• Proceedings of the Korea Concrete Institute Conference
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• 2002.10a
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• pp.513-518
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• 2002

In vertical construction joint, adhesives such as epoxy, acrylic, latex, etc. have been usually used for bonding fresh concrete to hardened concrete. In this study, performance of adhesives under various application conditions was investigated through tests for slant shear and flexural strength. From the results of the tests, it is found that superior bonding performance can be obtained under good surface preparation without adhesive when high strength concrete is used.

• Journal of the Korean Society of Safety
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• v.22 no.3 s.81
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• pp.22-27
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• 2007

The knowledge of the flash point of the various liquid substances is required because of process safety and control in industrial fire protection. The epoxy resin is one of versatile resins that has wide selection of using curing agents and additives to achieve various applications such as coatings, adhesives, interior materials, reinforced plastics and electrical insulation. In this study, the lower flash points for p-xylene+epoxy resin, o-xylene+epoxy resin and n-butanol+epoxy resin systems were measured by using Pensky-Martens closed cup tester. The lower flash points for p-xylene+epoxy resin, o-xylene+epoxy resin and n-butanol+epoxy resin systems rapidly increased 80wt%, 90wt% and 95wt% of epoxy resin concentration, respectively. This results serve as a guide to estimate flash point of any epoxy resin solution.

• Applied Chemistry for Engineering
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• v.25 no.5
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• pp.520-525
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• 2014

In this paper, the effect of silane-treated silicas and epoxidized soybean oil (ESBO) addition on adhesion properties of silicas-filled epoxy adhesives was examined. The silicas were treated by ${\gamma}$-methacryloxy propyltrimethoxy silane (MPS), ${\gamma}$-glycidoxy propyl trimethoxy silane (GPS), and ${\gamma}$-mercapto propyl trimethoxy silane (MCPS). Surface and structural properties of the adhesives were determined by using scanning electron microscope (SEM) and Fourier transform infrared spectroscopy (FT-IR). The t-peel strength of the adhesives was estimated using the universal testing machine (UTM). And, the equilibrium spreading pressure, surface free energy, and specific surface area were investigated by BET methods with $N_2$/77 K adsorption. As a result, the peel strength of the adhesives was increased in the presence of silane-treated silicas in the adhesives compared to that of untreated silicas. This result indicated that the silane coupling agent played an important role in improving the dispersion of silicas in epoxy adhesives. And, the adhesives treated by MCPS were superior to the others in adhesion.

• Proceedings of the Korean Fiber Society Conference
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• 1998.10a
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• pp.61-65
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• 1998

Epoxy resins are currently one of the most widely used thermoset polymers. Applications on epoxy-based materials range from common to structural adhesives as well as to matrix materials for high performance composites. The outstanding versatility of this resin can be related to the reactivity of the epoxy group, which can be opened by a large number of different chemical compounds, such a aliphatic and aromatic amines, anhydrides and poly-amides. (omitted)

• Polymer Science and Technology
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• v.4 no.5
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• pp.358-364
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• 1993

• Korean Chemical Engineering Research
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• v.47 no.2
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• pp.203-207
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• 2009

In the NCAs(non-conductive adhesive) for adhesion of Micro Electro Mechanical System(MEMS), there are some problems such as delamination and cracking, because of the differences of CTE(coefficients of thermal expansion) between NCAs and substrates. Addition of inorganic particle or flexibilizer have been performed to solve those problems. In this study, to improve the flexibility of epoxy adhesive, epoxy/siloxane composites were prepared by adding 1, 3, or 5 phr of amino modified siloxane(AMS). Glass transition temperatures(Tg), moduli and CTE of those composites were measured to confirm effects of siloxane on thermal/mechanical properties of siloxane/epoxy-composites. Tg of AMS/epoxy-composites decreased from $134^{\circ}C$ to $122^{\circ}C$ with increasing AMS contents and moduli decreased from 2,425 MPa to 2,143 MPa with increasing AMS contents. But CTE of AMS/epoxy-composites increased from $67ppm/^{\circ}C$ to $71ppm/^{\circ}C$ with increasing AMS contents. In short, the addition of siloxane is effective for enhancing the flexibility of epoxy but leads to the decrease of Tg.

• Applied Chemistry for Engineering
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• v.22 no.1
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• pp.104-108
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• 2011

In the non-conductive adhesives (NCAs) for adhesion of micro electro mechanical system (MEMS), there are some problems such as delamination and cracking resulting from the large differences of coefficients of thermal expansion (CTE) between NCAs and substrates. So, the addition of inorganic particles such as silica and nano clay to the CTEs composit have been applied to reduce the CTEs of the adhesives. Additions of the flexibilizers such as siloxanes have also been performed to improve the flexibility of epoxy composite. Amino modified siloxane (AMSs) were used to improve compatibility between epoxy and siloxane. In this study, glass transition temperatures (Tg) and moduli of those composites were measured to confirm the effects of AMS with two different equivalents on thermal/mechanical properties of AMS/epoxy composites. Tg of KF-8010/epoxy composites decreased from 148 to $122^{\circ}C$ and those of X-22-161A/epoxy composites decreased from 148 to $121^{\circ}C$. Moduli of KF-8010/epoxy composites decreased from 2648 to 2143 MPa by adding KF-8010 and moduli of X-22-161A/epoxy composites decreased from 2648 to 2014 MPa. In short, using long Si-O chain AMS leads to a greater decrease in moduli. However, haven't showed significant differences in Tg's.

• Composites Research
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• v.29 no.2
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• pp.79-84
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• 2016

An adhesive can be used to connect two different materials in structures. In comparing with other connecting methods, such as bolt, rivet, and hot melting, the adhesive does not need to use them. It leads to reduce the weight and decrease the stress concentration along the connecting line. This work studied the comparison of mechanical and interfacial properties of commonly-used two adhesives, acrylic type and bisphenol-A epoxy type. Tensile and flexural strength of neat adhesives were also compared. Lap shear test of two adhesives was deduced from the measurement of tensile and fatigue tests. After testing, the failure patterns of adhesive surfaces were observed by a microscope. Tensile strength and mechanical fatigue resistance at using bisphenol-A epoxy adhesive were better than acrylic adhesive. Also adding CNT reinforcement in epoxy adhesive can anticipate mechanical improvement.

• Journal of Conservation Science
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• v.35 no.6
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• pp.681-688
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• 2019

In this study, the characteristics of natural and synthetic adhesives used in woodcraft were evaluated. The pattern of deterioration of wood and adhesives according to changes in temperature and humidity were compared. For materials, one type of anlmal glue, three kinds of polyvinyl acetate adhesives, one type of epoxy adhesive and one type of zelkova wood were selected. Characteristics of physical and chemical characteristics, weather resistance and drying speed assessment were carried out. The adhesion characteristic evaluation showed that the adhesion strength of anlmal glue and one type of polyvinyl acetate adhesive were 6.54 N/㎟ and 7.01 N/㎟, pH meter of anlmal glue and polyvinyl acetate adhesives was pH 7.03 and pH 3.32-3.59 which were range of available as an adhesive. According to the test results of weather resistance, epoxy adhesives had the highest decreasing value in adhesion strength after deterioration. In the reversible test of the adhesive, it was found to be highly reversible in NaOH, a soluble solvent excluding epoxy, but attention is required when using the wood since it may show discoloration during processing.

• International journal of steel structures
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• v.18 no.4
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• pp.1410-1419
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• 2018

Recently, a repair method by bonding patch plates is being applied to corroded steel structures. However, one of the issues of patch plate bonding repair is the brittle debonding of the patch plates. Generally, when the delamination of the patch plates occurs, the composite effect acting between the steel members and patch plates abruptly decreases. Therefore, to prevent the brittle debonding of the patch plates, a repair method combining an adhesive and stud bolts is proposed. Till date, tensile and compressive tests have been performed for the proposed method. In this study, plate bending tests were conducted to verify the effectiveness of this method under bending conditions. Furthermore, two types of epoxy resin-based adhesives were prepared to evaluate the effectiveness of the proposed method with different adhesive properties. The test results show that the proposed method is able to prevent the brittle debonding of the patch plates in the case of both epoxy resins.