• 제목/요약/키워드: Encapsulation Process

검색결과 162건 처리시간 0.029초

졸-겔법을 이용한 광증폭기의 Er 이온 캡슐화 및 광학적 특성 (Encapsulation and optical properties of Er3+ ions for planar optical amplifiers via sol-gel process)

  • Kim, Joo-Hyeun;Seok, Sang-Il;Ahn, Bok-Yeop
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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    • pp.135-135
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    • 2003
  • The fast evolution in the fold of optical communication systems demands powerful optical information treatment. These functions can be performed by integrated optical systems. A key component of such systems is erbium doped waveguide amplifier(EDWA). The intra 4f radiative transition of Er at 1.5 $\mu\textrm{m}$ is particularly interesting because this wavelength is standard in optical telecommunications. The fabrication of waveguide amplifier for integrated optics using sol-gel process has received an increasing attention. Potential advantage of lower cost by less capital equipment and easy processing makes this process an attractive alternatives to conventional technologies like flame hydrolysis deposition, ion exchange and chemical vapor deposition, etc. In addition, sol-gel process has been found to be extremely suitable for the control of composition and refractive index related directly with optical properties. The main drawback of such an amplifier with respect to the EDWA is the need for a much higher Er3+ concentration to compensate for the smaller interaction length. However, the high doping of Er might be resulted in the non-radiative relaxation by clustering of Er ions End co-operative upconversion. In order to solve this problem, we investigate the possibility of avoiding short Er-Er distances by encapsulation of Er3+ ions in hosts such as organic-inorganic hybrid materials. For inorganic-organic hybrid sols, methacryloxypropyltrimethoxysilane (MPTS), zirconyl chloride octahydrate and erbium(III) chloride hexahydrate were used as starting materials, followed by conventional sol-gel process. It was observed by TEM that nano sols having core/shell toplology were formed, depending on the mole ratio of Zr/Er. The surface roughness for the coatings on Si substrate was investigated by AFM as a function of Zr/Er ratio. The local environment and vibrational Properties of Er3+ ions were studied using Near-IR, FT-IR, and UV/Vis spectroscopy. Nano hybrid coatings derived from polymer and Er doped encapsulation Eave the good luminescence at 1.55$\mu\textrm{m}$.

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고준위폐기물 처분공정 개념분석을 위한 가상환경 구축 (Implementation of a Virtual Environment for the HLW Disposal Process Analyses)

  • 이종열;조동건;최희주;김성기;최종원
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.1636-1639
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    • 2005
  • The process equipment and remote handling for the deep geological disposal of high-level radioactive waste(HLW) should be checked prior to the operation in view of reliability and operability. In this study, the concept of virtual environment workcell is implemented to analyze and define the feasible disposal process instead of real mock-up, which is very expensive and time consuming. To do this, the parts of process equipment for the disposal and maintenance will be modeled in 3-D graphics, assembled, and kinematics will be assigned. Also, the virtual workcell for the encapsulation and disposal process of spent fuel will be implemented in the graphical environment, which is the same as the real environment. This virtual workcell will have the several functions for verification such as analyses for the equipment's work space, the collision detection, the path planning and graphic simulation of the processes etc. This graphic virtual workcell of the HLW disposal process can be effectively used in designing of the processes for the hot cell equipment and enhance the reliability of the spent fuel management.

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Encapsulation of Lactobacillus rhamnosus GG Using Milk Protein-Based Delivery Systems: Effects of Reaction Temperature and Holding Time on Their Physicochemical and Functional Properties

  • Ayu, Istifiani Lola;Ha, Ho-Kyung;Yang, Dong-Hun;Lee, Won-Jae;Lee, Mee-Ryung
    • 한국축산식품학회지
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    • 제41권5호
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    • pp.894-904
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    • 2021
  • Microencapsulation is a protective process for materials that are sensitive to harsh conditions encounted during food manufacture and storage. The objectives of this research were to manufacture a milk protein-based delivery system (MPDS) containing Lactobacillus rhamnosus GG (LGG) using skim milk powder and to investigate the effects of manufacturing variables, such as reaction temerpature and holding time, on the physiccohemical properties of MPDS and viability of LGG under dairy food processing and storage conditions. MPDS was prepared using chymosin at varing reaction temperatures from 25℃ to 40℃ for 10 min and holding times from 5 to 30 min at 25℃. The morphological and physicochemical properties of MPDS were evaluated using a confocal laser scanning microscope and a particle size analyzer, respectively. The number of viable cells were determined using the standard plate method. Spherical-shaped MPDS particles were successfully manufactured. The particle size of MPDS was increased with a decrease in reaction temperature and an increase in holding time. As reaction temperature and holding time were increased, the encapsulation efficiency of LGG in MPDS was increased. During pasteurization, the use of MPDS resulted in an increase in the LGG viability. The encapsulation of LGG in MPDS led to an increase in the viability of LGG in simulated gastric fluid. In addition, the LGG viability was enhanced with an increase in reaction temperature and holding time. In conclusions, the encapsulation of LGG in MPDS could be an effective way of improving the viability of LGG during pasturization process in various foods.

금속판으로 봉인된 유-무기 보호 박막을 갖는 OLED 봉지 방법 (Encapsulation Method of OLED with Organic-Inorganic Protective Thin Films Sealed with Metal Sheet)

  • 임수용;서정현;주성후
    • 한국전기전자재료학회논문지
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    • 제26권7호
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    • pp.539-544
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    • 2013
  • To study the encapsulation method for heat dissipation of high brightness organic light emitting diode (OLED), red emitting OLED of ITO (150 nm) / 2-TNATA (50 nm) / NPB (30 nm) / $Alq_3$ : 1 vol.% Rubrene (30 nm) / $Alq_3$ (30 nm) / LiF (0.7 nm) / Al (200 nm) structure was fabricated, which on $Alq_3$ (150 nm) / LiF (150 nm) as buffer layer and Al as protective layer was deposited to protect the damage of OLED, and subsequently it was encapsulated using attaching film and metal sheet. The current density, luminance and power efficiency was improved according to thickness of Al protective layer. The emission spectrum and the Commission International de L'Eclairage (CIE) coordinate did not have any effects on encapsulation process using attaching film and metal sheet The lifetime of encapsulated OLED using attaching film and metal sheet was 307 hours in 1,200 nm Al thickness, which was increased according to thickness of Al protective layer, and was improved 7% compared with 287 hours, lifetime of encapsulated OLED using attaching film and flat glass. As a result, it showed the improved current density, luminance, power efficiency and the long lifetime, because the encapsulation method using attaching film and metal sheet could radiate the heat on OLED effectively.

Characterization of Al2O3 Thin Film Encasulation by Plasma Assisted Spatial ALD Process for Organic Light Emitting Diodes

  • Yong, Sang Heon;Cho, Sung Min;Chung, Ho Kyoon;Chae, Heeyeop
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.234.2-234.2
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    • 2014
  • Organic light emitting diode (OLED) is considered as the next generation flat panel displays due to its advantages of low power consumption, fast response time, broad viewing angle and flexibility. For the flexible application, it is essential to develop thin film encapsulation (TFE) to protect oxidation of organic materials from oxidative species such as oxygen and water vapor [1]. In many TFE research, the inorganic film by atomic layer deposition (ALD) process demonstrated a good barrier property. However, extremely low throughput of ALD process is considered as a major weakness for industrial application. Recently, there has been developed a high throughput ALD, called 'spatial ALD' [2]. In spatial ALD, the precursors and reactant gases are supplied continuously in same chamber, but they are separated physically using a purge gas streams to prevent mixing of the precursors and reactant gases. In this study, the $Al_2O_3$ thin film was deposited by spatial ALD process. We characterized various process variables in the spatial ALD such as temperature, scanning speed, and chemical compositions. Water vapor transmission rate (WVTR) was determined by calcium resistance test and less than $10-^3g/m^2{\cdot}day$ was achieved. The samples were analyzed by x-ray photoelectron spectroscopy (XPS) and field emission scanning electron microscope (FE-SEM).

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고로쇠 수피 수용성 추출물의 나노입자화를 통한 항암활성 증진 (Enhancement of Anticancer Activity of Acer mono Aqueous Extracts by Nano-Encapsulation Process)

  • 김지선;정명훈;최운용;서용창;조정섭;이현용
    • 한국산림과학회지
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    • 제100권1호
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    • pp.14-24
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    • 2011
  • 고로쇠 수피 수용성 추출물의 나노입자화를 통하여 항암활성 증진에 대하여 연구하였다. 먼저 세포독성 측정결과 인간 정상 폐 세포(HEL299)에 대하여 일반 열수 추출물이 1.0 mg/mL의 농도에서 23.51%로 나노입자에 비하여 낮은 세포독성을 나타내었다. 그리고 DPPH radical 소거 활성 실험결과 고로쇠 추출물 나노입자가 높은 항산화 활성을 나타내었고, SOD 유사활성 결과에서도 1.0 mg/mL의 농도에서 32.33%로 일반 열수 추출물에 비하여 높은 항산화 활성을 나타내었다. 인간 위암세포, 간암세포, 유방암세포 그리고 폐암세포에 대하여 암세포 억제 활성 측정결과 고로쇠 추출물 나노입자의 경우 1.0 mg/mL의 농도에서 59-73%의 억제 활성을 나타내었다. 나노입자의 경우 일반 열수 추출물에 비하여 약 5-10% 이상 증진된 활성을 보였다. 그리고 여러 인간 암세포주에 대한 항암실험 결과, 소화기계통의 암세포주에 대하여 71-73%의 암세포 억제 활성을 나타내어 다른 암세포주에 비하여 높은 암세포억제 활성을 보였다. 이러한 결과를 인간 위암세포인 AGS로의 나노입자 침투를 confocal microscope 관찰을 통하여 확인하였다. 위와 같은 결과를 바탕으로 하여 고로쇠 추출물을 나노입자화 공정을 통하여 활성 증진을 확인하였고, 천연 항산화제, 항암소재로서의 활용이 가능할 것으로 사료된다.

In-situ formation of co particles encapsulated by graphene layers

  • Minjeong Lee;Gyutae Kim;Gyu Hyun Jeong;Aram Yoon;Zonghoon Lee;Gyeong Hee Ryu
    • Applied Microscopy
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    • 제52권
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    • pp.7.1-7.6
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    • 2022
  • The process of encapsulating cobalt nanoparticles using a graphene layer is mainly direct pyrolysis. The encapsulation structure of hybrids prepared in this way improves the catalyst stability, which greatly reduces the leaching of non-metals and prevents metal nanoparticles from growing beyond a certain size. In this study, cobalt particles surrounded by graphene layers were formed by increasing the temperature in a transmission electron microscope, and they were analyzed using scanning transmission electron microscopy (STEM). Synthesized cobalt hydroxide nanosheets were used to obtain cobalt particles using an in-situ heating holder inside a TEM column. The cobalt nanoparticles are surrounded by layers of graphene, and the number of layers increases as the temperature increases. The interlayer spacing of the graphene layers was also investigated using atomic imaging. The success achieved in the encapsulation of metallic nanoparticles in graphene layers paves the way for the design of highly active and reusable heterogeneous catalysts for more challenging molecules.

WLP and New System Packaging Technologies

  • WAKABAYASHI Takeshi
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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    • pp.53-58
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    • 2003
  • The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

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THE STUDY ON STABLE EMULSION SYSTEM AND SELECTIVE ADDITION OF ACTIVE INGREDIENT IN W/O/W ONE STEP MULTIPLE EMULSION

  • Kim, Se-gie;Park, Hee-nam;Kim, Tae-kyoo
    • 대한화장품학회지
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    • 제24권3호
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    • pp.96-104
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    • 1998
  • It was possible to produce W/O/W one step multiple emulsion on the system which satisfied following conditions. 1. 1-5% of hydrophilic liquid surfactant over HLB20 and lipophilic liquid surfactant which has HLB 3∼5 2. Non wax copolymers as oil thickener 3. More than 0.5% of carbomer as aqueous thickener 4. The manufacturing process which neutralize the dispersed carbomer (2.0% in water), after emulsifying. For the selective addition into inner and outer aqueous phase, we melted the glucose in water before emulsifying. Using an Anthrone analysis method, we analyzed the encapsulation yield of glucose in inner water phase. It was possible to raise the water encapsulation yield of the multiple emulsion through the following conditions. 1. Using of anionic hydrophilic surfactant(HLB 40) and lipophilic surfactant (HLB 3∼5) 2. Controlling the ratio of hydrophilic surfactant and lipophilic surfactant 3. Strengthening interface with increase of non wax oil thickener. When the separated adding process of glucose was adopted, approximately 85% of glucose was added selectively within inner aqueous phase.

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