• Title/Summary/Keyword: Electroplating System

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Effect of Adiabatic Sidewalls on Natural Convection in a Rectangular Cavity (사각공동내 자연대류에서 측면 단열벽에 의한 영향)

  • Heo, Jeong-Hwan;Chung, Bum-Jin
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.34 no.9
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    • pp.825-834
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    • 2010
  • In this study, we investigated the effects of adiabatic walls on natural convection in various rectangular cavities experimentally and numerically. Heat transfer rates were measured for cavities with and without adiabatic sidewalls by varying Grashof number from $1.53\times10^7$ to $1.01\times10^{10}$. Some typical test results were successfully simulated using FLUENT. In the case of very narrow cavities, where the adiabatic walls were very close to each other, it was difficult to perform experiments; therefore, FLUENT simulations were performed. The existing heat transfer correlations for rectangular cavities were well predicted by the experimental and numerical results. As expected, the effects of adiabatic walls were restricted to the very narrow region near the walls. This study was carried out during the development of an analogy experimental method in which heat-transfer systems are replaced with mass-transfer systems using copper sulfate electroplating systems. The results of this study provide theoretical background of handling adiabatic walls during the design of test facilities.

Performance of Local Exhaust Ventilation Systems of Degreasing and Plating Workplaces (일부 탈지세척 및 도금공정 국소배기장치의 성능점검과 개선방안)

  • Han, Don-Hee
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.8 no.2
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    • pp.178-185
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    • 1998
  • In order to evaluate and improve the performance of local exhaust ventilation systems for two TCE degreasing (A, B) and two electroplating (C, E) and one acid dipping & plating (D) operations located in Kimhae, the performance test was conducted with trace gases and a thermal anemometer (Kanomax 24-6111, Japan). For the inadequately designed systems, the improvement and redesigns in compliance with recommendation by ACGIH was suggested. The results of performance test for each system are as follows; 1. System of Workplace A was generally well-designed. Actual exhaust air flow rate was in excess of 68% above the recommended standard exhaust air flow rate. 2. System of Workplace B was very well-designed and completely enclosed. 3. All systems of Workplace C including hoods were poorly-designed and actual exhaust air flow rates were insufficient for open tanks. All systems should be upgraded according to ACGIH recommendations. 4. Supply and exhaust air flow rate of push-pull exhaust systems in Workplace D should be greatly increased. The width of flange of dipping tank hood should be increased with the value suggested. 5. System of Workplace E was well-designed. Actual exhaust air flow rate was in excess of 54% above the required.

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WLP and New System Packaging Technologies

  • WAKABAYASHI Takeshi
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.53-58
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    • 2003
  • The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

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The Effects of the Anode Size and Position on the Limiting Currents of Natural Convection Mass Transfer Experiments in a Vertical Pipe (수직 원형관내 자연대류 물질전달실험에서 양극의 면적과 위치가 한계전류에 미치는 영향)

  • Kang, Kyoung-Uk;Chung, Bum-Jin
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.34 no.1
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    • pp.1-8
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    • 2010
  • Natural convection heat transfer rates in a vertical pipe were measured for $Gr_H$ number from 2.1x$10^6$ to 1.2x$10^9$. Using the analogy concept, heat transfer experiments were replaced by mass transfer experiments. A cupric acid - copper sulfate ($H_2SO_4-CuSO_4$) electroplating system was adopted as the mass transfer system and the mass transfer rates were measured. Comparison of the results with the existing laminar and turbulent natural convection heat transfer correlations on a vertical plate showed very good agreements except for the high $Gr_H$ case, where the boundary layer inside the vertical pipe interferes. The agreements showed the usefulness of the analogy experiment method. Using 3 different anode size and 6 different geometrical configurations, the effects of the anode size and position were explored. As expected, the anode size and position do not affect the limiting currents for most cases. These results will be used as the experimental background for the positioning and sizing of the anodes for a more complex experiment.

Study on Laminar Mixed Convection of Developing Flow in Vertical Pipe (수직관내 발달 유동의 층류혼합대류 연구)

  • Ko, Bong-Jin;Chung, Bum-Jin
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.34 no.5
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    • pp.481-489
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    • 2010
  • Experiments on laminar mixed convection in a vertical pipe were performed for the Re range 1,000-3,000, the $Gr_H$ range $10^5-10^8$, the Pr range 2,000-7,000, and aspect ratio range 1-7. Using the analogy concept, heat transfer systems were simulated by mass transfer systems. A cupric acid.copper sulfate electroplating system was adopted as the mass transfer system, and the mass transfer rates were measured. The measured Nu values were far greater than those previously reported because of the large value of pr in this experiment. As the aspect ratio in this study was not sufficiently large for the flow to be fully developed, the test results were similar to those for mixed convection on a vertical plate rather than that inside a long vertical pipe. It was concluded that the behavior of laminar mixed convection of a developing flow in a vertical pipe at a low aspect ratio and low $Gr_H$ is similar to that of laminar mixed convection in the vertical plate. As the aspect ratio and $Gr_H$ increase, the laminar mixed convection phenomena becomes similar to that observed in a fully developed flow in the vertical pipe.

A Preliminary Experiment for Rayleigh-Benard Natural Convection for Severe Accident Condition (중대사고시 노심용융물의 Rayleigh-Benard 자연대류 예비 실험)

  • Moon, Je-Young;Chung, Bum-Jin
    • Journal of Energy Engineering
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    • v.21 no.3
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    • pp.254-264
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    • 2012
  • Rayleigh-Benard natural convection experiments were carried out as the preliminary experiment to simulate the natural convection of the core melt at the severe accident conditions. This work focused on the influences of plate separation distance(s), the existence of the side walls and crust geometries of upper and lower plates. Based upon the analogy concept, a cupric acid-copper sulfate electroplating system($H_2SO_4-CuSO_4$) was employed as the mass transfer system and measurements were made for $Ra_s$ ranging from $1.06{\times}10^7$ to $2.91{\times}10^{10}$. The test results measured for a single horizontal plate were in good agreement with the correlation reported by McAdams and those for two horizontal plates showed the similar trend to the existing Rayleigh-Benard heat transfer correlations developed by Dropkin and Somerscales, Globe and Dropkin. The measured heat transfer rate decreased with the increasing separation distance between the two plates and became similar to those for a single horizontal plate. Fin arrays mounted on both upper and lower plates enhanced the heat transfer rates. For all cases, the heat transfer rates measured for open side walls are higher than those for closed ones.

Antibacterial Activity of Activated Carbon Fibers Containing Silver Metal

  • Park, Soo-Jin;Kim, Byung-Joo;Ryu, Seung-Kon
    • Carbon letters
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    • v.4 no.3
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    • pp.140-145
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    • 2003
  • Antibacterial behaviors of PAN-based activated carbon fibers (ACFs) containing silver metal were investigated. The effects of surface and pore structures of the ACFs were studied by $N_2$/77 K adsorption and D-R plot as a function of silver loading content. The antibacterial activities were investigated by a dilution test against Staphylococcus aureus (S. aureus; gram positive) and Klebsiella pnemoniae (K. pnumoniae; gram negative). As experimental results, the ACFs showed some decreases in specific surface areas, micropore volumes, and total pore volume with an increase of silver content. However, the antibacterial activities of the ACFs were strongly increased against S. aureus as well as K. pnumoniae, which could be attributed to the presence of antibacterial metal in the ACFs system.

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Measurements of the Mechanical Properties of Electroplated Gold Microstructure (전해 도금된 마이크로 금 구조물의 기계적 특성 측정)

  • Baek, Chang-Wong;Kim, Yong-Kweon;Ahn, Yoo-Min
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.50 no.2
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    • pp.86-95
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    • 2001
  • Mechanical properties of electroplated gold microstructures were determined from the micromachined beam structures. Cantilever and bridge beam structures of different length were fabricated by electroplating-surface micromachining technique, which is specially designed to realize an anchor structure close to an ideal fixed-boundary condition. Fabricated beams were electrostatically excited and their resonance frequencies were measured by optical system composed of laser displacement meter with dynamic signal analyzer. Young's modulus and mean residual stress were calculated from the measured frequencies of microbeams. In addtion, stress gradient was measured using deformation of released cantilever beam structure.

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Mass Transfer Experiments for the Heat Load During In-Vessel Retention of Core Melt

  • Park, Hae-Kyun;Chung, Bum-Jin
    • Nuclear Engineering and Technology
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    • v.48 no.4
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    • pp.906-914
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    • 2016
  • We investigated the heat load imposed on the lower head of a reactor vessel by the natural convection of the oxide pool in a severe accident. Mass transfer experiments using a $CuSO_4-H_2SO_4$ electroplating system were performed based on the analogy between heat and mass transfer. The $Ra^{\prime}_H$ of $10^{14}$ order was achieved with a facility height of only 0.1 m. Three different volumetric heat sources were compared; two had identical configurations to those previously reported, and the other was designed by the authors. The measured Nu's of the lower head were about 30% lower than those previously reported. The measured angular heat flux ratios were similar to those reported in existing studies except for the peaks appearing near the top. The volumetric heat sources did not affect the Nu of the lower head but affected the Nu of the top plate by obstructing the rising flow from the bottom.

Development of a DSP Control Board for Electroplating Power System (전기도금용 전원장치구동을 위한 DSP 탑재 제어보드의 개발)

  • Song, Ho-Shin;Lee, Dae-Hee;Bae, Jong-Moon;Lee, Oh-Guel;Noh, Sung-Chae
    • Proceedings of the KIEE Conference
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    • 2000.07d
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    • pp.2551-2553
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    • 2000
  • 고속 신호처리 및 실시간 제어 분야에 적합한 제어성능을 발휘하기 위해서는 신호처리전용 마이크로프로세서인 DSP(Digital Signal Processor)를 이용한 제어용 보드가 널리 활용되고 있다. 본 연구를 통하여 전기도금용 전원장치의 고성능화를 위하여 DSP제어용 보드를 개발하였으며, 전체구성은 고속 신호처리를 위한 메인 마이크로프로세서로서 경제성과 응용범위가 넓은 TMS320C32 DSP CHIP, Wait없는 프로그램 및 데이터 처리를 위한 고속 SRAM, 외부 디지털 입출력을 위한 인터페이스 회로, 아나로그 입출력 회로 및 PC 혹은 다른 마이크로컴퓨터와의 통신을 위한 직렬 통신 회로 등으로 구성하였다. 개발된 DSP 보드는 시제품 제작을 완료하여 그 성능 및 신뢰성을 검증하였으며, 전기도금장치의 고성능 제어처리를 위하여 채용하여 상품화 개발을 완료하였다.

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