• The KIPS Transactions:PartD
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• v.13D no.2 s.105
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• pp.259-270
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• 2006

Because a medical embedded software is the software that control the medical devices that are relevant to a human life, it requires high qualify level. It is requires to develop and apply the quality test module that suitable for the requirements to meet the high quality requirements of the medical embedded software. Also, it needs to develop the process that complement the quality defects of software by feedback of the test result. In this study, we developed test module and quality inspection table which can test medical embedded software and produce result based on ISO/IEC 12119.

• Journal of KIISE:Computing Practices and Letters
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• v.16 no.5
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• pp.576-580
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• 2010

Generally, due to the strong coherence between embedded software and hardware or peripheral software, embedded software is tested by using black-box test based on user scenario for the whole system. This paper suggests the method to coordinate between testing and debugging under consideration for difficulties on solving out the defects detected from black-box test. First of all, from test result analysis, it builds up the debugging strategies enable to trace the locations of the defect's causes. And along with the strategies, it implements the generator of test scripts to be performed on the emulator environment. Through these steps, it can coordinate embedded software testing and debugging activities.

• Geomechanics and Engineering
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• v.29 no.4
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• pp.407-420
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• 2022

Embedded piles, which are typically used in Korea, are precast piles inserted into prebored ground with cement paste. Dynamic pile tests tend to underestimate the bearing capacity of embedded piles because of the undeveloped shaft resistance prior to the curing of the cement paste and the insufficient energy transferred after the curing. In this study, a resistance combination method using the base resistance before the cement paste is cured and the shaft resistance after the cement paste is cured is proposed to obtain a combined load-settlement curve from dynamic pile tests. Two pairs of embedded piles with diameters of 600 and 500 mm are installed. Each pair comprises one pile for the dynamic pile test and another pile for the static load test. The shape of the load-settlement curve obtained using the proposed method is similar to that obtained from the static load test. Thus, the resistances evaluated using the proposed method at selected settlements are similar to those obtained from the static load test. This study shows that the resistance combination method may be used effectively in dynamic pile tests to accurately evaluate the bearing capacity of embedded piles.

• IEMEK Journal of Embedded Systems and Applications
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• v.5 no.1
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• pp.29-38
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• 2010

It is highly requested that the more complicated embedded software is used for high performance and multiple functions of the systems. This is inevitably increasing the errors. Therefore the embedded software testing is getting important recently. There are not general testing methods which are able to be applied for any embedded systems, but via this research, we introduce a testing method which is based on TTCN-3, a testing standard, for embedded systems. A testing environment for network-based embedded software is implemented with considering the features of TTCN-3 testing which is based on message exchange. The testing environment has two additional parts with TTCN-3 test system, the network analyzer to access the network-based systems and the communication interface which is suggested for embedded systems in previous work, and we have implemented the whole testing environment with interacting these two parts. In addition to the normal testing domain, called single node testing as a unit testing of V-model, we suggest another concept to test multiple nodes in network. It could be achieved by adding keywords such as supervisor and object which are describing the feature of TTCN-3 testing component and generating the TTCN-3 Executable code which contains new keywords. The testing has done for embedded software which is based on CAN network and the demonstration of the testing environment has been shown in this paper.

• Journal of the Korea Concrete Institute
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• v.24 no.4
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• pp.445-452
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• 2012

In this study, experimental research was carried out to evaluate the structural performance of the reinforced concrete beam using strengthening materials (embedded FRP rod, metal fittings) in existing reinforced concrete buildings. Seven reinforced concrete beams comprised of retrofitted embedded FRP rod (BCR series), embedded FRP rod with metal fittings (BCR-AC series), and standard specimen (BSS) were constructed and tested under monotonic loading. Design parameters of test specimens were amount of embedded FRP rod and metal fittings. The test results showed that the maximum load carrying capacity of specimens with embedded FRP rod (BCR series) and embedded FRP rod with metal fittings (BCR-AC series) increased by 21~55% and 21~63%, respectively, in comparison with the standard specimen BSS. BCR series test specimens failed by the adhesion slip and concrete cover separation. BCR-AC series test specimens failed by the adhesion slip due to the confining effect of metal fittings.

• The KIPS Transactions:PartD
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• v.13D no.7 s.110
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• pp.923-930
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• 2006

In this paper we design the system test model for the weapon system embedded software based on the Time Factor Method(TFM) considering time factors and suggest the results through the case study. For doing this, we discuss the features, system tests and the object-oriented model based UML notations of the weapon system embedded software. And we give a test method considering time factors, a measuring method to time factors, and a test case selection algorithm as an approach to the TFM for designing the system test model. The TFM based system test model consists of three factors (X, Y, Z) in the weapon system embedded software. With this model, we can extract test cases through the selection algorithm for a maximum time path in 'X', identify the objects related to the Sequence Diagram in 'Y' and measure the execution time of each objects which is identified by the Timing Diagram in 'Z' Also, we present the method of extracting the system test cases by applying the proposed system test model to the 'Multi-function missile defense system'.

• Journal of the Korea Society of Computer and Information
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• v.13 no.6
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• pp.95-105
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• 2008

Recently use of embedded software has been increased to different areas. The requirements and demands for the embedded software have also been altered. In the past, the embedded system was used in simple task and small portable devices but now, the usage of the embedded software has expanded to do much more complex and precise actions in a variety platform environment. The embedded software enables multiple softwares to be integrated into one and at the same time, control it. Currently the biggest challenges embedded software is facing during its development process is the improvement in product production and quality assurance. Our research team has developed an embedded software based on the component (technology or methodology) which both improves production capabilities as well as quality. Additionally, we also established and constructed a reliability test system which can effectively test the quality of the developed embedded software to further increase its competiveness.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.914-917
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• 2008

A quad-functional built-in test circuit has been developed for DRAM-frame-memory embedded SOG-LCDs. The quad function consists of memory test, display test, serial transfer test, and parallel transfer test which is the normal operation mode for our SOG-LCD. Results of memory and display tests are shown.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.22 no.7
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• pp.1394-1402
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• 1997

In this work, an efficient test algorithm and BIST architeture a for embedded memories are presented. The proposed test algorithm can fully detect stuck-at fault, transition fault, coupling fault. Moreover, the proposed test algorithm can detect nighborhood pattern sensitive fault which could not be detected in previous march test algoarithms. The proposed test algorithm perposed test algorithm performs testing for neghborhood pattern sensitive fault using backgroung data which has been used word-oriented memory testing.