• Journal of Radiation Industry
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• v.9 no.1
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• pp.9-13
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• 2015

Epoxy resin is widely used as aerospace, automobile, construction and electronics due to their good mechanical and electrical properties and environmental advantages. However, the inherent flammability of epoxy resin has limited its application in some field where good flame retardancy is required. Nano clay can enhance the properties of polymers such as flames retardancy and thermal stability. In this study, we have investigated the nanoclay filled epoxy composite, which has good flame retardancy while maintaining high mechanical properties. The cured epoxy resins were obtained using an electron beam curing process. The nano clays were dispersed in epoxy acrylate solution and mechanically stirred. The prepared mixtures were irradiated using an electron beam accelerator. The composites were characterized by gel content and thermal/mechanical properties. Moreover, the flammability of the composite was evaluated by limited oxygen index (LOI). The flame retardancy of nano clay filled epoxy composite was evidently improved.

• Elastomers and Composites
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• v.35 no.1
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• pp.12-18
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• 2000

With growing concerns of environment and due to strengthening the government regulations on volatile organic compounds(VOC) the coatings industries are developing new technologies to reduce the amount of VOC released from coatings. In this study. a water soluble curing agent of amino-epoxy adduct was synthesized and its structure was identified by FT-IR, GPC and TG/DTA. The mechanical properties of the new curing agent in combination of KER-828 and KER-500 were investigated respectively. As an experimental result, the drying time of KER-828 was faster than that of KER-500 but the adhesion and impact strength of KER-500 was better than that of KER-828.

• Proceedings of the Korea Concrete Institute Conference
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• 1997.04a
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• pp.571-578
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• 1997

In the repair and repair works, epoxy resins are widely used as repair materials. The successful concrete repairs and retrofit works depends on the quality of the repair and retrofit materials. Although many materials for the repairs and retrofit have been developed in many contries, information on the repair methods are somewhat limited. Futhermore, the repairs and retrofit methods are also largely dependent on those froms in other developed contries, it is necessary to initiate rather fundamental repair-related research. The purpose of this study is to investigate th physical and mechanical properties of epoxy resin which is commonly used in repairing concrte crack in RC structures. The basic physical properties such as specific gravity, gel point and shrinkage ratio as well as the mechanical properties such ad the tensile and compressive strength, elastic modulus were acquired by the standard test method (KS code). For the test results, the great deviations of physical and mechanical properties among the test materials were discovered and is, therefore, recommended that careful attentions should be give in selecting the epoxy resin by considering the characteristics of the repair materials and repair works.

• Analytical Science and Technology
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• v.24 no.5
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• pp.336-344
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• 2011

The study attempted to find out any effect to prevent photo aging of epoxy resin used for conservation by way of adding UV stabilizer, one of plastic additives. Specimens were made by adding HALS and UVA UV stabilizer as each concentration to 3 kinds of epoxy resin, which are most frequently used for artifacts joining and restoration process, and aging effects were investigated through Color change, SEM, contact angle, FTIR analysis during UV aging experiments. Last, usage suitability was checked when UV stabilizer was added through Universal Tensile strength tester. In result, it is impossible to prevent decomposition of chemical structure in spite of adding UV stabilizer but in the case of epoxy A and R, it is believed that photo aging such as yellowing or crack can be minimized without giving a big influence to adhesive strength of epoxy resin through adding less than 0.1% of UVA. It is expected that above will solve photo aging problem of epoxy resin used for joining and restoration of artifacts and will extend its life as joining and restoration materials.

• Transactions on Electrical and Electronic Materials
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• v.10 no.3
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• pp.97-101
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• 2009

The use of a filler material in epoxy composite materials is an essential condition for reducing the unit cost of production and reinforcing mechanical strength. However, the dielectric strength of insulators decreases rapidly due to interactions between the epoxy resin and filler particles. In contrast to existing composite materials, nano-composite materials have superior dielectric strength, mechanical strength, and enduring chemical properties due to an increase in the bond strength of the polymer and nano material, It is reported that nano-fillers provide new characteristics different from the properties of the polymer material. This study is to improve the insulation capability of epoxy resins used in the insulation of a power transformer apparatus and many electronic devices mold. To accomplish this, the additional amount of nano-$SiO_2$ to epoxy resin was changed and the epoxy/$SiO_2$ nano composite materials were made, and the fundamental electrical properties were investigated using a physical properties and an analysis breakdown test. Using allowable breakdown probability, the optimum breakdown strength for designing an electrical apparatus was determined. The results found that the electrical characteristics of the nano-$SiO_2$ content specimens were superior to the virgin specimens. The 0.4 wt% specimens showed the highest electrical properties among the specimens examined with an allowable breakdown probability of 20 %, which indicates stable breakdown strength in insulating machinery design.

• Applied Chemistry for Engineering
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• v.10 no.5
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• pp.701-706
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• 1999

The effect of siloxane oligomer content on thermal stability and internal stress of DGEBA epoxy resin was investigated. Siloxane-epoxy polymers having terminal epoxy group were prepared by reaction of siloxane-DDM prepolymer with DGEBA epoxy resin. Thermal stability was studied in terms of the initial decomposition temperature(IDT), temperature of maximum rate of weight loss($T_{max}$), integral procedural decomposition temperature(IPDT), and decomposition activation energy($E_t$) using TGA data. The thermal stability increased with increasing the siloxane oligomer content and showed a maximum value in the case of 5 wt% siloxane oligomer content in the blend system. While, the coefficient of thermal expansion(${\alpha}_r$) and the flexural modulus($E_r$) allowed us to study internal stress of the blend system. As the content of siloxane oligomer increases, the internal stress systematically decreases as decreasing both ${\alpha}_r$ and $E_r$.

• Composites Research
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• v.30 no.6
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• pp.350-355
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• 2017

The new liquid crystalline (LC) epoxy was designed by substituting the phenylcyclohexyl (PCH) mesogen moiety with an alkyl chain at the 2,5 position of the diglycidyl terephthalate. The mesomorphic properties were evaluated by differential scanning calorimetry (DSC) and polarized optical microscopy (POM). All LC epoxy derivatives exhibited an enantiotropic smectic phase upon heating and cooling process. The LC phase temperature range was widened by mixing the eutectic mixture of LC epoxies. Interestingly, the cured LC epoxy exhibited the highest thermal conductivity of $0.4W{\cdot}m^{-1}{\cdot}K^{-1}$. The novel LC epoxy with high thermal conductivity might be used as a composite material for electronic and display devices.

• Polymer(Korea)
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• v.25 no.2
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• pp.246-253
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• 2001

Amino terminated PES-CTBN-PES triblock copolymer was synthesized from PES oligomer and commercial CTBN rubber (CTBN1300$\times$13), and molecular weight of the copolymer was controlled to be 15000 g/mole. The copolymer was utilized to toughen diglycidyl ether of bisphenol-A (DGEBA) epoxy resin which was cured with 4,4'-diaminodi-phenylsulfone (DDS) and subjected to the measurement of thermal properties, fracture toughness ( $K_{IC}$), flexural properties and solvent resistance. The properties were compared with those from the samples modified by CTBN/PES blends. The maximum loading of copolymer into the epoxy resin was 40 wt% without utilizing solvent, at which $K_{IC}$ fracture toughness of 2.21 MPa${\cdot}m^{0.5}$ was obtained without sacrificing flexural properties and chemical resistance. However, the epoxy resin modified with PES/CTBN blend exhibited much lower $K_{IC}$ and flexural properties compared to the epoxy resins toughened by PES-CTBN-PES copolymers.

• Applied Chemistry for Engineering
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• v.22 no.3
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• pp.266-271
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• 2011

Single-walled carbon nanotube (SWCNT)/Epoxy composites were prepared for improving thermal conductivities and dispersion of SWCNTs in the epoxy matrix. Composites obtained different types of SWCNTs which are pristine and functionalized of the SWCNTs by acid and amine treatments. Three types of SWCNTs were dispersed in diglycidyl ether of bisphenol A (DGEBA) and bisphenol F (DGEBF). Enhanced interaction between functional groups on SWCNT and epoxy resins was evidenced by an improvement in the dispersion of the SWCNTs in the epoxy matrix. Thermal conductivity of composites containing acid SWCNTs were found to be much better than those containing pristine and amine treated SWCNTs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.303-306
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• 2001

Composite insulating materials used in outdoor high voltage equipment are required to have high electric performance because of the miniaturization. The frequence dependence of the permittivity and the loss tangent have important information. In this paper we describe the frequency dependence of the permittivity and the loss tangent for epoxy resin filled with silica and the influence of filler shape on the dielectric properties. The increment of tan $\delta$ in the low frequency region is caused by the increment of both of the electrical conductivity and the polarization due to the shape of filler and water sbsorbed in and near the interface between the fillers and resins. Result of charge current and discharge measure, electric conduction increased according to voltage.