• Journal of the Korean institute of surface engineering
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• v.16 no.4
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• pp.199-214
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• 1983

Up to this date, numerous methods of analysis of electroplating solutions are published. Some, however, need lots of works before reaching final results, or require high technique and special instruments, and also some are unaccurate due to unclearnes of end point. Like our undevelope countries, technicians of electoplating shops are most high school gradutes or under, and have not much knowledge on chemistry. Furthermore, those technicians have to control their plating solutions by themselves without having enough analytical laboratory equiIJment. Therefore, in this paper the simplest, besides accurate method is investigated after comparing nu.merous methods published. Among the methods of 'copper determinations from acid and alkaline copper plating baths, EDT A titration method are chosen, due to these methods are the simplest and fastest for the evaluation of metal content, without requiring any special instrument. For acid copper solutions, chelate titrations were accurate enough. Since the end point of titration of chelate method is variable according to the kind of .indicators androther metal's coexsistence as well as solution comIJonent, many difficulties were encountered from cyanide' copper, on the contrary of acid copper bath. PAN, PV, and MX indicators were tried, but it is found that MX is the best. In cyanide solution, due to cyanide is the masking reagent, elimination of this component is essential, and finally found that elimination eN- by precipitation with AgN03 solution was the simplest and the most accurate way among others. This method was very accurate for the new plating solutions even coexistence with organic brightners. However used solutions for long months running have to be predetermined the accurate copper value by thiosulfate method from time to time, before chelate titration by means of AgN03 precipitation. Always some constant deviatioJ;ls will be seen according to the solutions nature. Therefore those deviation values have to be compensated each time.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.1
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• pp.1-8
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• 2010

Natural convection heat transfer rates in a vertical pipe were measured for $Gr_H$ number from 2.1x$10^6$ to 1.2x$10^9$. Using the analogy concept, heat transfer experiments were replaced by mass transfer experiments. A cupric acid - copper sulfate ($H_2SO_4-CuSO_4$) electroplating system was adopted as the mass transfer system and the mass transfer rates were measured. Comparison of the results with the existing laminar and turbulent natural convection heat transfer correlations on a vertical plate showed very good agreements except for the high $Gr_H$ case, where the boundary layer inside the vertical pipe interferes. The agreements showed the usefulness of the analogy experiment method. Using 3 different anode size and 6 different geometrical configurations, the effects of the anode size and position were explored. As expected, the anode size and position do not affect the limiting currents for most cases. These results will be used as the experimental background for the positioning and sizing of the anodes for a more complex experiment.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.39-42
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• 2011

The composite electroplating is accomplished by adding inert materials during the electroplating. Permalloy is the term for Ni-Fe alloy and it is used for industrial applications due to its high magnetic permeability, surface wear resistance, corrosion protection. Microhardness for microdevices is enhanced after composite coating and it increases the life cycle. However, the hydroxyl group on the silica makes their surface susceptible to moisture and it causes the silica nanoparticles to be agglomerated in the aqueous solution. The agglomeration problem causes poor dispersion which eventually interrupts uniform deposition of silica nanoparticles. In this study, the dispersion of silica nanoparticles in the permalloy electroplated layer is reported with variation of additives and current densities. The optimum current density was 20 $mA/cm^2$ and the silica content was 9 at% at $50^{\circ}C$. The amount of silica nanopowder codeposition and surface morphologies were influenced with variation of additives. In the bath, smooth surface morphology and relatively high contents of silica nanopowder codeposition were obtained with addition of sodium lauryl sulfate.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.90.2-90.2
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• 2010

The coated metallic bipolar plates are getting attractive due to their good feasibility of mass production, low contact resistance, high electrical/thermal conductivity, low gas permeability and good mechanical strength comparing with graphite materials. Yet, metallic bipolar plates for polymer electrolyte membrane(PEM) fuel cells typically require coatings for corrosion protection. Other requirements for the corrosion protective coatings include low electrical contact resistance between metallic bipolar plate and gas diffusion layer, good mechanical robustness, low mechanical and fabrication cost. The authors have evaluated a number of protective coatings deposited on stainless steel substrate by electroplating. The coated metallic bipolar plates are investigated with an electrochemical polarization tests, salt dipping tests, adhesion tests for corrosion resistance and then the contact resistance was measured. The results showed that the selective samples electroplated with optimized method, satisfied the DOE target for corrosion resistance and contact resistance, and also were very stabilized in the typical fuel cell environments in the long-term.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.12
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• pp.1871-1876
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• 2004

We demonstrate a novel fabrication technology for the microneedle array that can be used in the medical test field, which is transdermal drug delivery and blood analyte sampling. Previous researchers have used silicon-processed micromachining, a reactive ion etching, and molding techniques for the fabrication of microneedle array. However, these fabrication techniques have somewhat limitations apply to the microneedle array fabrication according to its application. Inclined LIGA process is suggested to overcome these problems. This process provides easier, sharper and longer out-of-plane microneedle array structure than conventional silicon-processed fabrication method did. Additionally, because of the advantage of the LIGA process based on mold fabrication for mass production, the polymer, PMMA(PolyMethylMethAcrylate), based microneedle array is useful as the mold base of nickel electroplating process; on the other hand, silicon-processed microneedle array is used in itself. In this research, we fabricate different types of out-of-plane microneedle array, which have different shape of tip, base and hole structure, using the inclined LIGA process. The fabricated microneedles have proper mechanical strength, height and sharpness to puncture human hand epidermis or dermis with less pain and without needle tip break during penetrating the skin.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.29-36
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• 2004

A flexible packaging scheme, which includes chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending tests and finite element analysis. Thinned silicon chips (t<30 $\mu\textrm{m}$) are fabricated by chemical etching process to avoid possible surface damages on them. And the chips are stacked directly on $Kapton^{Kapton}$film by thermal compressive bonding. The low height difference between the thinned silicon chip and $Kapton^{Kapton}$film allows electroplating for electrical interconnection method. Because the 'Chip' is embedded in the flexible substrate, higher packaging density and wearability can be achieved by maximized usable packaging area.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.12
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• pp.1639-1645
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• 2002

Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer form the engine. Combustor size was determined to be 1 mm scale. Movable piston is engraved inside the wafer. Ignition was done by nickel spark plug which was electroplated with thickness of 40 ${\mu}{\textrm}{m}$. The wafers were bonded by epoxy that resists high temperature. In firing test due to the bonding method and design tolerance pressure buildup by reaction was not confirmed. But ignition, flame propagation and actuation of micro structure from the reaction was observed. From the result basement of design and fabrication technology was obtained.

• Korea-Australia Rheology Journal
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• v.19 no.3
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• pp.171-176
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• 2007

LCD-BLU (Liquid Crystal Display-Back Light Unit) of medium size is usually manufactured by forming numerous dots with $50{\sim}300\;{\mu}m$ in diameter by etching process and V-grove shape with $50\;{\mu}m$ in height by mechanical cutting process. However, the surface of the etched dots is very rough due to the characteristics of the etching process and V-cutting needs rather high cost. Instead of existing optical pattern made by etching and mechanical cutting, 3-dimensional continuous micro-lens of $200\;{\mu}m$ in diameter was applied in the present study. The continuous micro-lens pattern fabricated by modified LIGA with thermal reflow process was tested to this new optical design of LGP. The manufacturing process using LIGA-reflow is made up of three stages as follows: (i) the stage of lithography, (ii) the stage of thermal reflow process and (iii) the stage of electroplating. The continuous micro-lens patterned LGP was fabricated with injection molding and its test results showed the possibility of commercial use in the future.

• The korean journal of orthodontics
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• v.36 no.2 s.115
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• pp.145-152
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• 2006

The purpose of this study was to evaluate electroless plating as a method of increasing the diameter of an orthodontic wire in comparison with eletroplating. After pretreatment plating of the 0.016 inch stainless steel orthodontic wire, electroless plating was performed at $90^{\circ}C$ until the diameter of the wire was increased to 0.018 inch. During the process of electroless plating, the diameter of the wire was measured every 5 minutes to examine the increasing ratio of the wire's diameter per time unit. And to examine the uniformity, the diameter at 3 points on the electroless-plated orthodontic wire was measured. An X-ray diffraction test for analyzing the nature of the plated metal and a 3-point bending test for analyzing the physical property were performed. The electroless-plated wire group showed a increased tendency for stiffness, yield strength, and ultimate strength than the electroplated wire group. And there was a statistically significant difference between the two groups for stiffness and ultimate strength. In the electroless-plated wire group, the increasing ratio of the diameter was $0.00461{\pm}0.00003mm/5min$ (0.00092 mm/min). In the electroplated wire group, it was $0.00821{\pm}0.00015mm/min$. The results of the uniformity test showed a tendency for uniformity in both the plating methods. The results of this study suggest that electroless plating of the wire is closer to the ready-made wire than electroplating wire in terms of the physical property. However, the length of plating time needs further consideration for the clinical application of electroless plating.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.3
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• pp.413-418
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• 2018

In this paper, we describe the development of a non-enzymatic glucose sensor based on copper nanocubes(Cu NCs) electroplated laser induced graphene(LIG) electrodes which can detect a certain range of glucose concentrations. $CO_2$ laser equipment was used to form LIG electrodes on the PI film. This fabrication method allows easy control of the LIG electrode size and shape. The Cu NCs were electrochemically deposited on the LIG electrodes to improve electron transfer rates and thus enhancing electrocatalytic reaction with glucose. The average sheet resistances before and after electroplating were $15.6{\Omega}/{\Box}$ and $19.6{\Omega}/{\Box}$, respectively, which confirmed that copper nanocubes were formed on the laser induced graphene electrodes. The prepared electrode was used to measure the current according to glucose concentration using an electrochemical method. The LIG electrodes with Cu NCs demonstrated a high degree of sensitivity ($1643.31{\mu}A/mM{\cdot}cm^2$), good stability with a linear response to glucose ranging from 0.05 mM to 1 mM concentration, and a limit of detection of 0.05 mM. In order to verify that these electrodes can be used as flexible devices, the electrodes were bent to $30^{\circ}$, $90^{\circ}$, and $180^{\circ}$ and cyclic voltammetry measurements were taken while the electrodes were bent. The measured data showed that the peak voltage was almost constant at 0.42 V and the signal was stable even in the flexed condition. Therefore, it is concluded that these electrodes can be used in flexible sensors for detecting glucose in the physiological sample like saliva, tear or sweat.