• Journal of Welding and Joining
• /
• 제33권5호
• /
• pp.41-46
• /
• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• Corrosion Science and Technology
• /
• 제10권3호
• /
• pp.80-86
• /
• 2011

Welding was widely used in shipbuilding industries as a joining method. In present study, the effects of welding fume contaminated on steel surface on corrosion protection were examined by water ballast simulation test and condensation chamber test. Pull-off adhesion test, blistering test and cathodic disbondment test were carried out to evaluate the effects of residual welding fume. Consequently, it was clearly indicated that the residual welding fume didn't affect the corrosion protection of epoxy coated on steel when surface was treated by light sweep blasting to heavy sweep blasting which was applied in this study.

• 한국콘크리트학회:학술대회논문집
• /
• 한국콘크리트학회 2005년도 봄학술 발표회 논문집(I)
• /
• pp.503-506
• /
• 2005

The purpose of this study was the Development of Retrofit Method for Beam Using Steel Plate Reinforced by Fiber Sheet.1. Additional reinforcements are not needed in the joining area of slab and beam web.2. Beam using carbon fiber reinforced plastic displays low effects in shearing effect.3. Beams reinforced steel plate by epoxy effect the capacities of strength. But the capacities of strength are rapidly reduced when adhesive surface be omitted. Thus details are needed in this case.4.Retrofit method for beam using steel plate reinforced by fiber sheet with epoxy rosin improves the capacities of strength and the initial stiffness, shows a large transformation since the maximum load likewise may be excellent to the shearing reinforcement.

• 전자통신동향분석
• /
• 제35권4호
• /
• pp.1-10
• /
• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Journal of Welding and Joining
• /
• 제13권2호
• /
• pp.106-114
• /
• 1995

The characteristics of adhesive bonded joint of steels for automobile were investigated. Shear and tear strength were tested and analyzed for the joints of cold rolled steel sheets bonded with three kinds of epoxy and urethane based adhesive. The results showed that the tensile shear strength and the tear strength of adhesive joint were affected by the shape of adhesive joint such as the length and width of adhesive joint. The thickness of adhesive layer was very important factor affecting the bonding strength. The shear strength increased with decrease of the thickness of adhesive layer, while the tear strength decreased as the thickness of adhesive layer decreased. In comparison with the strength of spot welded joint, the shear strength of adhesive Joint was higher than that of spot welded joint, but the tear strength of adhesive Joint was lower than that of spot welded joint.

• 한국복합재료학회:학술대회논문집
• /
• 한국복합재료학회 2002년도 춘계학술발표대회 논문집
• /
• pp.22-26
• /
• 2002

The goal of this study is to replace the current forward 2-piece propeller shaft of 8 ton large truck made of steel with 1-piece composite propeller shaft. A low cost Glass/Epoxy composite propeller shafts were successfully developed, which satisfy requirements such as the capacity of static torque transfer, fatigue strength and bending natural frequency. Devising secure joining method of a composite tube and metal yoke was the most critical issue in successful development of a high torque composite propeller shaft. In this study, joining method using thermal interference fit was adopted for composite to metal joint. Optimum conditions of heating temperature and interference level of thermal interference fit were determined from thermal stress analysis using 3D finite element method. Static torsion test, fatigue test, RPM and balance test were performed to verify the design.

• 한국복합재료학회:학술대회논문집
• /
• 한국복합재료학회 2004년도 추계학술발표대회 논문집
• /
• pp.78-82
• /
• 2004

The co-cured joint has been widely used in joining process of composite structures due to its simple and easy manufacturing process. In this paper, the effect of stacking sequence of the carbon epoxy prepreg, bonding length and thickness of the aluminum plate on the static tensile load capability of the co-cured aluminum-composite double lap joint were experimentally investigated. From experimental results, the optimum EA ratios with respect to stacking sequence and bonding length of the co-cured joint were obtained, which may be useful for the joining of hybrid structures.

• Journal of Welding and Joining
• /
• 제18권4호
• /
• pp.64-69
• /
• 2000

Reliability of PBGA(Plastic Ball Grid Array) package is very weak compared with normal plastic packages. The reliability are the lower resistance to popcorn cracking, which is reduced by moisture absorption in PCB(Printed Circuit Board). This paper adapts plasma treatment process and analyzes their effect. The contents of C and Cl decrease after plasma treatment but O, Ca and N relatively increase. The Plasma treatment to improve the adhesion between EMC(Epoxy Molding Compound) and PCB(solder mask). The degree of improvement was over 100% Max., which is depend on the properties of EMC. Ar+H$_2$as plasma gas show good result. There is a little difference in RF power and treatment time.

• 마이크로전자및패키징학회지
• /
• 제24권2호
• /
• pp.11-15
• /
• 2017

실리콘 칩을 적층하는 3D 멀티 플립칩 패키지의 경우 방열문제가 대두됨에 따라 접착 접합부의 열전도도 향상이 요구되고 있다. 본 연구에서는 플립칩 본딩용 비전도성 접착제(NCP)에 있어서 알루미나 필러의 첨가가 NCP의 물성 및 열전도도에 미치는 영향을 조사하였다. 알루미나 필러는 미세피치 플립칩 접속을 위해 평균입도 400 nm의 미세분말을 사용하였다. 알루미나 필러 함량이 0~60 wt%까지 증가함에 따라 60 wt% 첨가 시 0.654 W/mK에 도달하였다. 이는 동일 첨가량 실리카의 0.501 W/mK보다는 높은 열전도도이지만, 동일 함량의 조대한 알루미나 분말을 첨가한 경우에 비해서는 낮은 열전도도로, 미세 플립칩 본딩을 위해 입도가 미세한 분말을 첨가하는 것은 열전도도에 있어서는 불리한 효과로 작용함을 알 수 있었다. NCP의 점도는 40 wt% 이상에서 급격히 증가하는 현상을 나타내었는데, 이는 미세 입도에 따른 필러 간 상호작용의 증가에 기인하는 것으로, 미세피치 플립칩 본딩을 위해 열전도도가 우수한 미세 알루미나 분말을 사용하기 위해서는 낮은 점도를 유지하면서 필러 첨가량을 증가시킬 수 있는 분산방안이 필요한 것으로 판단되었다.

• 마이크로전자및패키징학회지
• /
• 제29권2호
• /
• pp.113-119
• /
• 2022

플렉서블, 웨어러블 디바이스 등을 포함한 차세대 전자 기기의 기계적 신뢰성 향상을 위하여 다양한 유연 접합부에서 높은 수준의 기계적 신뢰성이 요구되고 있다. 기존 고분자 기판 접합을 위한 에폭시 등의 유기 접착소재는 접합부 두께 증가가 필연적이며, 반복 변형, 고온 경화에 의한 열기계적 파손 문제를 수반한다. 따라서 유연 접합을 위해서 접합부 두께를 최소화하고 열 손상을 방지하기 위한 저온 접합 공정 개발이 요구된다. 본 연구에서는 플렉서블 기판의 유연, 강건, 저 열 손상 접합이 가능한 플렉서블 레이저 투과 용접(flexible laser transmission welding, f-LTW)를 개발하였다. 유연 기판 위 탄소나노튜브(carbon nanotube, CNT)를 박막 코팅하여 접합부 두께를 줄였으며, CNT 분산 빔 레이저 가열을 통한 고분자 기판 표면의 국부적 용융 접합 공정이 개발되었다. 짧은 접합 공정 시간과 기판의 열 손상을 최소화하는 레이저 공정 조건을 구축하였으며 고분자 기판과 CNT 접합 형성 메커니즘을 분석하였다. 또한 접합부의 강건성 및 유연성 평가를 위해 인장강도 시험, 박리 시험과 반복 굽힘 시험을 진행하였다.