• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2286-2291
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• 2008

Some electronics component, which is adopted as components of antenna for radar or satellite system and used for amplifying signals to transmit, is accompanied by very significant heat dissipation levels because of the inefficiencies inherent in radio frequency wave generation. So, proper cooling performance for that system is base requirement for thermal design. On this paper, we applied heat spreading structures to reduce thermal density and find the optimum values of heat sink design factors through theoretically, numerically and evaluated by product test. As the results, the performance of the cooling system shows the propriety of cooling high density heat dissipation electronics components.

• JSTS:Journal of Semiconductor Technology and Science
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• 제12권3호
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• pp.297-312
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• 2012

For future multi-core processors, 3D integration is regarded as one of the most promising techniques since it improves performance and reduces power consumption by decreasing global wire length. However, 3D integration causes serious thermal problems since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Conventional air cooling schemes are not enough for 3D multi-core processors due to the limit of the heat dissipation capability. Without more efficient cooling methods such as liquid cooling, the performance of 3D multi-core processors should be degraded by dynamic thermal management. In this paper, we examine the architectural impact of cooling methods on the 3D multi-core processor to find potential benefits of liquid cooling. We first investigate the thermal behavior and compare the performance of two different cooling schemes. We also evaluate the leakage power consumption and lifetime reliability depending on the temperature in the 3D multi-core processor.

• 전력전자학회:학술대회논문집
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• 전력전자학회 1998년도 Proceedings ICPE 98 1998 International Conference on Power Electronics
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• pp.564-568
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• 1998

All elements and systems of electronics have optimum temperature conditions. A using of the thermoelectric method of cooling is the most approach for the thermal management of power electronics. An analysis of using the thermoelectric cooling and the temperature control is given as an efficient method of ensuring a work of power electronic devices in conditions of micro-miniaturization.

• Elastomers and Composites
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• 제59권1호
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• pp.22-33
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• 2024

Passive radiative cooling is a promising technology for cooling objects without energy input. Passive radiative cooling works by radiating heat from the surface, which then passes through the atmosphere and into space. Achieving efficient passive radiative cooling is mainly accomplished by using materials with high emissivity in the atmospheric window (8-13 ㎛). Research has shown that polymers tend to exhibit high emissivity in this spectral range. In addition to elastomers, other materials with potential for passive radiative cooling include metal oxides, carbon-based materials, and polymers. The structure of a passive radiative cooling device can affect its cooling performance. For example, a device with a large surface area will have a greater amount of surface area exposed to the sky, which increases the amount of thermal radiation emitted. Passive radiative cooling has a wide range of potential applications, including building cooling, electronics cooling, healthcare, and transportation. Current research has focused on improving the efficiency of passive radiative cooling materials and devices. With further development, passive radiative cooling can significantly affect a wide range of sectors.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집B
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• pp.205-209
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• 2000

The performances of cascade-type thermoelectric modules are analysed by numerical simulations. The geometrical variations are used as design parameters.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 추계학술대회 논문집 전기기기 및 에너지변환시스템부문
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• pp.208-210
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• 2005

A lot of conventional automotive components driven by mechanical power source are being replated with electrical ones to comply with the demands of market and customer, therefore the amount of electric energy used in a vehicle will be increased continuously. The increment of electric power demand causes interest on new higher power system such as 42V Power Net, and furthermore necessity for development of energy storage device is highlighted recently. This paper presents the design of the BLDC motor drive for Cooling Fan in 42V automotive system. Test results confirmed the feasibility of the proposed motor drive system design.

• 전력전자학회논문지
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• 제15권1호
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• pp.27-34
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• 2010

하이브리드 전기자동차(HEV)용 인버터의 스위칭 소자에서 발생하는 열을 효율적으로 냉각시키기 위한 수냉식구조를 제안한다. 기존의 볼트형 냉각구조는 강한 수압에서 누수현상이 발생할 수 있으므로 본 논문에서는 이를 방지하기 위해 방열판 내에 파이프 형태의 구조를 적용하였다. 발열원을 기준으로 수로의 이격거리 변화와 여러 형태의 수로에 대해 방열현상을 시뮬레이션으로 해석하고, 방열효과가 우수한 2가지 배관구조 모델을 기준으로 방열효과를 비교 분석하였다. 시뮬레이션 결과를 토대로 2가지 배관구조를 적용한 HEV용 30kW급 인버터를 제작하여 방열효과를 검증하였다.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2008년도 동계학술발표대회 논문집
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• pp.170-174
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• 2008

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of slimness of the devices, so it is not easy to find the optimal thermal management technology for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint. In the present study, the silicon and metal flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. Through the experimental study, the normal isothermal characteristic by vapor-liquid phase change was confirmed and the cooling device with 70mm of total length showed 6.8W of the heat transfer rate within the range of $4{\sim}5^{\circ}C$/W of thermal resistance. In the meantime, the metal cooling device was developed for commercialization. The device was designed to have all structures of evaporator, vapor flow path, liquid flow path and condenser in one plate. And an envelope of that could be completed by combining the two plates of same structure and size. And the simplicity of fabrication process and reduction of manufacturing cost could be accomplished by using the stamping technology for fabricating large flow paths relatively. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of that.

• Journal of Power Electronics
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• 제16권4호
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• pp.1598-1611
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• 2016

In some special occasions with strict size requirements, such as mine hoists, improving the design accuracy of the forced-air cooling systems of NPC three-level inverters is a key technology for improving the power density and decreasing the volume. First, a fast power-loss calculation method was brought. Its calculation principle introduced in detail, and the computation formulas were deduced. Secondly, the average and dynamic power losses of a 1MW mine hoist acting as the research target were analyzed, and a forced-air cooling system model based on a series of theoretical analyses was designed with the average power loss as a heat source. The simulation analyses proves the accuracy and effectiveness of this cooling system during the unit lifting period. Finally, according to an analysis of the periodic working condition, the maximum power-loss range of a NPC three-level inverter under multi cycle operation was obtained and its dynamic power loss was taken into the optimized cooling system model as a heat source to solve the power device damage caused by instantaneous heat accumulation. The effectiveness and feasibility of the optimization design based on the dynamic power loss calculation of the maximum power-loss range was proved by simulation and experimental results.

• Journal of Power Electronics
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• 제10권2호
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• pp.187-193
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• 2010

This paper proposes a cooling system using thermoelectric elements for improving the output of building integrated photovoltaic (BIPV) modules. The temperature characteristics that improve the output of a BIPV system have rarely been studied up to now but some researchers have proposed a method using a ventilator. The efficiency of a ventilator depends mainly on the weather such as wind, irradiation etc. Because this cooling system is so sensitive to the velocity of the wind, it is unable to operate in the nominal operating cell temperature (NOCT) or the standard test condition (STC) which allow it to generate the maximum output. This paper proposes a cooling system using thermoelectric elements to solve such problems. The temperature control of thermoelectric elements can be controlled independently in an outdoor environment because it is performed by a micro-controller. In addition, it can be operated around the NOCT or the STC through an algorithm for temperature control. Therefore, the output of the system is increased and the efficiency is raised. This paper proves the validity of the proposed method by comparing the data obtained through experiments on the cooling systems of BIPV modules using a ventilator and thermoelectric elements.