• 분석과학
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• 제25권3호
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• pp.159-163
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• 2012

A spectrofluorimetric method has been developed for the determination of free $CN^-$ in real samples with fluorescent safranine-O. When safranine-O interacts electrostatistically with $CN^-$, the fluorescent intensity of safranine-O is decreased. Several experimental conditions such as pH of the sample solution and the amount of safranine-O were optimized. $Ag^+$ interfered higher than any other ions. Interference of $Ag^+$ could be disregarded because $Ag^+$ was scarcely contained or mostly complexed with $CN^-$ in selected real samples. With this proposed method, the linear range of $CN^-$ was from 5.0 to 110 ng/mL and the detection limit of $CN^-$ was 2.9 ng/mL. For validating this technique, real samples (Cu, Ag, Au electroplating wastewater, and untreated wastewater in university and in sewage treatment plant) were used. Recovery yields of 91.5%~106.0% were obtained. Based on experimental results, it is proposed that this technique can be applied to the practical determination of free $CN^-$.

• 한국태양에너지학회 논문집
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• 제35권4호
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• pp.9-15
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• 2015

Black cobalt solar selective coatings were prepared by using an electroplating method. The changes in the optical properties of the black cobalt selective coating due to thermal degradation were analyzed by using the Auger electron spectroscopy (AES) and spectrophotometer. The black cobalt selective coating was prepared on a copper substrate by using a synthesized electrolyte with $CoCl_2$ and KSCN at a current density of ${\sim}0.5A/dm^2$ for 45s ~ 60s. Its optical properties were a solar absorptance (${\alpha}$) of the order of 0.80 ~ 0.84 and a thermal emittance (${\epsilon}$) of 0.01. From the AES depth profile analysis of heated sample, thermal degradation of the black cobalt selective coating heated for 33 hours at temperature of $350^{\circ}C$ occurred primarily due to interdiffusion at interface of cobalt and copper substrate. This results were predictable that the ${\alpha}$ decreases due to the thermal oxidation and diffusion.

• 한국환경보건학회지
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• 제28권1호
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• pp.41-49
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• 2002

Recently, pilot studies showed an evidence of reduction of airborne hexavalent chromium, Cr(VI), on PVC filter during air sampling and storage. However, the information on this in the field was limited. Thus, we studied the reduction behaviors of airborne Cr(VI) on PVC filters during sampling and storage at three field electroplating operations. Regression between sampling time and the reduction (ratio of Cr(VI) to total Cr concentrations) was not statistically significant (p>0.05). However, the reductions in samples collected for 240 ～ 340 minutes were significantly higher than those for 30 - 60 minutes. On the other hand, another experiment showed a good correlation (r=0.96) between sampling time and the reduction without an exceptional value. Storage temperature was not a factor affecting the reduction of Cr(VI) collected on PVC filter. The loss of Cr(VI) samples stored in alkali solution (2% NaOH/3% Na$_2$CO$_3$) was significantly lower than that stored in vial according to NIOSH method (p<0.05). Thus, dipping Cr(VI) samples into alkali solution was a storage method to minimize tile reduction.

• 한국표면공학회지
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• 제49권2호
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• pp.111-118
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• 2016

A method to quantitatively analyze the defects formed by the hydrogen evolution during electroplating was suggested based on the theoretical approach of the small angle neutron scattering technique. In case of trivalent chrome layers, an isolated defect size due to the hydrogen evolution was about 40 nm. Direct and pulse plating conditions gave the average defect size of about 4.9 and $4.5{\mu}m$ with rod or calabash shape, respectively. Current density change of the pulse plating from $1.5A/dm^2$ to $2.0A/dm^2$ enlarged the average defect size from 3.3 to $7.8{\mu}m$. The defect morphology like rod or calabash was originated by inter-connecting the isolated defects. Small angle neutron scattering was useful to quantitatively evaluate defect morphology of the deposit.

• 대한치과보철학회지
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• 제40권3호
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• pp.246-261
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• 2002

The screw loosening is one of the complications that happen frequently in dental implant prostheses. The purpose of this study was to evaluate the changes of reverse/loosening (opening) torque of the screw according to the surface modifications by sandblasting and 24K gold electroplating as well as to determine the possibility of the clinical use of a washer in dental implant. The reverse torque of 4 experimental conditions(control, sandblasted, use of washers, electroplasted) was measured by digital torque gauge (Model MGT50Z, Mark-10 Corp., 458 West John Street Hicksville, NY 11801 USA). Electronic torque controller (Nobel Biocare DEA 020) was used in fastening the gold screws into abutment replicas. Mixed Linear Model Analysis method was used for statistical analysis. To examine the changes of screw thread surface, microphotographs were taken by Olympus PME-3 metallurgic microscope (Olympus Optical Co. Ltd., Tokyo, Japan). Within the limitations of this study, the following results were drawn: 1. The surface modifications of the gold screws and the use of a washer have significantly affected the reverse torque value compared to the control group (P<0.01). 2. Sandblasting and electroplating treatments demonstrated significantly higher reverse torque value than that of control group. 3. The use of a washer may be one of the useful clinical methods that prevent the screw loosening. However, further studies are necessary for the material selection and design of the washer.

• 마이크로전자및패키징학회지
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• 제14권1호
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• pp.55-60
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• 2007

니켈-다이아몬드 복합 도금은 회전전극을 이용하여 미세 다이아몬드 입자가 공침된 니켈 복합도금층에 대하여 연구하였다. 복합층의 도금시에 인가한 전류밀도와 전류형태(직류, 펄스)가 도금층의 경도와 표면형상에 미치는 영향에 대하여 알아보았으며 첨가제의 영향에 대하여도 연구하였다. 표면조직을 FESEM을 이용하여 관찰하였으며 Micro Victors를 사용하여 도금층의 경도를 측정하였다. 복합도금층에 다이아몬드가 들어감에 따라 경도는 100%, 마찰저항은 27%까지 증가하였다. 또한 다이아몬드 함량이 20gpl 이상인 경우 경도값이 완만하게 증가하였다.

• 한국산업보건학회지
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• 제7권2호
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• pp.223-232
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• 1997

The accuracy and precision of a modified method of NIOSH Method 7600 and EPA method 218.6 was determined for analyzing hexavalent chromium, Cr(VI), collected on PVC filter from workplace air. The method was designed to extract from Cr(VI) on PVC filter with a alkali solution, 2% NaOH/3% $Na_2CO_3$, and to analyze it using ion chromatography/visible absorbance detection(IC/VAD). The results and conclusion are as the following. 1. The peak of Cr(VI) was separated sharply on chromatogram and was linearly related with Cr(VI) concentration in sloution. The correlation coefficient was 0.9999 in a calibration curve. The limit of detection was 0.25 $0.25{\mu}g/sample$. 2. The accuracy(% recovery) was 93.3% in a set of sample($9-50{\mu}g$) stored for a day, and 100.1%($10-60{\mu}g$) in another set of samples stored for 2 hours. It is assumed that the difference in recovery by storage time was due to reduction of Cr(VI) to Cr(III). 3. The precision(coefficient of variation, CV) of the method was 0.015 in spiked samples with Cr(VI) standard solution, and 0.010 in spiked samples with plating solution from a chrome electroplating factory. The overall CV in all types of samples was 0.0013. 4. The Cr(VI) was stable in 2% NaOH/3% $Na_2CO_3$ at least for 10 hours. In conclusion, the IC/VAD method is appropriate for determining low-level Cr(VI) in workplace air containing various interferences.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.994-996
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• 2002

We present a novel fabrication method for a V-grooved mold of the light guide plat of TFT-LCD with MEMS technology. This method is performed by the inclined UV lithography and Ni electroplating unlike the previous mechanical processing technique. V-grooves with different dimension can be made simultaneously with single photomask.

• 한국표면공학회지
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• 제1권1호
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• pp.5-13
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• 1967

Up to this date, numerous methods of analysis of electropling solutions are published. Some, however, need lots of works before reaching final results, or require high technique and special instruments, and also some are unaccurate due to unclearnes of end point. Like our undevelop countries, technicians of electroplating shops are most high school graduates or under, and have not much knowledge on chemistry. Furthermore, those technicians have to control their plating solutions by themselves without having enough analytical laboratory equipment . Therefore, in this paper the simplest, besides accurate method is investigated after comparing numerous methods published. Among the methods of copper determinations from acid and alkaline copper plating baths, EDTA titration method are chosen, due to these methods are the simpest and fastest for the evaluation of metal content, without requirng any special instrument. For acid copper solutions, chelate titrations were accurate enough. Since the end point of titration of chelate method is variable according to the kind of indicators and other metal's coexisitence as well as solution component, many difficulties were encountered from cyanide copper, on the contrary of acid copper bath. PAN , PV, and MX indicators were tried , but it is found that MX is the best. In chyanide solution ,due to cyanide is the masking reagent , elimination of this component is essential , and finally found that elimination CN-by precipitation with AgNO$_3$ solution was the simplest and the most accurate way among others. This method was very accurate for the new plating solutions even coexistence with organic brightners. However used solutions for long months running have to be predetermined the accurate copper value by thiosulfate method form time to time, before chelate titration by means of AgNO$_3$ precipitation. Always some constant deviations will be seen according to the solutions nature. Therefore those deviation values have to be compensated each time.

• 한국재료학회지
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• 제13권2호
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• pp.133-136
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• 2003

Sn-2.5Cu alloy layers were deposited on the Alloy 42 lead-frame substrates by the electroplating method, and their microstructures, adhesion strength, and electrical resistivity were measured to evaluate the applicability of Sn-Cu alloy as a surface finishing material of electronic parts. The Sn-2.5Cu layers were electroplated in the granular form, and composed of pure Sn and Cu$_{6}$Sn$_{5}$ intermetallic compound. Surfaces of the electroplated Sn-2.5Cu layers were rather rough and also the thickness variance was large. The adhesion strength of the Sn-2.5Cu electroplated layers was highly comparable to that of the electroplated Cu alloy layer and the electrical conductivity was about 10 times higher than the pure Sn. After the 20$0^{\circ}C$ 30 min. annealing of the electroplated Sn-2.5Cu layers, the surface roughness was reduced, and adhesion strength and conductivity were improved. These results showed the Sn-Cu alloys can be used as an excellent surface finishing material.ial.