• Title/Summary/Keyword: Engineering process

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Corrosion Damage Characteristics with Materials and Process Time in Ultrasonic-Chemical Decontamination of Immersion Type (침적식 초음파-화학 제염 시 재료 및 공정 시간에 따른 부식 손상 특성)

  • Lee, Seung-Jun;Hyun, Koangyong;Han, Min-Su;Kim, Seong-Jong
    • Journal of the Korean institute of surface engineering
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    • v.51 no.5
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    • pp.291-296
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    • 2018
  • In this study, we carried out an ultrasonic-chemical decontamination process with immersion type, reproduced in the laboratory. The corrosion damage characteristics, depending on kind of materials and ultrasonic process time, were investigated. Inconel 600, which showed lower corrosion potential and higher corrosion current density than that of STS 316, revealed severer corrosion damage and higher weight-loss rate than STS 316. Weight-loss rate of Inconel 600 increased with increasing ultrasonic process time. On the other hands, STS 316 presented a negligibly small corrosion damage, which was almost indistinguishable from visual observation. There was no effect of ultrasonic process time on the weight-loss rate of STS 316.

The Study on the Uniformity, Deposition Rate of PECVD SiO2 Deposition

  • Eun Hyeong Kim;Yoon Hee Choi;Hyeon Ji Jeon;Woo Hyeok Jang;Garam Kim
    • Journal of the Semiconductor & Display Technology
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    • v.23 no.2
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    • pp.87-91
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    • 2024
  • SiO2, renowned for its excellent insulating properties, has been used in the semiconductor industry as a valuable dielectric material. High-quality SiO2 films find applications in gate spacers and interlayer insulation gap-fill oxides, among other uses. One of the prevalent methods for depositing these SiO2 films is plasma enhanced chemical vapor deposition (PECVD) favored for its relatively low processing costs and ability to operate at low temperatures. However, compared to the increasingly utilized atomic layer deposition (ALD) method, PECVD exhibits inferior film characteristics such as uniformity. This study aims to produce SiO2 films with uniformity as close as possible to those achieved by ALD through the adjustment of PECVD process parameters. we conducted a total of nine PECVD processes, varying the process time and gas flow rates, which were identified as the most influential factors on the PECVD process. Furthermore, ellipsometry analysis was employed to examine the uniformity variations of each process. The experimental results enabled us to elucidate the relationship between uniformity and deposition rate, as well as the impact of gas flow rate and deposition time on the process outcomes. Additionally, thickness measurements obtained through ellipsometer facilitate the identification of optimal process parameters for PECVD.

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Effect of carbon substrate on the intracellular fluxes in succinic acid producing Escherichia coli.

  • Hong, Soon-Ho;Lee, Dong-Yup;Kim, Tae-Yong;Lee, Sang-Yup;Park, Sun-Won
    • Proceedings of the Korean Society for Bioinformatics Conference
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    • 2003.10a
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    • pp.251-257
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    • 2003
  • Metabolic engineering has become a new paradigm for the more efficient production of desired bioproducts. Metabolic engineering can be defined as directed modification of cellular metabolism and properties through the introduction, deletion, and modification of metabolic pathways by using recombinant DNA and other molecular biological tools. During the last decade, metabolic flux analysis(MFA) has become an essential tool fur metabolic engineering. By MFA, the intracellular metabolic fluxes can be quantified by the measurement of extracellular metabolite concentrations in combination with the stoichiometry of intracellular reactions and mass balances. The usefulness and functionality of MFA are demonstrated by applying to metabolic pathways in E. coli. First, a large-scale in silico E. coli model is constructed, and then the effects of carbon sources on intracellular flux distributions and succinic acid production were investigated on the basis of the uptake and secretion rates of the relevant metabolites. The results indicated that succinic acid yields increased in order of gluconate, glucose and sorbitol. Acetic acid and lactic acid were produced as major products rather than when gluconate and glucose were used carbon sources. The results indicated that among three carbon sources available, the most reduced substrate is sorbitol which yields efficient succinic acid production.

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Control of dissolved Oxygen Concentration and Specific Growth Rate in Fed-batch Fermentation (유가식 생물반응기에서의 용존산소농도 및 비성장속도의 제어)

  • Kim, Chang-Gyeom;Lee, Tae-Ho;Lee, Seung-Cheol;Chang, Yong-Keun;Chang, Ho-Nam
    • Microbiology and Biotechnology Letters
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    • v.21 no.4
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    • pp.354-365
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    • 1993
  • A novel control method with automatic tuning of PID controller parameters has been developed for efficient regulation of dissolved oxygen concentration in fed-batch fermentations of Escherichia coli. Agitation speed and oxygen partial pressure in the inlet gas stream were chosen to be the manipulated variables. A heuristic reasoning allowed improved tuning decisions from the supervision of control performance indices and it coule obviate the needs for process assumptions or disturbance patterns. The control input consisted of feedback and feedforword parts. The feedback part was determined by PID control and the feedforward part is determined from the feed rate. The proportional gain was updated on-line by a set of heuristics rules based on the supervision of three performance indices. These indices were output error covariance, the average value of output error, and input covariance, which were calculated on-line using a moving window. The integral and derivative time constants were determined from the period of output response. The specific growth rate was maintained at a low level to avoid acetic acid accumulation and thus to achieve a high cell density. The specific growthe rate was estimated from the carbon dioxide evolution rate. In fed-batch fermentation, the simutaneous control of dissolved oxygen concentration (at 0.2; fraction of saturated value) and specific growth rate (at 0.25$hr^{-1}$) was satisfactory for the entire culture period in spite of the changes in the feed rate and the switching of control input.

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The study of a novel SWRO-PRO hybrid desalination technology (SWRO-PRO 복합해수담수화 신공정기술의 연구)

  • Kim, Jisook;Yeo, Inho;Lee, Wonil;Park, Taeshin;Park, Yonggyun
    • Journal of Korean Society of Water and Wastewater
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    • v.32 no.4
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    • pp.317-324
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    • 2018
  • SWRO-PRO hybrid desalination technology is recently getting more attention especially in large desalination markets such as USA, Middle East, Japan, Singapore, etc. because of its promising potential to recover a considerable amount of osmotic energy from brine (a high-concentration solution of salt, 60,000 - 80,000 mg/L) and also to minimize the impact of the discharged brine into a marine ecosystem. By the research and development of the core technologies of the SWRO-PRO desalination system in a national desalination research project (Global MVP) supported by Ministry of Land, Infrastructure, and Transport (MOLIT) and Korea Agency for Infrastructure Technology Advancement (KAIA), it is anticipated that around 25% of total energy consumption rate (generally 3 to $4kWh/m^3$) of the SWRO desalination can be reduced by recovering the brine's osmotic energy utilizing wastewater treatment effluent as a PRO feed solution and an isobaric pressure exchanger (PX, ERI) as a PRO energy converter. However, there are still several challenges needed to be overcome in order to ultimately commercialize the novel SWRO-PRO process. They include system optimization and integration, development of efficient PRO membrane and module, development of PRO membrane fouling control technology, development of design and operation technology for the system scaling-up, development of diverse business models, and so on. In this paper, the current status and progress of the pilot study of the newly developed SWRO-PRO hybrid desalination technology is discussed.

A Study on the Debinding Process of High Purity Alumina Ceramic Fabricated by DLP 3D Printing (DLP 3D 프린팅으로 제작된 고순도 알루미나 세라믹 탈지 공정 연구)

  • Lee, Hyun-Been;Lee, Hye-Ji;Kim, Kyung-Ho;Ryu, Sung-Soo;Han, Yoonsoo
    • Journal of Powder Materials
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    • v.27 no.6
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    • pp.490-497
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    • 2020
  • The 3D printing process provides a higher degree of freedom when designing ceramic parts than the conventional press forming process. However, the generation and growth of the microcracks induced during heat treatment is thought to be due to the occurrence of local tensile stress caused by the thermal decomposition of the binder inside the green body. In this study, an alumina columnar specimen, which is a representative ceramic material, is fabricated using the digital light process (DLP) 3D printing method. DTG analysis is performed to investigate the cause of the occurrence of microcracks by analyzing the debinding process in which microcracks are mainly generated. HDDA of epoxy acrylates, which is the main binder, rapidly debinded in the range of 200 to 500℃, and microcracks are observed because of real-time microscopic image observation. For mitigating the rapid debinding process of HDDA, other types of acrylates PETA, PUA, and MMA are added, and the effect of these additives on the debinding rate is investigated. By analyzing the DTG in the 25 to 300℃ region, it is confirmed that the PETA monomer and the PUA monomer can suppress the rapid decomposition rate of HDDA in this temperature range.

OOPT: An Object-Oriented Development Methodology for Software Engineering Education (OOPT: 소프트웨어공학 교육을 위한 객체지향 소프트웨어 개발 방법론)

  • Jung, Sejin;Lee, Dong-Ah;Kim, Eui-Sub;Chang, Chun-Hyon;Yoo, Junbeom
    • Journal of KIISE
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    • v.44 no.5
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    • pp.510-521
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    • 2017
  • The software development process (SDP) plays an important basic role in software engineering education. Every software is developed in accordance with a specific SDP which contains all phases of software development. SDP education helps students to understand the overall techniques and the process of software engineering. This paper introduces a software development methodology (i.e., process) - 'OOPT (Object Oriented Process with Traceability),' which was proposed for use in university software engineering classes. The OOPT is based on object-oriented software development, and it defines concrete requirements as well as outputs of each process/phases. It also contains the unit/system testing and a traceability analysis. We have used the OOPT in software engineering classes at Konkuk university for eight years. This paper conveys our experience as well as future extension and improvement plans.

The Shear and Friction Characteristics Analysis of Inconel 718 during End-milling process using Equivalent Oblique Cutting System I -Up Endmilling- (등가경사절삭 시스템에 의한 Inconel 718 엔드밀링 공정의 전단 및 마찰특성 해석 I -상향 엔드밀링-)

  • Lee, Young-Moon;Yang, Seung-Han;Choi, Won-Sik;Song, Tae-Seong;Gwon, O-Jin;Choe, Yong-Hwan
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.2
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    • pp.79-86
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    • 2002
  • In end milling process the undeformed chip thickness and the cutting force components vary periodically with phase change of the tool. In this study, up end milling process is transformed to the equivalent oblique cutting. The varying undeformed chip thickness and the cutting force components in end milling process are replaced with the equivalent average ones. Then it can be possible to analyze the chip-tool friction and shear process in the shear plane of the end milling process by the equivalent oblique cutting system. According to this analysis, when cutting Inconel 718, 61, 64 and 55% of the total energy is consumed in the shear process with the helix angle 30$^{\circ}$, 40$^{\circ}$ and 50$^{\circ}$ respectively, and the balance is consumed in the friction process. With the helix angle of 40$^{\circ}$ the specific cutting energy consumed is smaller than with the helix angle 30$^{\circ}$ and 50$^{\circ}$.

Optically Controlled Silicon MESFET Fabrication and Characterizations for Optical Modulator/Demodulator

  • Chattopadhyay, S.N.;Overton, C.B.;Vetter, S.;Azadeh, M.;Olson, B.H.;Naga, N. El
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.10 no.3
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    • pp.213-224
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    • 2010
  • An optically controlled silicon MESFET (OPFET) was fabricated by diffusion process to enhance the quantum efficiency, which is the most important optoelectronic device performance usually affected by ion implantation process due to large number of process induced defects. The desired impurity distribution profile and the junction depth were obtained solely with diffusion, and etching processes monitored by atomic force microscope, spreading resistance profiling and C-V measurements. With this approach fabrication induced defects are reduced, leading to significantly improved performance. The fabricated OPFET devices showed proper I-V characteristics with desired pinch-off voltage and threshold voltage for normally-on devices. The peak photoresponsivity was obtained at 620 nm wavelength and the extracted external quantum efficiency from the photoresponse plot was found to be approximately 87.9%. This result is evidence of enhancement of device quantum efficiency fabricated by the diffusion process. It also supports the fact that the diffusion process is an extremely suitable process for fabrication of high performance optoelectronic devices. The maximum gain of OPFET at optical modulated signal was obtained at the frequency of 1 MHz with rise time and fall time approximately of 480 nS. The extracted transconductance shows the possible potential of device speed performance improvements for shorter gate length. The results support the use of a diffusion process for fabrication of high performance optoelectronic devices.

An Experimental Study on Optimizing for Tandem Gas Metal Arc Welding Process (탄뎀 가스메탈아크 용접공정의 최적화에 관한 실험적 연구)

  • Lee, Jongpyo;Kim, Illsoo;Lee, Jihye;Park, Minho;Kim, Youngsoo;Park, Cheolkyun
    • Journal of Welding and Joining
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    • v.32 no.2
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    • pp.22-28
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    • 2014
  • To enhance productivity and provide high quality production material in a GMA welding process, weld quality, productivity and cost reduction affects the number of process variables. In addition, a reliable welding process and conditions must be implemented to reduce weld structure failure. In various industries the welding process mathematical model is not fully formulated for the process parameter and on the welding conditions, therefore only partial variables can be predicted. The research investigates the interaction between the welding parameters (welding speed, distance between electrodes, and flow rate of shielding gas) and bead geometry for predicting the weld bead geometry (bead width, bead height). Taguchi techniques are applied to bead shape to develope curve equation for predicting the optimized process parameters and quality characteristics by analyzing the S/N ratio. The experimental results and measured error is within the range of 10% presenting satisfactory accuracy. The curve equation was developed in such a way that you can predict the bead geometry of constructed machinery that can be used for making tandem welding process.