• 반도체디스플레이기술학회지
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• 제13권4호
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• pp.15-20
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• 2014

The fracture analysis of $SiN_x$ layers, which were deposited by low-temperature plasma enhanced chemical vapor deposition (LT-PECVD) and could be used for an encapsulation layer of a flexible organic light emitting display (OLED), was performed by an electrical method. The specimens of metal-insulator-metal (MIM) structure were prepared using Pt and ITO electrodes. We stressed MIM specimen mechanically by bending outward with a bending radius of 15mm repeatedly and measured leakage current through the top and bottom electrodes. We also observed the cracks, were generated on surface, by using optical microscope. Once the cracks were initiated, the leakage current started to flow. As the amount of cracks increased, the leakage current was also increased. By correlating the electrical leakage current in the MIM specimen with the bending times, the amount of cracks in the encapsulation layer, generated during the bending process, was quantitatively estimated and fracture behavior of the encapsulation layer was also closely investigated.

• 한국통신학회논문지
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• 제32권11B호
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• pp.693-699
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• 2007

본 논문은 지상파 DMB에서 효율적인 IP 인캡슐레이션 방법을 제안한다. 단방향으로 전송되는 멀티미디어 시스템에서 데이터 통신을 효과적으로 하기 위해서는 데이터의 신뢰성이 무엇보다 요구된다. 또한 리턴 채널의 비용이 상대적으로 크기 때문에 데이터의 인캡슐레이션에서도 충분한 분석이 필요하다. 이러한 부분을 고려해서 지상파 DMB에서 요구되는 IP 데이터그램 전송을 위해 이론적으로 분석하려고 한다. 지상파 DMB에 전송하게 됨으로써 연동형 및 독립형 데이터서비스를 선택적으로 할 수 있다. 보다 안정적인 서비스를 위해서 IP 인캡슐레이션하는 과정에서 생기는 전송 오버헤드를 분석하고, 지상파 DMB에 적용 시 단말기의 호환성을 검토하는 과정이 검토한다. 표준에서 제안하는 방법과 지상파 DMB에서 적용 가능한 인캡슐레이션 방법을 비교해서 보다 효과적인 IP 인캡슐레이션 전송 방법을 도출한다.

• 반도체디스플레이기술학회지
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• 제20권3호
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• pp.22-26
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• 2021

Thin-film encapsulation (TFE) technology is most effective in preventing water vapor and oxygen permeation in the organic light emitting diodes (OLED). Of those, a laminated structure of Al₂O₃ and MgO were applied to provide efficient barrier performance for increasing the stability of devices in air. Atomic layer deposition (ALD) method is known as the most promising technology for making the laminated Al₂O₃/MgO and is used to realize a thin film encapsulation technology in organic light-emitting diodes. Atomic layer deposited inorganic films have superior barrier performance and have advantages of excellent uniformity over large scales at relatively low deposition temperatures. In this study, the control system of the MgCP₂ precursor for the atomic layer deposition of MgO was established in order to deposit the MgO layer stably by the injection time of second level and the stable heating temperature. The deposition rate was obtained stably to be from 4 to 10 Å/cycle using the injection pulse times ranging from 3 to 12 sec and a substrate temperature ranging from 80 to 150 ℃.

• 방사선산업학회지
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• 제17권4호
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• pp.519-532
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• 2023

Spent nuclear fuel(SNF) is stored in nuclear power plants for a certain period of time and then transported to an interim storage facility. After that, SNF is finally repackaged in a disposal canister at an encapsulation plant for final disposal. Finland and Sweden, leading countries in SNF disposal technology, have already completed designing of spent fuel encapsulation plant. In particular, the encapsulation plant construction in Finland is near completion. When it comes to South Korea, as the amount of SNF production and disposal plan is different from those in Finland and Sweden, it is difficult to apply the concepts of these contries as is. Therefore, it is necessary to establish the spent fuel repackaging concept and to derive each operating and repackaging procedures by considering annual disposal plan of South Korea. The results of this study is expected to be used to establish the concept of optimized encapsulation plant through further research.

• 마이크로전자및패키징학회지
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• 제7권4호
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• pp.17-22
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• 2000

In this paper, methods to analyze wire sweep during the semiconductor chip encapsulation have been studied. The wire sweep analysis is used to analyze the deformation of bonding wires that connect the chip to the leadframe during encapsulation. The analysis is done using either analytical solutions or numerical simulation. The analytical solution is used for rough but fast calculation of wire sweep. The results from the numerical simulation are closest to the experimental results.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1699-1702
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• 2007

We will discuss encapsulation of OLEDs on both flexible and rigid glass substrates. Accelerated testing at 6CC/90RH and 85C/85RH is compared and acceleration factors for OLED and Calcium test samples are discussed.We have tested the stability and performance of our barrier coating to much higher temperatures: up to 140 C. Water Vapor Transmission rates at temperatures from 60 to 140 C are presented. Rates and methods for low cost manufacturing on a large scale are analysed

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1634-1637
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• 2008

We will discuss encapsulation of OLEDs on both flexible and rigid glass substrates. Accelerated testing at 6CC/90RH and 85C/85RH is compared and acceleration factors for OLED and Calcium test samples are discussed.We have tested the stability and performance of our barrier coating to much higher temperatures: up to 140 C. Water Vapor Transmission rates at temperatures from 60 to 140 C are presented. Rates and methods for low cost manufacturing on a large scale are analysed.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2003년도 추계학술대회 발표 논문집
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• pp.154-159
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• 2003

Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

• 정보보호학회지
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• 제14권5호
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• pp.44-49
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• 2004

비밀키 암호의 키 관리 문제를 해결하기 위해 제안된 공개키 암호는 효율성이나 제한된 메시지 영역으로 인해, 실제로는 메시지의 암호화에는 비밀키 암호를 사용하고 이때 사용되는 키를 메시지를 보낼 상대방과 안전하게 공유하기 위한 용도로 공개키 암호를 사용하는 하이브리드 형태가 일반적으로 사용된다. 최근 Shoup에 의해 제안된 Key Encapsulation Mechanism (KEM)은 이러한 공개키 암호의 실제 사용 용도를 감안하여 제안된 모델로 Data Encapsulation Mechanism (DEM)과 함께 안전한 하이브리드 공개키 암호를 설계하는 하나의 이론적인 모델을 제시하며, 이를 이용하여 만들어진 하이브리드 암호는 최근의 공개키 암호 표준화 작업에서 하나의 주류로 받아들여지고 있다. 본 논문에서는 최근 공개키 암호의 새로운 적용 방식으로 주목받고 있는 KEM과 함께, 이와 관련된 공개키 암호 표준화 작업에 대해서 구체적으로 알아본다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.395-395
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• 2012

We fabricate organic-inorganic hybrid thin film for the purpose of encapsulation by molecular layer deposition (MLD) using Trimethylaluminium (TMA) and Adipoyl Chloride (AC). Ellipsometry was employed to verify self limiting reaction of ALD. Linear relationship between number of cycle and thickness was obtained. We found that desirable organic thin film fabrication is possible by MLD surface reaction in nanoscale. Purging was carried out after dosing of each precursor to form monolayer in each sequence. We also confirmed roughness of the organic thin film by atomic force microscopy. We deposit TMA and AC at $70^{\circ}C$ and that 1.78A root mean square was obtained which indicates that uniform organic thin film was formed. We confirmed precursor's functional group by IR spectrum. We calculated WVTR of organic-inorganic hybrid super-lattice epitaxial layer using Ca test. WVTR indicates superlattice film can be possibly use as encapsulation in flexible devices.