could be obtained and the microstructures are equiaxed with a relatively homogeneous grain size of 2 H phases. The variation of the seeding of $\alpha$-SiC in SIC-A1N solid solutions could be attributed to the transformation behaviour and differences in size and shape of the grains, as well as to other factors, such as grain size distributions, compositional inhomogeneity, and structural defects.

• Journal of Korean Dental Science
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• v.10 no.1
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• pp.10-21
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• 2017

Purpose: The purpose of this study was to investigate the electrochemical characteristics of nanotubular Ti-25Nb-xZr ternary alloys for dental implant materials. Materials and Methods: Ti-25Nb-xZr alloys with different Zr contents (0, 3, 7, and 15 wt.%) were manufactured using commercially pure titanium (CP-Ti), niobium (Nb), and zirconium (Zr) (99.95 wt.% purity). The alloys were prepared by arc melting in argon (Ar) atmosphere. The Ti-25Nb-xZr alloys were homogenized in Ar atmosphere at $1,000^{\circ}C$ for 12 hours followed by quenching into ice water. The microstructure of the Ti-25Nb-xZr alloys was examined by a field emission scanning electron microscope. The phases in the alloys were identified by an X-ray diffractometer. The chemical composition of the nanotube-formed surfaces was determined by energy-dispersive X-ray spectroscopy. Self-organized $TiO_2$ was prepared by electrochemical oxidation of the samples in a $1.0M\;H_3PO_4+0.8wt.%$ NaF electrolyte. The anodization potential was 30 V and time was 1 hour by DC supplier. Surface wettability was evaluated for both the metallographically polished and nanotube-formed surfaces using a contact-angle goniometer. The corrosion properties of the specimens were investigated using a 0.9 wt.% aqueous solution of NaCl at $36^{\circ}C{\pm}5^{\circ}C$ using a potentiodynamic polarization test. Result: Needle-like structure of Ti-25Nb-xZr alloys was transform to equiaxed structure as Zr content increased. Nanotube formed on Ti-25Nb-xZr alloys show two sizes of nanotube structure. The diameters of the large tubes decreased and small tubes increased as Zr content increased. The lower contact angles for nanotube formed Ti-25NbxZr alloys surfaces showed compare to non-nanotube formed surface. The corrosion resistance of alloy increased as Zr content increased, and nanotube formed surface showed longer the passive regions compared to non-treatment surface. Conclusion: It is confirmed that corrosion resistance of alloy increased as Zr content increased, and nanotube formed surface has longer passive region compared to without treatment surface.

• Korean Journal of Materials Research
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• v.30 no.10
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• pp.542-549
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• 2020

Effects of Sc addition on microstructure, electrical conductivity, thermal conductivity and mechanical properties of the as-cast and as-extruded Al-2Zn-1Cu-0.3Mg-xSc (x = 0, 0.25, 0.5 wt%) alloys are investigated. The average grain size of the as-cast Al-2Zn-1Cu-0.3Mg alloy is 2,334 ㎛; however, this value drops to 914 and 529 ㎛ with addition of Sc element at 0.25 wt% and 0.5 wt%, respectively. This grain refinement is due to primary Al₃Sc phase forming during solidification. The as-extruded Al-2Zn-1Cu-0.3Mg alloy has a recrystallization structure consisting of almost equiaxed grains. However, the as-extruded Sc-containing alloys consist of grains that are extremely elongated in the extrusion direction. In addition, it is found that the proportion of low-angle grain boundaries below 15 degree is dominant. This is because the addition of Sc results in the formation of coherent and nano-scale Al₃Sc phases during hot extrusion, inhibiting the process of recrystallization and improving the strength by pinning of dislocations and the formation of subgrain boundaries. The maximum values of the yield and tensile strength are 126 MPa and 215 MPa for the as-extruded Al-2Zn-1Cu-0.3Mg-0.25Sc alloy, respectively. The increase in strength is probably due to the existence of nano-scale Al₃Sc precipitates and dense Al₂Cu phases. Thermal conductivity of the as-cast Al-2Zn-1Cu-0.3Mg-xSc alloy is reduced to 204, 187 and 183 W/MK by additions of elemental Sc of 0, 0.25 and 0.5 wt%, respectively. On the other hand, the thermal conductivity of the as-extruded Al-2Zn-1Cu-0.3Mg-xSc alloy is about 200 W/Mk regardless of the content of Sc. This is because of the formation of coherent Al₃Sc phase, which decreases Sc content and causes extremely high electrical resistivity.

• Corrosion Science and Technology
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• v.8 no.4
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• pp.162-169
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• 2009

Pure titanium and its alloys are drastically used in implant materials due to their excellent mechanical properties, high corrosion resistance and good biocompatibility. However, the widely used Ti-6Al-4V is found to release toxic ions (Al and V) into the body, leading to undesirable long-term effects. Ti-6Al-4V has much higher elastic modulus than cortical bone. Therefore, titanium alloys with low elastic modulus have been developed as biomaterials to minimize stress shielding. For this reason, Ti-30Ta-xZr alloy systems have been studied in this study. The Ti-30Ta containing Zr(5, 10 and 15 wt%) were 10 times melted to improve chemical homogeneity by using a vacuum furnace and then homogenized for 24 hrs at $1000^{\circ}C$. The specimens were cut and polished for corrosion test and Ti coating and then coated with TiN, respectively, by using DC magnetron sputtering method. The analyses of coated surface were carried out by field emission scanning electron microscope(FE-SEM). The electrochemical characteristics were examined using potentiodynamic (- 1500 mV~+ 2000 mV) and AC impedance spectroscopy(100 kHz~10 mHz) in 0.9% NaCl solution at $36.5{\pm}1^{\circ}C$. The equiaxed structure was changed to needle-like structure with increasing Zr content. The surface defects and structures were covered with TiN/Ti coated layer. From the polarization behavior in 0.9% NaCl solution, The corrosion current density of Ti-30Ta-xZr alloys decreased as Zr content increased, whereas, the corrosion potential of Ti-30Ta-xZr alloys increased as Zr content increased. The corrosion resistance of TiN/Ti-coated Ti-30Ta-xZr alloys were higher than that of the TiN-coated Ti-30Ta-xZr alloys. From the AC impedance in 0.9% NaCl solution, polarization resistance($R_p$) value of TiN/Ti coated Ti-30Ta-xZr alloys showed higher than that of TiN-coated Ti-30Ta-xZr alloys.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.4
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• pp.176-181
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• 2003

Rapid densification of a SiC powder with additive 0.5 wt% $B_4$C was conducted by spark plasma sintering (SPS). The unique features of the process are the possibilities of using very fast heating rate and short holding time to obtain fully dense materials. The heating rate and applied pressure were kept to be $100^{\circ}C$/min and 40 MPa, while sintering temperature and soaking time varied to 1800, 1850, 1900 and $1950^{\circ}C$ and 10, 20 and 30 min, respectively. All of the SPS-sintered specimens at $1950^{\circ}C$ reached near-theoretical density. The XRD found that 3C-to-6H transformation at $1850^{\circ}C$. The microstructures of the rapidly densified SiC ceramics consisted of duplex microstructure with ultrafine equiaxed grains under 2 $\mu\textrm{m}$ and elongated grains of 0.5∼2 $\mu\textrm{m}$ wide, length 3∼10 $\mu\textrm{m}$. The biaxial strength increased with the increase of sintering time. Strength of 392.7 MPa was obtained with the fully densified specimen sintered at $1950^{\circ}C$ for 30 min, in agreement with the general tendency that strength increases with decreases pore. On the other hand, the fracture toughness shows the value of 2.17∼2.34 MPa$.$$m^{1/2}$ which might be due to the transgranular fracture mode.

• Korean Journal of Materials Research
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• v.3 no.2
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• pp.158-165
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• 1993

Abstract To investigate the effect of underlying Si on the thermal stability of the TiS$i_2$ film, TiS$i_2$ films obtained by the solid-state reaction of the Ti film on as-deposited or on heat-treated poly-silicon and amorphous-silicon were annealed at 90$0^{\circ}C$ for various times. The poly-Si film was evaluated by XRD, SEM and TEM. The thermal stability of the TiS$i_2$ film was evaluated by measuring the sheet resistance and microstructural evolution during furnace annealing. Agglomeration of the TiSi, film occurred more on amorphous-Si than on poly-Si. The thermal stability of the TiS$i_2$ film was improved by annealing poly-Si. The Si layer crystallized from amorphous-Si has an equiaxed structure with the (111) preferred orientation whereas for as-deposited poly-Si has a columnar structure with the (110) orientation. Better thermal stability of the TiS$i_2$ film can be obtained by the higher surface energy of underlying poly-Si.

• Korean Journal of Materials Research
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• v.4 no.8
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• pp.895-905
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• 1994

The solid phase crystallization behavior of undoped amorphous $Si_{1-x}Ge_{x}$ (X=O to 0.53) alloyfilms was studied by X-ray diffractometry(XRD) and transmission electron microscopy(TEM). Thefilms were deposited on thermally oxidized 5" (100) Si wafer by MBE(Mo1ecular Beam Epitaxy) at 300'C and annealed in the temperature range of $500^{\circ}C$ ~ $625^{\circ}C$. From XRD results, it was found that the thermal budget for full crystallization of the film is significantly reduced as the Ge concentration in thefilm is increased. In addition, the results also shows that pure amorphous Si film crystallizes with astrong (111) texture while the $Si_{1-x}Ge_{x}$ alloy film crystallzes with a (311) texture suggesting that the solidphase crystallization mechanism is changed by the incorporation of Ge. TEM analysis of the crystallized filmshow that the grain morphology of the pure Si is an elliptical and/or a dendrite shape with high density ofcrystalline defects in the grains while that of the $Si_{0.47}Ge_{0.53}$ alloy is more or less equiaxed shape with muchlower density of defects. From these results, we conclude that the crystallization mechanism changes fromtwin-assisted growth mode to random growth mode as the Ge cocentration is increased.ocentration is increased.