• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3286-3288
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• 1999

The electrostatically actuated test structure was presented to measure the micro mechanical characteristics of micromaterials as thin films forming the microactuators. The test structure was fabricated by the surface micromachining processes and driven by the electrostatic force, In order to measure the fracture toughness, the sharp notch in the test structure was introduced by the etching process. On the basis of the beam bending theory, the elastic modulus was measured by using the microcantilevr beam and the mechanical displacement, curvature and deflection curve under the electrostatic force was evaluated by using the electrostatic structure.

• Journal of Institute of Convergence Technology
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• v.1 no.2
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• pp.6-15
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• 2011

This paper reports the design and fabrication of a micro-electro-mechanical-system(MEMS)-based electrostatic angular microactuator for a dual-stage servo. The proposed actuator employs a novel electrode pattern named "skewed electrode array(SEA)" scheme. It is shown that SEA has better linearity than a parallel plate type actuator and stronger force than a comb-drive based actuator. The moving and the fixed electrodes are arranged to make the driving force perpendicular to the rotating moment of arm. By changing the electrode overlap length, the magnitude of electrostatic force and stable displacement will be changed. In order to optimize the design, an electrostatic FE analysis was carried out and an empirical force model was established for SEA. A new assembly method which will allow the active electrodes to be located beneath the slider was developed. The active electrodes are connected by inner and outer rings lifted on the base substrate, and the inner and outer rings are connected to platform on which the slider locates. Electrostatic force between active electrodes and platform can be used for exiting out of plane modes, so this provides the possibility of the flying height control. A microactuator that can position the pico-slider over ${\pm}0.5{\mu}m$ using under 20 volts for a 2 kHz fine-tracking servo was designed and fabricated using SoG process.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.12-18
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• 2024

A Electrostatic chuck is a device that fixes the substrate, using the force between charges applied between two parallel plates to attract substrates such as wafers or OLED panels. Unlike mechanical suction methods, which rely on physical fixation, this method utilizes the force of electrostatics for fixation, making it important to verify the adhesion force. As the size of the substrate increases, deformations due to gravity or chucking force also increase, and the adhesion force decreases rapidly as the distance between the chuck and the substrate increases. The outlook for displays is shifting from small to large OLEDs, necessitating consideration of substrate deformations. In this paper, to confirm the deformation of the substrate through various patterns, a simplified 2D model using Ansys' electromagnetic field analysis program, Maxwell, and the static structural analysis program, Mechanical, was utilized to observe changes in adhesion force according to the variation in the air gap between the substrate and the chuck. Additionally, the chucking force was analyzed for the size of the substrate, and the deformation of the substrate was confirmed when gravity and chucking force act simultaneously.

• Proceedings of the KIEE Conference
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• 1994.11a
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• pp.422-424
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• 1994

A comb drive electrostatic micro gripper was designed and fabricated. We designed it analytically using electrostatic force and cantilever deflection equation. In fabrication, we used LIGA-like technology consisted of Ni electroplating through polyimide patterned by $O_2$ Plasma RIE and Al sacrificial layer. This micro gripper was designed to handle an optical fiber which is $125{\mu}m$ in diameter.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.21 no.10
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• pp.1284-1293
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• 1997

The electrostatic effect on particle deposition onto a heated, Horizontal free-standing wafer surface was investigated numerically. The deposition mechanisms considered were convection, Brownian and turbulent diffusion, sedimentation, thermophoresis and electrostatic force. The electric charge on particle needed to calculate the electrostatic migration velocity induced by the local electric field was assumed to be the Boltzmann equilibrium charge. The electrostatic forces acted upon the particle included the Coulombic, image, dielectrophoretic and dipole-dipole forces based on the assumption that the particle and wafer surface are conducting. The electric potential distribution needed to calculate the local electric field around the wafer was calculated from the Laplace equation. The averaged and local deposition velocities were obtained for a temperature difference of 0-10 K and an applied voltage of 0-1000 v.The numerical results were then compared with those of the present suggested approximate model and the available experimental data. The comparison showed relatively good agreement between them.

• Journal of ILASS-Korea
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• v.5 no.3
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• pp.45-54
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• 2000

A novel electrostatic splaying method for solidifying a galvanized coating layer was studied. Our experimental results and computer simulations showed that electric field could assist the fine droplets to attach on the steel surface and change the sprayed droplets trajectory especially in the space near the steel surface. It was necessary to apply the electric voltage higher than - 20 kV to obtain the enough electrostatic attraction force between droplets and the steel sheet.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.848-853
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• 2001

Electrostatic actuation was adopted for ease of fabrication. We proposed a new driving scheme that uses the vector sum of force generated by comb-finger and by parallel plate. The moving and fixed electrodes are arranged to maximize the driving force. In this paper, an electrostatic field analysis is performed by Maxwell analysis tool for micro actuators. From the analysis, a comb-parallel type micro-actuator with 4${\mu}{\textrm}{m}$ width, 6${\mu}{\textrm}{m}$ overlap and 45${\mu}{\textrm}{m}$ height could be designed. In order to compare the new type of actuator with the conventional comb type of actuator, we arranged that both types have the same area and the same number of actuators. To make a high aspect ratio structure, we are developing fabrication process using SU-8 and electro-plating.

• The KSFM Journal of Fluid Machinery
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• v.15 no.1
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• pp.27-35
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• 2012

A numerical simulation for particle collection efficiency in a wire-plate electrostatic precipitator (ESP) has been performed. Method of characteristics and finite differencing method (MOC-FDM) were employed to obtain electric field and space charge density, and lattice boltzmann method (LBM) was used to predict the Electrohydrodynamic (EHD) flow according to the ion convection. Large eddy simulation (LES) was considered for turbulent flow and particle simulation was performed by discrete element method (DEM) which considered field charging, electric force, drag force and wall-collision. One way coupling from FDM to LBM was used with small and low density particle assumption. When the charged particle collided with the collecting plate, particle-wall collision was calculated for re-entertainment effect and the effect of gravity force was considered.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.9-13
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• 2002

A polyimide-type electrostatic chuck (ESC) was fabricated for the application of holding 8-inch silicon wafers in the oxide etching equipment. For the fabrication of the unipolar ESC, core technologies such as coating of polyimide films and anodizing treatment of aluminum surface were developed. The polyimide films were prepared on top of thin coated copper substrates for the good electrical contacts, and the helium gas cooling technique was used for the temperature uniformity of the silicon wafers. The ESC was essentially working with an unipolar operation, which was easier to fabricate and operate compared to a bipolar operation. The chucking force of the ESC has been measured to be about 580 gf when the applied voltage was 1.5 kV, which was considered to be enough force to hold wafers during the dry etching processing. The employment of the ESC in etcher system could make 8% enhancement of the wafer processing yield.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10a
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• pp.393-396
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• 1996

This paper studies electrostatically suspended induction motors (ESIM). The ESIM possesses the rotating ability of an ordinary electrostatic induction motor, in addition to providing contactless support by electrostatic suspension. To accomplish these two functions, a feedback control strategy and the operating principle of an ordinary electrostatic induction motor are used. The stator possesses electrodes which exert the electrostatic forces to the rotor and are divided into a part responsible for suspension and one for rotation. Two rotor types are utilized: a polished glass disk without any surface treatment, and a polished glass disk covered with a thin layer of conductive material (ITO layer) on only one side. In this paper, the principle of the ESIM is described, followed by stator electrode design, experimental apparatus, control strategy for stable suspension. Experimental results show that the glass disk has been rotated with a speed of approximately 70 rpm while being suspended stably at a gap length of 0.3 mm.