• Journal of the Korean Society for Precision Engineering
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• v.25 no.6
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• pp.80-91
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• 2008

Electrostatic forces have an advantage of directly levitating not only non-ferromagnetic metals but also semiconductors, such as silicon wafers, and dielectric materials like glass. This paper describes the characteristics of electrostatic forces and electrostatic suspension system, followed by the basic principle of 1-DOF(degree of freedom) electrostatic suspension system, and the structures of electrodes-for-suspension and voltage supplying methods to the electrodes in 1-DOF model. This paper also discuss about the minimum number of electrodes needed to control n-DOF motion of the suspended object and represents some desirable electrode patterns to stabilize the 6-DOF motion of the object. In the near future, electrostatic suspension system is expected to be applied to industrial manufacturing processes, for example, to the manufacture of semiconductor devices and/or flat panel display devices.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.6
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• pp.71-79
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• 2008

In the manufacture of flat panel display devices, there is a strong demand for contactless glass panel handling devices that can manipulate a glass panel without contaminating or damaging it. To fulfill this requirement, an electrostatic suspension device far glass panels where the glass panel is supported by electrostatic forces without any mechanical contact is proposed. To implement the system with low cost and compactness, switched-voltage control scheme that is based on the relay feedback control is utilized. Relay feedback control method deploys only a single high-voltage power supply that can deliver a DC voltage of positive and/or negative polarity and thus high voltage amplifiers that are costly and bulky are not needed any more. It is shown that despite the inherent limit cycle property of the relay feedback based control, an excellent performance in vibration suppression is attained due to the presence of a relatively large squeeze film damping originating from the electrodes and levitated object. Using this scheme, a $100{\times}100mm^2$ glass panel was levitated stably with airgap variation decreasing down to $1\;{\mu}m$ at an airgap of $100\;{\mu}m$.

• Food Science and Preservation
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• v.5 no.1
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• pp.65-71
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• 1998

The changes in gel characteristics of soy protein as a result of various reagents that alter specific interactions which affect the formation and textural properties of gels, were studied. The reagents were added to 15% soy protein solutions prior to heat treatment. The gels were not formed with urea, indicating that hydrogen bonds significantly contributed to the formation and hardness of soy protein gel. Hydrophobic interactions and disulfide bonds compensated for hydrogen bonds and the contributions of electrostatic interactions to gel hardness are relatively insignificant. The farce primarily responsible for gel cohesiveness appeared to be disulfide bonds, because a significant decrease in cohesiveness was found only with the presence of N-ethylmaleimide. Adhesiveness decreased only with the addition of urea, and thus the contribution of hydrogen bonding to adhesiveness of gel could be concluded to be resent. However, adhesiveness was suggested to be interpreted not only wile molecular forces involved in gel formation but also with hydration properties of protein.