• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.607-610
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• 2003

The characteristic prediction and analysis of 3-dimensional (3-D) solenoid-type embedded inductors is investigated. The four different structures of 3-D inductor are fabricated by using low-temperature cofired ceramic (LTCC) process. The circuit model parameters of the each building block are optimized and extracted using the partial element equivalent circuit method and HSPICE circuit simulator. Based on the model parameters, predictive modeling is applied for the structures composed of the combination of the modeled building blocks. And the characteristics of test structures, such as self-resonant frequency, inductance and Q-factor, are analyzed. This approach can provide the characteristic conception of 3-D solenoid embedded inductors for structural variations.

• Journal of KSNVE
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• v.11 no.3
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• pp.422-427
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• 2001

In this paper is presented passive-active noise control in a duct using a ring-type smart foam. The ring-type smart foam is comprised of a PVDF film embedded in elastic noise control foam of lining shape. The embeddedPVDF element acts as an actuator to reduce noise at lower frequencies and the foam absorbs noise at higher frequencies. By implementing an adaptive filtered-x LMS algorithm, experiments are performed to reduce both tonal and broadband noise in a duct with one end closed and the other end open.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.75-81
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• 2015

In this paper, numerical analysis by finite element method and parameter design by the Taguchi method were used to reduce warpage of a two passive components embedded double side substrate for PoP(Package on Package). The effect of thickness of circuit layers (L1, L2) and thickness of solder resist (SR_top, SR_BTM) were analyzed with 4 variations and 3 levels(minimum, average and maximum thickness) to find optimized thickness conditions. Also, paste effect of solder resist on unit area of top surface was analyzed. Finally, experiments was carried out to prove numerical analysis and the Taguchi method. Based on the numerical and experimental results, it was known that circuit layer in ball side of substrate was the most severe determining deviation for reducing warpage. Buried circuit layer in chip side, solder resist and were insignificant effects on warpage relatively. However, warpage decreased as circuit layer in ball side thickness increased but effect of solder resist and circuit layer in chip side thickness were conversely.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.151-154
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• 2001

Shape memory alloy (SMA) has demonstrated its potentials for various smart structure applications. SMA wires undergo a reversible phase transformation from martensite to austenite as temperature increases. This transformation leads to shape recovery and associated recovery strains. If SMA actuators are embedded off the neutral surface and are oriented in arbitrary angles with respect to a beam axis, then the beam bends and twists due to the coupling effects of recovery strains activated. In this study, the bending and twisting of a SMA/Composite beam were controlled by both electric resistive heating and passive elastic tailoring. 3-dimensional finite element formulations were derived and validated to analyze the responses of the SMA/Composite beam. Numerical results show that the shape of the SMA/Composite beam can be controlled by judicious choices of control temperatures, SMA angles, and elastic tailoring.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.322-322
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• 2008

Low-temperature co-fired ceramics (LTCC) have turned out to be very promising technology in accordance with the rapid developments in semiconductor technology. The demands for compact electrical assemblies, smaller power loss as well as high signal density can be fulfilled by LTCC. And for the multi-layered ceramic devices with embedded passive components such as high dielectric constant decoupling capacitor, LTCC materials require the several conditions to avoid delamination and internal cracks. For the present study, diopside-based glass is chosen as the LTCC substrate material in view of its high coefficient of thermal expansion (CTE). From the experimental resultsn the influence of each element on the CTE change can be revealed.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.53 no.11
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• pp.680-686
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• 2004

An integrated inductor using the low temperature cofiring ceramics(LTCC) technology was fabricated. The inductor has Ag circular spiral coil with 16 turns (2-turn x 8-layer) and has a dimension of 11.52mm diameter and 0.71mm thick. For the fabricated inductor, calculation method of inductance was given and it is confirmed that the calculated value is very close to the measured one. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC buck DC/DC converter with 1.32W output power and 1MHz switching frequency using the inductor fabricated was developed. For the converter the maximum efficiency of about 81% was obtained.