• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2003.10a
• /
• pp.121-124
• /
• 2003

A new form-joining process with the aid of an adhesive is proposed in which an epoxy adhesive is applied to a sheet metal pair, and before it cures the pair is clinched to cause the geometric constraint in the form of a protrusion. In order to reduce the forming load and the height of protrusions, a new die and punch set with a very small clearance was devised to reduce the depth of drawing and the forming load. Taguchi method was employed to find the optimal values of design parameters. To implement each case of the orthogonal array, the finite element method was used. The experiments showed that on the tensile-shear test, the bonding strength of the new form-joining process with an epoxy adhesive is approximately the same as that of the resistance spot welding; and in comparison with the other two form-joining processes with an epoxy adhesive, the height of protrusions was reduced by more than 65 percent and the forming load by 50 percent.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.24 no.10 s.181
• /
• pp.2520-2528
• /
• 2000

Mechanical and physical properties of composite materials make a great difference due to their cure process condition. In order to clarify the effect of cure process condition on the microscopic damage behavior and failure mechanism of Carbon/Epoxy composites, three point bend test has been performed. For this purpose, two kinds of specimens with single adhesive and multiple adhesive layers were prepared. For single adhesive layer, four different types of specimen were used, that is, non-sanding, sanding, cocured, laminated specimens. Three different types of specimen were also used for the multiple adhesive layer, non-sanding, sanding, cocured specimens. Acoustic emission technique has also been employed to monitor the damage progresses associated with each micro-failure mechanism. The characteristics of AE parameters associated with micro-failure mechanism of each specimen were discussed.

• Journal of Welding and Joining
• /
• v.29 no.4
• /
• pp.54-60
• /
• 2011

Adhesive bonding is one of the most promising joining methods which may substitute for conventional metallurgical joining processes, such as welding, brazing and soldering. Curing behavior and mechanical properties of adhesive joint are largely dependent on the curing agent including hardener and catalyst. In this study, effects of curing system on the curing behavior and single-lap shear strength of epoxy adhesive joint are investigated. Dihydrazide, anhydride and dicyandiamide(DICY) were chosen as hardener and imidazole and triphenylphosphine(TPP) were chosen as catalyst. In curing behavior, TPP showed the delay of the curing rate for DICY and ADH at $160^{\circ}C$, compared to imidazole catalyst due to the high curing onset/peak temperature. DICY seemed to be most beneficial in the joint strength for both steel and Al adherends, although the type of adherends affected the shear strength of epoxy adhesive joint.

• Proceedings of the Korea Concrete Institute Conference
• /
• 1998.04b
• /
• pp.627-632
• /
• 1998

This study deals with the effect on adhesive strength properties of waterproofing and reinforcing layer and mortar or concrete substrate applicated by epoxy resin anticorrosive and bonding materials. Properties of adhesive strength change condition of concrete substrate, temperature, moisture, curing and cleaning and so on. The purpose of this study is that it makes the estimation value of bond strength of concrete wall and epoxy resin layer when coated epoxy resin as anticorrosive materials for durability performance estimation depend on concrete watertightness, and when penetrated epoxy resin for the reinforcement of concrete used the carbon fiber sheet.

• Journal of Welding and Joining
• /
• v.33 no.4
• /
• pp.44-49
• /
• 2015

The structural epoxy adhesive used in car body assembly needs the highest level of joint mechanical strength under lap shear, T-peel and impact peel conditions. In this study, the effect of nano functionalized block copolymer addition on the impact peel strength of epoxy adhesive was investigated. DSC analysis showed that the addition of nano functionalized block copolymer did not affect the curing reaction of epoxy adhesive. From single lap shear test, it was found out that the addition of nano functionalized block copolymer slightly decreased the cohesive strength of cured adhesive layer. The addition of nano functionalized block copolymer showed beneficial effect on T-peel strength by changing the adhesive failure mode to the mixed mode. However, the addition of nano functionalized block copolymer just decreased the room temperature impact peel strength. It was considered that the addition of nano functionalized block copolymer could have effect on disturbing the crack propagation only for the case of slow strain rate.

• Journal of the Society of Naval Architects of Korea
• /
• v.58 no.2
• /
• pp.66-72
• /
• 2021

As the demand for natural gas that satisfies environmental regulations increases, the quantities of natural gas cargo that carrier can load is also increasing. Natural gas is transported in a liquefied state at -163 ℃ to increase loading efficiency. Among several LNG CCS types, MARK-III types are generally adopted in terms of loading efficiency. The secondary barrier adhesives of the MARK-III, nevertheless, is subjected to tensile stress due to thermal contraction and tension in the environment. In terms of these reasons, local analysis of the adhesive to evaluate the stress state must be carried out. According to previous studies, local analysis is unavailable since material properties for secondary barrier adhesives have not been reported. Thus, in this study, the cryogenic tensile test and coefficient of thermal expansion of epoxy and polyurethane (PU15, PU45), which are most widely used at cryogenic temperatures, were experimentally analyzed. At cryogenic temperature, the mechanical behavior of the polyurethane adhesive was better than epoxy of the adhesive. the joint of FSB and epoxy adhesive of the secondary barrier has the maximum coefficient of thermal expansion difference at 25 ℃ and minimum at -150 ℃, respectively.

• Textile Coloration and Finishing
• /
• v.34 no.3
• /
• pp.157-164
• /
• 2022

This study tried to analyze the heat resistance properties by blending epoxy and phenolic resin in a certain ratio, and to analyze the adhesive properties at the time of metal-polymer hetero-adhesion by applying Epoxy-phenolic resin between a silicon steel sheet and m-aramid sheet, the viscosity, adhesive peel strength, and adhesive cross section were measured using a rotational rheometer, a tensile tester(UTM), and a field emission scanning electron microscopy(FE-SEM). The thermal stability and heat resistance were confirmed by measuring the mass loss according to the temperature increase using Thermogravimetric analysis(TGA). After blending with epoxy and Phenolic resin(1:0.25 ratio) curing at 110℃ for 10 min, high adhesive strength was improved more than 40% compared to the adhesive strength using epoxy alone. When the space between the silicon steel sheet and m-aramid sheet, which is created during curing of the E-P blend, is cured with a slight weight, it is possible to control the empty space and improve adhesion.

• Journal of Adhesion and Interface
• /
• v.23 no.4
• /
• pp.108-115
• /
• 2022

In this study, we synthesized poly(itaconic acid-co-acrylamide) (IAcAAM) used as a novel polymer adhesion promoter to improve the adhesion strength of surface-treated Cu lead frames and epoxy composites. IAcAAM comprising itaconic acid, acrylamide was prepared through radical aqueous polymerization. The chemical structure and properties of IAcAAM was analyzed by FT-IR, ¹H-NMR, GPC, and DSC. The surface of the copper lead frame was treated with high temperature, alkali, and UV ozone to reduce the water contact angle and increase the surface energy. The adhesive strength of Cu lead frame and epoxy composite increased with the decrease of contact angle. The adhesive strength of Cu lead frame/epoxy composite increased with the addition of IAcAAM in epoxy composite. As silica content increased, the adhesive strength of Cu lead frame and epoxy composite tended to slightly decrease.

• Proceedings of the Korea Concrete Institute Conference
• /
• 1998.10c
• /
• pp.145-150
• /
• 1998

This study deals with the effect on performance of epoxy resign mortar mixed special cement for surface control and maintenance of aging concrete construction. The test of main property of epoxy resign in this study are the evaluation on the adhesive strength between substrate and epoxy resign mortar under the environment of wet or concrete substrate surface. We gained the test results of good adhesive strength over 15 kgf/$\textrm{cm}^2$ under the wet and dry condition of concrete surface.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.12 no.3
• /
• pp.1479-1487
• /
• 2011

In the field of the entire electronic component industry including mobile IT products, the importance of a versatile package with the multifunctional or high capacity memories is gradually increased. Multi Chip Package which has several chips in a single package is frequently used for that purpose. In MCP, epoxy adhesive films play a major role in adhesion between the chips or between chip and substrate. A series of silane coupling agents with a functional group such as epoxy, amine, mercaptan, and isocyanate were applied to the epoxy adhesives and material properties such as wettability and reliability of the adhesives were investigated. From the results, the silane coupling agent with an epoxy functional group showed highest wettability and peel strength in epoxy adhesive. For those reasons, it lead to a superior reliability in the epoxy adhesive against interfacial fracture behaviors through moisture resistance test.