• Fire Science and Engineering
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• v.33 no.5
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• pp.19-27
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• 2019

Fire extinguishing composite materials based on low-viscosity epoxy resin (EP) and containing 50 wt% of encapsulated fire extinguishing agent (EFA) have been studied. The positive effect of the EP on the kinetics and temperature of the EFA decapsulation was established. The EP increases the decapsulation temperature of the EFA from 130 ℃ to 155 ℃ and changes the kinetics of the decapsulation. The epoxy matrix increases the thermal stability of the EFA more than 3.9 times compared to that of the pure EFA. The protective effect of the EP on the storage stability of the EFA was validated. The mass loss of EP-containing EFA at 60 ℃ and 80% humidity over 96 h is 0.4%. The mass loss of pure EFA under the same conditions is 15%. A similar effect was observed under ultraviolet radiation: the EP-containing EFA loses 0.8% at pure EFA mass of 6%. The testing of alternative polymer matrixes has been considered.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Advanced Composite Materials
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• v.17 no.1
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• pp.57-73
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• 2008

The present paper focuses on experimental verification of the ply-by-ply basis inelastic analysis of multidirectional laminates. First of all, rate dependence of the tensile behavior of balanced symmetric cross-ply T800H/epoxy laminates with a $[0/90]_{3S}$ lay-up under off-axis loading conditions at $100^{\circ}C$ is examined. Uniaxial tension tests are performed on plain coupon specimens with various fiber orientations $[{\theta}/(90-{\theta})]_{3S}$ ($\theta$ = 0, 5, 15, 45 and $90^{\circ}C$) at two different strain rates (1.0 and 0.01%/min). The off-axis stress.strain curves exhibit marked nonlinearity for all the off-axis fiber orientations except for the on-axis fiber orientations $\theta$ = 0 and $90^{\circ}$, regardless of the strain rates. Strain rate has significant influences not only on the off-axis flow stress in the regime of nonlinear response but also on the apparent off-axis elastic modulus in the regime of initial linear response. A macromechanical constitutive model based on a ply viscoplasticity model and the classical laminated plate theory is applied to predictions of the rate-dependent off-axis nonlinear behavior of the cross-ply CFRP laminate. The material constants involved by the ply viscoplasticity model are identified on the basis of the experimental results on the unidirectional laminate of the same carbon/epoxy system. It is demonstrated that good agreements between the predicted and observed results are obtained by taking account of the fiber rotation induced by deformation as well as the rate dependence of the initial Young's moduli.

• Elastomers and Composites
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• v.41 no.1
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• pp.19-26
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• 2006

In this study, the effect of thermal aging temperature on the weight loss, glass transition temperature, and morphology of epoxy adhesives cured with amine (D-230), amide (G-5022), and anhydride (HN-2200) was investigated. As a result, the weight loss of three specimens was increased with increasing the thermal aging temperature. The result was attributed to the thermal aging which was occurred at the surface of adhesive specimens at high aging temperature, resulting in increasing the weight loss of the specimens. According to the DSC result, the glass transition temperature of DGEBA/D-230 and DGEBA/G-5022 samples war increased as the aging temperature increased, whereas the glass transition temperature of DGEBA/HN-2200 samples was constant above aging temperature of $150^{\circ}C$ and aging tine of 7 days. The SEM result indicated that the surface of DGEBA/G-5022 specimen showed more rough topography than that of DGEBA/D-230 or DGEBA/HN-2200 specimen after thermal aging. This could be correlated with the result of weight loss.

• Journal of the Korean Wood Science and Technology
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• v.50 no.2
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• pp.93-103
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• 2022

Currently, biofibers are used as a reinforcement in polymer composites for structural elements and construction materials instead of the synthetic fibers which cause environmental problems and are expensive. One of the chemicals with a pH close to neutral that can be potentially used as a modified fiber material is sodium chloride (NaCl). Therefore, this study aims to investigate the characteristics of a composite board made from NaCl-treated kenaf fiber. A completely randomized design method was used with consideration of two factors: the content of NaCl in the treatment solution (1 wt%, 3 wt%, and 5 wt%) and the duration of immersion of fibers in the solution (1 h, 2 h, and 3 h). The NaCl treatment was conducted by soaking the fibers in the solution for different durations. The fibers were then rinsed with water until the pH of the water reached 7 and subsequently dried inside an oven at 80℃ for 6 h. Kenaf fiber and epoxy were mixed manually with the total loading of 20 wt% based on the dry weight of the fiber. Physical and mechanical properties of the fibers were then evaluated based on JIS A 5908 particleboard standards. The results showed that increasing NaCl content in the fiber treatment solution can increase the physical and mechanical properties of the composite board. The properties of fibers treated with 5 wt% NaCl for 3 h were superior with a modulus of elasticity of 2.085 GPa, modulus of rupture of 19.77 MPa, internal bonding of 1.8 MPa, thickness swelling of 3%, and water absorption of 10.9%. The contact angle of untreated kenaf fibers was 104°, which increased to 80° and 73° on treatment with 1 wt% and 5 wt% NaCl for 3 h, respectively.

• Polymer(Korea)
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• v.25 no.3
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• pp.359-366
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• 2001

Isothermal physical aging of a glass fiber/epoxy composite was examined at different aging temperatures ($T_a$) and degrees of conversion (monitored by the glass transition temperature, $T_g$) by means of the TBA torsion pendulum technique. The range of aging temperature was from 10 to $130^{\circ}C$ : the conversion was systematically changed from $T_g$=$76^{\circ}C$ to $T_g$=$177^{\circ}C$ (fully crosslinked). The effect of isothermal physical aging was manifested as perturbations of the modulus and mechanical loss vs. temperature in the vicinity of $T_a$ for all conversions. The rate of isothermal physical aging determined from the change of modulus with aging time at fixed aging temperature decreased and then increased with increasing conversion below T$_{a}$=9$0^{\circ}C$. There exists a superposition in aging rate vs. ($T_g$ -$T_a$) by shifting horizontally and vertically. This implies that the physical aging process is independent of the change of chemical structure as conversion proceeds. It has been found that water absorbed at the aging temperature below $70^{\circ}C$ during isothermal physical aging lowers the apparent aging rate. It is due to the absorbed water molecules forming strong polar interactions with hydroxyl group on network chain and reducing the segmental mobility during the physical aging.g.

• Corrosion Science and Technology
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• v.7 no.1
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• pp.50-60
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• 2008

The majority of the described experimental results deal with relatively pure aluminium. Variations were made in the pretreatment of the aluminum substrates and an investigation was performed on the resulting changes in oxide layer composition and chemistry. Subsequently, the bonding behavior of the surfaces was investigated by using model adhesion molecules. These molecules were chosen to represent the bonding functionality of an organic polymer. They were applied onto the pretreated surfaces as a monolayer and the bonding behavior was studied using infrared reflection absorption spectroscopy. A direct and clear relation was found between the hydroxyl fraction on the oxide surfaces and the amount of molecules that subsequently bonded to the surface. Moreover, it was found that most bonds between the oxide surface and organic functional groups are not stable in the presence of water. The best performance was obtained using molecules, which are capable of chemisorption with the oxide surface. Finally, it was found that freshly prepared relatively pure aluminum substrates, which are left in air, rapidly lose their bonding capacity towards organic functional groups. This can be attributed to the adsorption of contamination and water to the oxide surface. In addition the adhesion of a typical epoxy-coated aluminum system was investigated during exposure to water at different temperatures. The coating was found to quite rapidly lose its adhesion upon exposure to water. This rapid loss of adhesion corresponds well with the data where it was demonstrated that the studied epoxy coating only bonds through physisorptive hydrogen bonding, these bonds not being stable in the presence of water. After the initial loss the adhesion of the coating was however found to recover again and even exceeded the adhesion prior to exposure. The improvement could be ascribed to the growth of a thin oxyhydroxide layer on the aluminum substrate, which forms a new, water-stable and stronger bond with the epoxy coating. Two routes for improvement of adhesion are finally decribed including an interphasial polymeric thin layer and a treatment in boiling water of the substrate before coating takes place. The adhesion properties were finely also studied as a function of the Mg content of the alloys. It was shown that an enrichment of Mg in the oxide could take place when Mg containing alloys are heat-treated. It is expected that for these alloys the (hydr)oxide fraction also depends on the pre-treatment and on the distribution of magnesium as compared to the aluminium hydroxides, with a direct impact on adhesive properties.

• Polymer(Korea)
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• v.36 no.2
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• pp.169-176
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• 2012

Based on our experience in developing resistive humidity sensor, interdigital gold electrodes with different fingers and gaps have been fabricated on a glass epoxy (GE) substrate using screen printing techniques. The basic structure of the electrode consisted of a 3-, 4- and 5-fingers with gaps of 310 and 460 ${\mu}m$. Gold electrode/GE was prepared by first printing silver nanopaste, followed by consecutive electroless plating of Cu, Ni and then Au. Copolymer of [2-(methacryloyloxy)ethyl] dimethyl benzyl ammonium chloride (MDBAC) and methyl methacrylate (MMA) was used as a humidity-sensing polyelectrolyte, which was fabricated by a screen printing method on the Au electrode/GE substrate. The flexible humidity sensor showed acceptable linearity between logarithmic impedance and relative humidity in the range of 20-95%RH, low hysteresis of 1.5%RH, good response and recovery time of 75 sec at 1 V, 1 kHz, and $25^{\circ}C$. Electrode construction had a significant influence on the humidity-sensing characteristics of polymeric humidity sensors. The activation energy between electrode and ion conducting polyelectrolyte plays an important role in explaining the differences of humidity sensing characteristics such as temperature dependence, sensitivity, linearity and hysteresis.

• Elastomers and Composites
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• v.38 no.3
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• pp.213-226
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• 2003

The cure and rheological behavior of diglycidyl ether of bisphenol F/nadic methyl anhydride resin system with the kinds of imidazole were studied using a differential scanning calorimeter (DSC) and a rotational rheometer. The isothermal traces were employed to analyze cure reaction. The DGEBF/ anhydride conversion profiles showed autocatalyzed reaction characterized by maximum conversion rate at $20{\sim}40 %$ of the reaction. The rate constants ($k_1,\;k_2$) showed temperature dependance, but reaction order did not. The reaction order (m+n) was calculated to be close to 3. There are two reaction mechanisms with the kinds oi catalyst. The gel time was determined by using G'-G" crossover method, and the activation energy was obtained from this results. From measurement of rheological properties it was found that the logarithmic 1:elation time of fused silica filled DBEBF epoxy compounds linearly increased with the content of filler and decreased with temperature. The highly filled epoxy compounds showed typical pseudoplastic behavior, and the viscosity of those decreased with increasing maximum packing ratio.

• Composites Research
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• v.19 no.5
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• pp.20-27
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• 2006

Self-sensing and interfacial evaluation of Ni nanowire/polymer composites were investigated using electro-macromechanical technique, which can be used fur a feasible sensing measurement on tensile and compressive loading/consequent unloading, temperature, and humidity. Mechanical properties of Ni nanowire with different aspect ratio and adding contents in either epoxy or silicone composites were measured indirectly using electro-pullout test under uniform and non-uniform cyclic loadings. Comparing apparent modulus with the conventional mechanical tensile modulus of Ni nanowire/epoxy composites, the trends were consistent with each other. Ni nanowire/epoxy composites showed the sensing response on humidity and temperature. Self-sensing on applied tensile and compressive loading/unloading was also responded for Ni nanowire/silicone composites via electrical contact resistivity showing the opposite trend between tension and compression. It can be due to the different electrically-interconnecting mechanisms of dispersed Ni nanowires embedded in silicone matrix.