Characteristics of Low Density Fiberboards Bonded with Different Adhesives for Thermal Insulation (II) - Formaldehyde·Total Volatile Organic Compounds Emission Properties and Combustion Shapes - (다양한 접착제로 제조한 단열재용 저밀도섬유판의 특성(II) - 폼알데하이드·총휘발성유기화합물 방출 특성 및 연소 형상 -)
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- Journal of the Korean Wood Science and Technology
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- v.45 no.5
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- pp.580-587
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- 2017