• 한국재료학회:학술대회논문집
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• 한국재료학회 1999년도 추계학술발표강연 및 논문개요집
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• pp.157-157
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• 1999

• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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• pp.101.1-101
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• 1998

• Korea-Australia Rheology Journal
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• 제12권3_4호
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• pp.165-173
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• 2000

Three-dimensional numerical simulation of isothermal/nonisothermal coextrusion process of two immiscible polymers through a rectangular channel has been done using the finite element method. The encapsulation phenomenon with the less viscous layer encapsulating the more viscous layer was investigated with the generalized Newtonian fluids. The interface position around the symmetric plane obtained by numerical simulation nearly coincided with the one observed in experiments, but the degree of encapsulation was less than the one observed experimentally. Open boundary condition method was found to be applied to the simulation of nonisothermal coextrusion process, however, the results are not far from those using the fully developed boundary condition, because the temperature development along the downstream direction is very slow in the case of convection dominated flow. When the inlet velocity is increased, the interface profile does not change in isothermal flow, while it moves upward in nonisothermal situation. The degree of encapsulation decreases along the downstream direction in nonisothermal flow. When the inlet temperature increases compared to the wall temperature, the outlet interface moves downward and the degree of encapsulation increases. The difference of degree of encapsulation between the simulation and the experiments seems to arise from the viscoelastic effect of the materials. It was concluded that the nonisothermal effect alone does not explain the complex coextrusion process and the viscoelastic effect needs to be considered.

• 한국전기전자재료학회논문지
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• 제25권10호
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• pp.849-856
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• 2012

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.198.1-198.1
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• 2016

Organic light-emitting diode (OLED) displays have promising potential to replace liquid crystal displays (LCDs) due to their advantages of low power consumption, fast response time, broad viewing angle and flexibility. Organic light emitting materials are vulnerable to moisture and oxygen, so inorganic thin films are required for barrier substrates and encapsulations.[1-2]. In this work, the silicon-based inorganic thin films are deposited on plastic substrates by plasma-enhanced chemical vapor deposition (PECVD) at low temperature. It is necessary to deposit thin film at low temperature. Because the heat gives damage to flexible plastic substrates. As one of the transparent diffusion barrier materials, silicon oxides have been investigated. $SiO_x$ have less toxic, so it is one of the more widely examined materials as a diffusion barrier in addition to the dielectric materials in solid-state electronics [3-4]. The $SiO_x$ thin films are deposited by a PECVD process in low temperature below $100^{\circ}C$. Water vapor transmission rate (WVTR) was determined by a calcium resistance test, and the rate less than $10.^{-2}g/m^2{\cdot}day$ was achieved. And then, flexibility of the film was also evaluated.

• 한국고분자학회:학술대회논문집
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• 한국고분자학회 2006년도 IUPAC International Symposium on Advanced Polymers for Emerging Technologies
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• pp.217-217
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• 2006

The surface energy control capability of electrohydrodynamic force provides electrospraying with various potential advantages such as simple particle size control, mono-dispersity, high recovery, and mild processing conditions. Herein, the one step nano-encapsulation of protein drugs using electrospraying was developed. The major processing parameters such as the conductivity of spraying liquids, flow rate, the distance between electric potentials, etc were examined to obtain the maximum efficiency. The recovery of particles was found relatively high as could be conjectured based on the principle of electrospraying. When organic solvents were employed, the processing windows of electrospraying were relatively narrow than water systems. Efficient nano-encapsulation of BSA with polymers was conveniently achieved using electrospraying at above 12 kV.

• 한국식품과학회지
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• 제31권6호
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• pp.1563-1569
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• 1999

본 연구는 분무건조를 이용한 향기성분의 미세캡슐화를 위해 maltodextrin(MD), gum arabic(GA),alkenylsuccinated modified starch(MS), gellan gum을 피복물질로 사용하여 배합비율을 최적화하는데 목표를 갖고 수행되었다. 핵물질은 특성이 다른 5종류의 향기성분을 채종유와 1 : 4의 비율로 혼합한 flavor model system으로 사용하였다. 예비실험을 통해 핵물질 : 피복물질의 비율을 1 : 4로 하였으며, MD함량은 30%로 고정하였다. GA : MS를 $2\;:\;8{\sim}8\;:\;2$의 비율로 제조하여 유화액에서의 특성을 분석한 결과, GA : MS = 4 : 6에서 유화안정성이 우수하였으며, flavor release가 가장 적었다 이 비율에 gellan gum을 $1{\sim}5%$ 첨가하여 실험한 결과, 4% 첨가한 것이 결과가 가장 우수하였다. 이상의 결과로 MD : GA : MS : gellan gum = 30 : 26.4 : 37.6 : 4의 배합비율이 분무건조를 이용한 향기성분의 미세캡슐화를 위한 피복물질의 최적 배합조건이었다.

• 마이크로전자및패키징학회지
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• 제28권2호
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• pp.1-12
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• 2021

3차원 인쇄 기술은 제품의 설계를 3차원으로 하여 조립없이 제품의 생산까지의 시간을 획기적으로 줄이고 복잡한 구조도 구현할 수 있어 미래의 기술로 각광받고 있다. 본 논문은 3차원 인쇄기술을 이용한 전자소자에 대한 최근 연구동향을 알아보면서 구성품, 전원공급장치와 회로에서의 연결과 3차원 인쇄기술 PCB의 응용한 연구논문들을 소개하고 있다. 3차원 인쇄기술로 제작한 전자소자는 원스톱으로 전자소자, 솔더링(soldering), 스태킹(stacking), 회로의 봉지막(encapsulation)까지 제작함으로써 생산설비의 단순화와 전자기기를 개인 맞춤형을 할 수 있는 가능성을 보여주었다.

• 한국전기전자재료학회논문지
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• 제25권5호
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• pp.381-386
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• 2012

To study encapsulation method for large-area organic light emitting diodes (OLEDs), red emitting OLEDs were fabricated, on which $Alq_3$ as organic buffer layer and LiF and Al as inorganic protective layers were deposited to protect the damage of OLED by epoxy. And then the OLEDs were attached to flat glass by printing method using epoxy. The basic structure of OLED doped with rubrene of 1 vol.% as emitting layer is ITO(150 nm) / 2-TNATA(50 nm) / ${\alpha}$-NPD(30 nm) / $Alq_3$:Rubrene(30 nm) / $Alq_3$(30 nm) / LiF(0.7 nm) / Al(100 nm). In case of depositing $Alq_3$, LiF and Al and then attaching of flat glass onto OLED, current density, luminance, efficiency and driving voltage were not changed and lifetime was increased according to thickness of Al as inorganic protective layers. The lifetime of OLED/$Alq_3$/LiF/Al_4/glass structure was 139 hours increased by 15.8 times more than bare OLED of 8.8 hours and 1.6 times more than edge sealed OLED of 54.5 hours.

• Food Science and Biotechnology
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• 제18권1호
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• pp.157-161
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• 2009

Resveratrol-loaded poly($\varepsilon$-caprolactone) (PCL) nanoparticles were prepared by oil in water (O/W) emulsion solvent evaporation method. The morphology of the nanoparticles was evaluated using atomic force microscope (AFM), in which well-shaped and rigid nanoparticles were prepared. The mean particle size of nanoparticles prepared using only dichloromethane (DCM) ($523.5{\pm}36.7\;nm$) was larger than that prepared with a mixture of DCM and either ethanol (EtOH) ($494.5{\pm}29.2\;nm$) or acetone ($493.5{\pm}6.9\;nm$). The encapsulation efficiency of nanoparticles prepared only with DCM as dispersed phase ($78.3{\pm}7.7%$) was the highest of those prepared with solvent mixtures. An increase in the molecular weight of PCL led to an increase in encapsulation efficiency (from $78.3{\pm}7.7$ to $91.4{\pm}3.2%$). Pluronic F-127 produced the smallest mean size ($523.5{\pm}36.7\;nm$) with the narrowest particle size distribution. These results show that dispersed phase, molecular weight of wall materials, emulsion stabilizer could be important factors to affect the properties of nanoparticles.